基本信息:
- 专利标题： 软性印刷电路板压焊结构与制造方法
- 专利标题（英）：Pressure welding structure and manufacturing method of flexible printed circuit board
- 申请号：CN200510008418.8 申请日：2005-02-18
- 公开(公告)号：CN1658735A 公开(公告)日：2005-08-24
- 发明人： 何雅婷 , 陈丽惠
- 申请人： 友达光电股份有限公司
- 申请人地址： 台湾省新竹市力行二路1号新竹科学工业园区
- 专利权人： 友达光电股份有限公司
- 当前专利权人： 友达光电股份有限公司
- 当前专利权人地址： 台湾省新竹市力行二路1号新竹科学工业园区
- 代理机构： 北京恒信悦达知识产权代理有限公司
- 代理人： 徐雪崎
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K1/16 ; H05K3/46 ; H05K3/34 ; H05K1/09 ; H05K3/42
A pressed welding structure and manufacturing method of the flexible printed circuit (FPC). The structure includes a samdwich, that in turn includes a first insulating layer, a first conductor layer, a second insulating layer, a second conductor layer and a third insulating layer; and a transfixion hole, used to run through the before-mentioned first conductor layer, the second insulating layer and the second conductor layer, thereinto the first insulating layer has a pressed welding material laid area to basset the second conductor layer. By using this, the wastage of the heat energy of the heat pressing head in the insulating material. We can use the less heat energy and time to melt the welding material, and the material of the pressed welding area (the insulative basal board material or the agglutinant) won't go bad because of the heat energy is exorbitant.
公开/授权文献:
- CN100417311C 软性印刷电路板压焊结构与制造方法 公开/授权日：2008-09-03
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |
| ----------H05K1/11 | ..对印刷电路或印刷电路之间提供电连接的印刷元件 |