The invention discloses a CPU heat radiation copper foil paster reflow soldering jig. The CPU heat radiation copper foil paster reflow soldering jig comprises a carrier plate, a CUP locating plate, aheat radiation copper foil locating plate a pressing plate and a pressing block. In this way, the independently located CPU locating plate made from martensitic stainless steel is adopted by the CPU heat radiation copper foil paster reflow soldering jig, and heat deformation of the locating plate can be avoided to the maximum extent; contact bevel structures are arranged on the edge of the bottomof the CPU locating plate and the edge of a groove opening of a carrier plate CPU groove, and the locating precision is improved; meanwhile, a diversion trench is formed in the upper surface of the CPU locating plate, overflowing redundant solder paste flows into the diversion trench, and it is avoided that when the jig is opened, the jig and a CPU shell adhere, and a finished product is damaged;and copper foil is located through the heat radiation copper foil locating plate made from the martensitic stainless steel, heat deformation can be reduced to the maximum extent in the repeated heating process, the processing precision is improved, and the rate of finished products is increased.