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    • 4. 发明授权
    • Deicing louvers for datacenter applications
    • 数据中心应用程序的除冰百叶窗
    • US08978747B2
    • 2015-03-17
    • US12982884
    • 2010-12-31
    • Eric C PetersonChristian L. Belady
    • Eric C PetersonChristian L. Belady
    • H05K7/00F24F12/00F24F13/00H05K7/20F24F13/14F24F11/00
    • H05K7/20745F24F11/41F24F13/14H05K7/20836Y10S165/909
    • A datacenter may use heat collected from a heat exchanger at the exhaust portion of a cooling system to heat inlet louvers for an atmospheric intake. The louvers may have fluid passages through which heated fluid may pass and cause the louvers to heat up. The heated louvers may operate during periods of snow, rain, high humidity, or other conditions to eliminate condensation, snow and ice buildup, or other problems. In some embodiments, a liquid may be passed through the louvers, while in other embodiments, heated air or other gas may be passed through conductive paths in the louvers. In a heated air system, holes in the louvers may allow the heated air to enter the incoming airstream to regulate the incoming temperature to the datacenter.
    • 数据中心可以使用从冷却系统的排气部分的热交换器收集的热量来加热大气摄入的入口百叶窗。 百叶窗可以具有流体通道,加热的流体可以通过流体通道,并使百叶窗加热。 加热的百叶窗可以在雪,雨,高湿度或其他条件期间操作,以消除冷凝,积雪积雪或其他问题。 在一些实施例中,液体可以通过百叶窗,而在其他实施例中,加热的空气或其它气体可以通过百叶窗中的导电路径。 在加热的空气系统中,百叶窗中的孔可以允许加热的空气进入进入的空气流以调节到数据中心的进入温度。
    • 5. 发明申请
    • CLIMATE REGULATOR CONTROL FOR DEVICE ENCLOSURES
    • 用于装置外壳的气候调节器控制
    • US20130344794A1
    • 2013-12-26
    • US13530899
    • 2012-06-22
    • Mark ShawMatthew Allen FaistEric C. PetersonHarry Raymond Rogers
    • Mark ShawMatthew Allen FaistEric C. PetersonHarry Raymond Rogers
    • F24F11/02
    • G06F1/206H05K7/20836
    • Climate regulation within an enclosure (e.g., a case of a workstation or a rack or cabinet of servers) may be achieved through a climate regulator featuring several selectable climate regulator settings (e.g., a variable-speed fan array). Controllers of such climate regulators often select climate regulator settings based on current conditions inside the enclosure, such as the temperature of one or more processors operating within the enclosure. However, such control fails to account for the climate of air outside the enclosure that is drawn in to provide climate regulation, even though the climate properties of inlet air may significantly affect the effectiveness of climate regulation. Accordingly, a controller of a climate regulator may be configured to detect inlet climate properties of air directed into the enclosure, and to map the inlet climate properties (alone or in combination with other factors) to a selected climate regulator setting for the climate regulator.
    • 外壳内的气候调节(例如,工作站或机架或机柜的服务器的情况)可以通过具有若干可选气候调节器设置(例如,变速风扇阵列)的气候调节器来实现。 这种气候调节器的控制器通常根据机箱内的当前条件(例如在机箱内运行的一个或多个处理器的温度)来选择气候调节器设置。 然而,这种控制不能解释为了提供气候调节而被吸引到外壳外部的空气气候,即使入口空气的气候特性可能会显着影响气候调节的有效性。 因此,气候调节器的控制器可以被配置为检测引导到外壳中的空气的入口气候特性,并且将入口气候特性(单独地或与其他因素组合)映射到用于气候调节器的选定的气候调节器设置。
    • 6. 发明申请
    • MULTI-CHASSIS CLIMATE REGULATOR PLENUM
    • 多层次气候变化监管机构
    • US20130295834A1
    • 2013-11-07
    • US13465164
    • 2012-05-07
    • Matthew Allen FaistEric C. Peterson
    • Matthew Allen FaistEric C. Peterson
    • F24F7/00H05K5/02
    • H05K7/20736F24F2011/0006
    • Climate regulation within a chassis of an electronics enclosure (e.g., a workstation case or a server cabinet) may be achieved through an airflow regulated by at least one climate regulator devices (e.g., a variable-speed fan array) and a plenum configured to direct the airflow at the components of the enclosure. The enclosure may store a set of chassis, each having a dedicated plenum and climate regulator devices. However, this architecture may be less efficient than an architecture wherein adjacently mounted chassis may connect plenums (e.g., directly connecting an exhaust of one plenum with an inlet of the adjacent plenum) to unify the airflow directed through several chassis. Additionally, the chassis may feature a removable portion of the plenum wall that provides access to the plenum, and the climate regulator devices may be mounted on the removable portion, such that detachment enables withdrawal and servicing of the climate regulator devices.
    • 可以通过由至少一个气候调节器装置(例如,可变速风扇阵列)调节的气流和被配置为引导的气室来实现电子机箱(例如,工作站外壳或服务器机柜)的底盘内的气候调节 外壳部件的气流。 外壳可以存储一组底盘,每个底盘具有专用的气室和气候调节器装置。 然而,这种架构可能比其中相邻安装的底盘可以连接气室(例如,将一个增压室的排气直接连接到相邻增压室的入口)的架构效率较低,以统一通过多个机架引导的气流。 此外,底盘可以具有提供通向气室的通风壁的可移除部分,并且气候调节器装置可以安装在可移除部分上,使得分离能够撤回和维修气候调节器装置。
    • 7. 发明授权
    • Cooling apparatus for an IC
    • IC冷却装置
    • US08542488B2
    • 2013-09-24
    • US13146884
    • 2009-01-29
    • Eric C. PetersonBrandon Rubenstein
    • Eric C. PetersonBrandon Rubenstein
    • G06F1/20H05K13/00H05K7/20
    • G06F1/20G06F2200/201H01L23/4006H01L23/473H01L2924/0002Y10T29/49002H01L2924/00
    • A cooling apparatus is disclosed. The cooling apparatus comprising a printed circuit (PC) board with an integrated circuit (IC) socket mounted onto the top side of the PC board. A mounting frame generally in the shape of a plate, with a first opening passing through the center of the plate, is mounted on the top side of the PC board with the IC socket located inside the first opening. A cold plate is attached to the mounting frame, the cold plate has an opening that passes through the cold plate. The opening in the cold plate is sized to allow an IC to be inserted into the IC socket through the opening. A fluid passageway is formed inside the cold plate. A fluid inlet port and a fluid outlet port are mounted on the cold plate and coupled to a first end and a second end of the fluid passageway, respectively. A heat spreader is removably attached to the top side of the cold plate wherein the bottom side of the heat spreader is configured to contact the top side of an IC when the IC is mounted in the IC socket.
    • 公开了一种冷却装置。 该冷却装置包括印刷电路板(PC),其具有安装在PC板的顶侧上的集成电路(IC)插座。 大体上为板状的安装框架,其中穿过板的中心的第一开口安装在PC板的顶侧,IC插座位于第一开口的内部。 冷板连接到安装框架上,冷板具有穿过冷板的开口。 冷板中的开口尺寸设计成允许IC通过开口插入到IC插座中。 在冷板内形成流体通道。 流体入口和流体出口分别安装在冷板上并分别连接到流体通道的第一端和第二端。 散热器可移除地附接到冷板的顶侧,其中当IC安装在IC插座中时,散热器的底侧被配置为接触IC的顶侧。
    • 9. 发明申请
    • COOLING APPARATUS
    • 冷却装置
    • US20110304979A1
    • 2011-12-15
    • US13146884
    • 2009-01-29
    • Eric C. PetersonBrandon Rubenstein
    • Eric C. PetersonBrandon Rubenstein
    • G06F1/20H05K13/00H05K7/20
    • G06F1/20G06F2200/201H01L23/4006H01L23/473H01L2924/0002Y10T29/49002H01L2924/00
    • A cooling apparatus is disclosed. The cooling apparatus comprising a printed circuit (PC) board with an integrated circuit (IC) socket mounted onto the top side of the PC board. A mounting frame generally in the shape of a plate, with a first opening passing through the center of the plate, is mounted on the top side of the PC board with the IC socket located inside the first opening. A cold plate is attached to the mounting frame, the cold plate has an opening that passes through the cold plate. The opening in the cold plate is sized to allow an IC to be inserted into the IC socket through the opening. A fluid passageway is formed inside the cold plate. A fluid inlet port and a fluid outlet port are mounted on the cold plate and coupled to a first end and a second end of the fluid passageway, respectively. A heat spreader is removably attached to the top side of the cold plate wherein the bottom side of the heat spreader is configured to contact the top side of an IC when the IC is mounted in the IC socket.
    • 公开了一种冷却装置。 该冷却装置包括印刷电路板(PC),其具有安装在PC板的顶侧上的集成电路(IC)插座。 大体上为板状的安装框架,其中穿过板的中心的第一开口安装在PC板的顶侧,IC插座位于第一开口的内部。 冷板连接到安装框架上,冷板具有穿过冷板的开口。 冷板中的开口尺寸设计成允许IC通过开口插入到IC插座中。 在冷板内形成流体通道。 流体入口和流体出口分别安装在冷板上并分别连接到流体通道的第一端和第二端。 散热器可移除地附接到冷板的顶侧,其中当IC安装在IC插座中时,散热器的底侧被配置为接触IC的顶侧。