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11. 发明授权

US09532371B2 Method and apparatus for scheduling user equipment 有权
标题翻译：调度用户设备的方法和装置
公开(公告)号：US09532371B2
公开(公告)日：2016-12-27
申请号：US14345139
申请日：2012-03-23
申请人： Gang Wang , Lei Jiang , Ming Lei
发明人： Gang Wang , Lei Jiang , Ming Lei
IPC分类号： H04W72/12 , H04W72/08 , H04W52/36 , H04L1/00 , H04L5/00
CPC分类号： H04W72/1231 , H04L1/0003 , H04L1/0015 , H04L5/0057 , H04W52/367 , H04W72/08
摘要： Embodiments of the disclosure provide a method and apparatus for scheduling a UE, wherein a BS serves the UE and employs a non-normal subframe to coordinate inter-cell interference, and wherein transmission power in the non-normal subframe is lower than that in a normal subframe. In the method according to embodiments of the present invention, channel quality information for the non-normal subframe may be adjusted based on information on transmission power of downlink packets and reference signals; and a target MCS may be determined according to the adjusted channel quality information, so that the BS schedules the UE based on the target MCS in the non-normal subframe.
摘要翻译：本公开的实施例提供了一种用于调度UE的方法和装置，其中BS服务于UE并采用非正常子帧来协调小区间干扰，并且其中非正常子帧中的发射功率低于正常子帧在根据本发明的实施例的方法中，可以基于关于下行链路分组和参考信号的发送功率的信息来调整用于非正常子帧的信道质量信息; 并且可以根据所调整的信道质量信息来确定目标MCS，使得BS基于非正常子帧中的目标MCS来调度UE。

12. 发明申请

US20110060009A1 Hydroxamate-Based Inhibitors of Deacetylases 审中-公开
标题翻译：基于羟基甲酸酯的去乙酰化酶抑制剂
公开(公告)号：US20110060009A1
公开(公告)日：2011-03-10
申请号：US12870186
申请日：2010-08-27
申请人： Clinton A. BROOKS , Christine Hiu-Tung CHEN , Young Shin CHO , Lei JIANG , Gang LIU , Michael SHULTZ
发明人： Clinton A. BROOKS , Christine Hiu-Tung CHEN , Young Shin CHO , Lei JIANG , Gang LIU , Michael SHULTZ
IPC分类号： A61K31/4439 , C07D403/06 , A61K31/4045 , C07D401/06 , C07D401/14 , A61K31/4155 , A61K31/4192 , A61P35/00 , A61P25/28 , A61P25/16 , A61P9/00 , A61P19/02 , C12N9/99
CPC分类号： C07D403/06 , C07D401/14 , C07D403/04 , C07D498/06
摘要： The present teachings relate to compounds of Formula I: and pharmaceutically acceptable salts, hydrates, esters, and prodrugs thereof, wherein R1, R2, R3, R4, R5, ring A, and Z are as defined herein.The present teachings also provide methods of preparing compounds of Formula I and methods of use compounds of Formula I in treating pathologic conditions or disorders mediated wholly or in part by deacetylases.
摘要翻译：本发明涉及式I化合物及其药学上可接受的盐，水合物，酯和前药，其中R 1，R 2，R 3，R 4，R 5，环A和Z如本文所定义。本教导还提供制备式I化合物的方法和使用式I化合物治疗全部或部分由脱乙酰酶介导的病理状况或病症的方法。

13. 发明申请

US20090161998A1 Method for optimizing a grooved bearing pattern on a bearing surface of a fluid dynamic bearing for the purpose of improving the bearing properties and an appropriate grooved bearing pattern 审中-公开
标题翻译：为了改善轴承性能和适当的槽形轴承图案，优化流体动力轴承的轴承表面上的带槽轴承图案的方法
公开(公告)号：US20090161998A1
公开(公告)日：2009-06-25
申请号：US12316709
申请日：2008-12-16
申请人： Lei Jiang , Martin Bauer
发明人： Lei Jiang , Martin Bauer
IPC分类号： F16C32/06
CPC分类号： F16C33/10
摘要： The invention relates to a method for optimizing a grooved bearing pattern on a bearing surface of a fluid dynamic bearing for the purpose of improving the bearing properties as well as an appropriately designed grooved bearing pattern, the grooved bearing pattern having a defined length, width and depth, and the bearing surface being moveable with respect to another associated bearing surface in at least one direction of movement, having the following steps:selection of a bearing property to be improved, optimization of the geometry of the grooved bearing pattern in respect of the bearing property to be improved by adjusting one or more of the following parameters of the grooved bearing pattern: depth, width, length, angle with respect to direction of movement of the bearing surface or its normal, contour, geometry of the transition to adjacent surfaces.
摘要翻译：本发明涉及一种用于优化流体动力轴承的支承表面上的带槽轴承图案以改善轴承性能以及适当设计的带槽轴承图案的方法，所述带槽轴承图案具有限定的长度，宽度和深度，并且所述支承表面可在至少一个运动方向上相对于另一个相关联的支承表面移动，具有以下步骤：选择要改进的轴承属性，优化所述带槽轴承图案的几何形状通过调整带槽轴承图案的以下参数中的一个或多个来确定轴承性能：相对于支承表面的运动方向的深度，宽度，长度，角度或其相对于相邻表面的过渡的几何形状。

14. 发明申请

US20090110337A1 Fluid bearing having improved wear properties 审中-公开
标题翻译：具有改善磨损性能的流体轴承
公开(公告)号：US20090110337A1
公开(公告)日：2009-04-30
申请号：US12290261
申请日：2008-10-29
申请人： Lei Jiang , Martin Bauer , Huseyin Taner Baytekin
发明人： Lei Jiang , Martin Bauer , Huseyin Taner Baytekin
IPC分类号： F16C32/06
CPC分类号： F16C33/107 , F16C17/026 , F16C17/107 , F16C2240/40
摘要： A radial fluid bearing having improved wear properties in the operating state of start-up and run-down, the bearing pattern being formed in the region between a bearing bush and a shaft engaging through the bearing bush and consisting of a plurality of grooves disposed at a distance from one another, characterized in that at least the groove depth of the radial bearing is made smaller than that of the prior art, a groove depth of less than 3 micrometers being preferred.
摘要翻译：一种径向流体轴承，其在启动和断开的操作状态下具有改善的磨损特性，所述轴承图案形成在轴承衬套与通过所述轴承衬套接合的轴之间的区域中，所述轴由多个槽组成，彼此相距一定的距离，其特征在于至少使径向轴承的槽深小于现有技术的凹槽深度，优选小于3微米的凹槽深度。

15. 发明申请

US20080213995A1 Ultrasonic electropolishing of conductive material 审中-公开
标题翻译：超声波电解抛光导电材料
公开(公告)号：US20080213995A1
公开(公告)日：2008-09-04
申请号：US11713215
申请日：2007-03-02
申请人： Tatyana N. Andryushchenko , Radek P. Chalupa , Anne E. Miller , Lei Jiang
发明人： Tatyana N. Andryushchenko , Radek P. Chalupa , Anne E. Miller , Lei Jiang
IPC分类号： H01L21/44 , C25D17/00
CPC分类号： C25D5/02 , C25D7/123 , C25F3/30 , H01L21/32115 , H01L21/7684
摘要： In one embodiment, the present invention includes a method for forming a dielectric layer on a semiconductor wafer and patterning at least one opening in the dielectric layer, depositing a barrier layer over the dielectric layer, depositing a conductive layer over the barrier layer, and electropolishing the conductive layer while ultrasonically agitating the semiconductor wafer until a predetermined amount of the conductive layer remains over the barrier layer. Other embodiments are described and claimed.
摘要翻译：在一个实施例中，本发明包括一种用于在半导体晶片上形成电介质层并图案化介电层中的至少一个开口，在电介质层上沉积阻挡层，在阻挡层上沉积导电层和电解抛光导电层，同时超声搅拌半导体晶片，直到预定量的导电层保留在阻挡层上。描述和要求保护其他实施例。

16. 发明授权

US07288019B2 Method of changing the surface wettability of polymer materials 有权
标题翻译：改变聚合物材料的表面润湿性的方法
公开(公告)号：US07288019B2
公开(公告)日：2007-10-30
申请号：US10590395
申请日：2004-11-30
申请人： Chaowei Guo , Lin Feng , Lei Jiang
发明人： Chaowei Guo , Lin Feng , Lei Jiang
IPC分类号： B24B1/00
CPC分类号： B29C59/02 , B29C2059/027
摘要： The present invention belongs to the field of surface modification of solid materials, specifically relates to a method of changing the surface wettability of polymer materials. The method of the present invention comprises of rubbing the surface of the polymer materials various times by using sand paper of different grades (GB/T 15305) with a determined pressure at the ambient temperature, so as to change the contact angle of said surface of polymer material with water thereby changing the surface wettability of the polymer materials to different degrees. The method of the present invention has advantages of using devices that are simple, low cost, and the surface characteristics of the polymer materials could be changed from hydrophilicity to hydrophobicity, from hydrophobicity to super hydrophobicity, or from hydrophilicity to super hydrophilicity, at ambient temperature without any special requirement to the polymer materials or the preparation process thereof.
摘要翻译：本发明属于固体材料的表面改性领域，具体涉及改变聚合物材料的表面润湿性的方法。本发明的方法包括通过使用不同等级的砂纸（GB / T 15305）在环境温度下以确定的压力摩擦聚合物材料的表面，以便改变所述表面的接触角聚合物材料与水，从而将聚合物材料的表面润湿性改变到不同程度。本发明的方法具有使用简单，成本低廉的装置的优点，并且在环境温度下，聚合物材料的表面特性可以从亲水性变为疏水性，从疏水性变为超疏水性，或从亲水性变为超级亲水性对聚合物材料或其制备方法没有任何特殊要求。

17. 发明授权

US07021999B2 Rinse apparatus and method for wafer polisher 失效
标题翻译：晶圆抛光机的冲洗装置及方法
公开(公告)号：US07021999B2
公开(公告)日：2006-04-04
申请号：US11099926
申请日：2005-04-05
申请人： Lei Jiang , Jin Liu , Sadasivan Shankar , Thomas Bramblett
发明人： Lei Jiang , Jin Liu , Sadasivan Shankar , Thomas Bramblett
IPC分类号： B24B1/00
CPC分类号： B24B53/017
摘要： An apparatus for polishing a wafer comprising a rotatable polishing pad having a center of rotation and a rinse delivery conduit positioned adjacent to the polishing pad and substantially in radial alignment with the center. The rinse delivery conduit includes a plurality of nozzles to dispense a rinsing liquid. In one embodiment, the plurality of nozzles are configured and positioned to generate a higher flow rate of the rinsing liquid at the end of the rinse delivery conduit proximate to the center than at the end of the rinse delivery conduit distal to the center. In another embodiment, the rinse delivery conduit has a proximal end which is substantially adjacent the center and the distal end which is approximately adjacent an outer periphery of the pad.
摘要翻译：一种用于抛光晶片的装置，包括具有旋转中心的可旋转抛光垫和邻近抛光垫定位并基本上与中心径向对准的冲洗输送导管。冲洗输送导管包括多个喷嘴以分配冲洗液体。在一个实施例中，多个喷嘴被配置和定位成在漂洗输送导管的末端靠近中心产生较高流量的漂洗液体，而不是在远离中心的漂洗输送导管末端。在另一个实施例中，冲洗输送导管具有基本上邻近中心的近端和与垫的外周近似近似的远端。

18. 发明申请

US20050181709A1 Rinse apparatus and method for wafer polisher 失效
标题翻译：晶圆抛光机的冲洗装置及方法
公开(公告)号：US20050181709A1
公开(公告)日：2005-08-18
申请号：US11099926
申请日：2005-04-05
申请人： Lei Jiang , Jin Liu , Sadasivan Shankar , Thomas Bramblett
发明人： Lei Jiang , Jin Liu , Sadasivan Shankar , Thomas Bramblett
IPC分类号： B24B37/04 , B24B53/007 , B24B1/00
CPC分类号： B24B53/017
摘要： An apparatus for polishing a wafer comprising a rotatable polishing pad having a center of rotation and a rinse delivery conduit positioned adjacent to the polishing pad and substantially in radial alignment with the center. The rinse delivery conduit includes a plurality of nozzles to dispense a rinsing liquid. In one embodiment, the plurality of nozzles are configured and positioned to generate a higher flow rate of the rinsing liquid at the end of the rinse delivery conduit proximate to the center than at the end of the rinse delivery conduit distal to the center. In another embodiment, the rinse delivery conduit has a proximal end which is substantially adjacent the center and the distal end which is approximately adjacent an outer periphery of the pad.
摘要翻译：一种用于抛光晶片的装置，包括具有旋转中心的可旋转抛光垫和邻近抛光垫定位并基本上与中心径向对准的冲洗输送导管。冲洗输送导管包括多个喷嘴以分配冲洗液体。在一个实施例中，多个喷嘴被配置和定位成在漂洗输送导管的末端靠近中心产生较高流量的漂洗液体，而不是在远离中心的漂洗输送导管末端。在另一个实施例中，冲洗输送导管具有基本上邻近中心的近端和与垫的外周近似近似的远端。

19. 发明授权

US06908370B1 Rinse apparatus and method for wafer polisher 失效
公开(公告)号：US06908370B1
公开(公告)日：2005-06-21
申请号：US10728550
申请日：2003-12-04
申请人： Lei Jiang , Jin Liu , Sadasivan Shankar , Thomas Bramblett
发明人： Lei Jiang , Jin Liu , Sadasivan Shankar , Thomas Bramblett
IPC分类号： B24B37/04 , B24B53/007 , B24B1/00
CPC分类号： B24B53/017
摘要： An apparatus for polishing a wafer comprising a rotatable polishing pad having a center of rotation and a rinse delivery conduit positioned adjacent to the polishing pad and substantially in radial alignment with the center. The rinse delivery conduit includes a plurality of nozzles to dispense a rinsing liquid. In one embodiment, the plurality of nozzles are configured and positioned to generate a higher flow rate of the rinsing liquid at the end of the rinse delivery conduit proximate to the center than at the end of the rinse delivery conduit distal to the center. In another embodiment, the rinse delivery conduit has a proximal end which is substantially adjacent the center and the distal end which is approximately adjacent an outer periphery of the pad.

20. 发明申请

US20050124267A1 RINSE APPARATUS AND METHOD FOR WAFER POLISHER 失效
标题翻译：用于波轮抛光的冲洗装置和方法
公开(公告)号：US20050124267A1
公开(公告)日：2005-06-09
申请号：US10728550
申请日：2003-12-04
申请人： Lei Jiang , Jin Liu , Sadasivan Shankar , Thomas Bramblett
发明人： Lei Jiang , Jin Liu , Sadasivan Shankar , Thomas Bramblett
IPC分类号： B24B37/04 , B24B53/007 , B24B1/00
CPC分类号： B24B53/017
摘要： An apparatus for polishing a wafer comprising a rotatable polishing pad having a center of rotation and a rinse delivery conduit positioned adjacent to the polishing pad and substantially in radial alignment with the center. The rinse delivery conduit includes a plurality of nozzles to dispense a rinsing liquid. In one embodiment, the plurality of nozzles are configured and positioned to generate a higher flow rate of the rinsing liquid at the end of the rinse delivery conduit proximate to the center than at the end of the rinse delivery conduit distal to the center. In another embodiment, the rinse delivery conduit has a proximal end which is substantially adjacent the center and the distal end which is approximately adjacent an outer periphery of the pad.
摘要翻译：一种用于抛光晶片的装置，包括具有旋转中心的可旋转抛光垫和邻近抛光垫定位并基本上与中心径向对准的冲洗输送导管。冲洗输送管道包括多个喷嘴以分配冲洗液体。在一个实施例中，多个喷嘴被配置和定位成在漂洗输送导管的末端靠近中心产生较高流量的漂洗液体，而不是在远离中心的漂洗输送导管末端。在另一个实施例中，冲洗输送导管具有基本上邻近中心的近端和与垫的外周近似近似的远端。

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