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    • 76. 发明申请
    • METHOD OF ANTISTATIC DEPOSITION ON COMPONENTS OF MOBILE PHONE
    • 移动电话组件的抗静电沉积方法
    • US20100039745A1
    • 2010-02-18
    • US12440018
    • 2007-08-31
    • Byung Hoon RyouWon Mo SungJun Lee
    • Byung Hoon RyouWon Mo SungJun Lee
    • H05F1/02B05D7/00B29C43/18
    • C23C14/20B29C45/0053B29C45/16B29L2009/008B29L2031/3437B29L2031/3493H05K9/0067
    • The present invention provides an antistatic deposition method of a wireless terminal component, which comprises depositing tin (Sn) or a tin-aluminum (Sn—Al) alloy on a molded material for a wireless terminal component. Also, the present invention discloses an antistatic deposition method of a wireless terminal component, which comprises: depositing tin (Sn) or a tin-aluminum (Sn—Al) alloy on a molded material for a wireless terminal component; and depositing one or more materials selected from the group consisting of Si, SiO, Ti, TiO, Al O and a mixture thereof on the deposited tin (Sn) layer or the deposited tin-aluminum (Sn—Al) alloy layer. The antistatic deposition method of a wireless terminal component according to the present invention has advantageous effects in that it overcomes the problems of the prior art that generation of static electricity adversely affects the performance of the inner circuits of the wireless terminal in case where a metal such as nickel (Ni), chrome (Cr) or the like is deposited on a wireless terminal component so as to create a mirror effect, and in that it can maintain an mirror effect and the performance of radio frequencies, can prevent peel-off of a tin (Sn) or tin-aluminum (Sn—Al) alloy deposited on a molded material for a wireless terminal component, and can improve scratch resistance and impact resistance of the wireless terminal component.
    • 本发明提供一种无线终端部件的抗静电沉积方法,其包括在用于无线终端部件的模制材料上沉积锡(Sn)或锡 - 铝(Sn-Al)合金。 另外,本发明公开了一种无线终端部件的抗静电沉积方法,包括:在用于无线终端部件的模制材料上沉积锡(Sn)或锡 - 铝(Sn-Al)合金; 并且在沉积的锡(Sn)层或沉积的锡 - 铝(Sn-Al)合金层上沉积选自由Si,SiO,Ti,TiO,AlO及其混合物组成的组中的一种或多种材料。 根据本发明的无线终端部件的抗静电沉积方法具有有利的效果,因为它克服了现有技术的问题,静电的产生在金属等的情况下对无线终端的内部电路的性能产生不利影响 因为镍(Ni),铬(Cr)等沉积在无线终端部件上,以产生镜面效果,并且因为它可以保持镜面效果和射频的性能,可以防止剥离 沉积在用于无线终端部件的模制材料上的锡(Sn)或锡 - 铝(Sn-Al)合金,并且可以提高无线终端部件的耐擦伤性和抗冲击性。