专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110285284A1 Light Emitting Device Using AC and Manufacturing Method of the Same 审中-公开
标题翻译：使用交流电的发光装置及其制造方法
公开(公告)号：US20110285284A1
公开(公告)日：2011-11-24
申请号：US12911372
申请日：2010-10-25
申请人： Yugang Zhou , Zhaoming Zeng , Yin Hing Lai , Chi Wing Keung , Chaojun Xu , Ruizhen Wang , Guowei David Xiao
发明人： Yugang Zhou , Zhaoming Zeng , Yin Hing Lai , Chi Wing Keung , Chaojun Xu , Ruizhen Wang , Guowei David Xiao
IPC分类号： F21V23/00 , H01L33/48
CPC分类号： H05B33/0821 , H01L25/0753 , H01L25/167 , H01L2224/16 , Y02B20/348
摘要： The present invention relates to a light emitting device using AC, comprising: at least one LED chip and an AC driving circuit chip, wherein the AC driving circuit chip comprises a substrate and a rectifying circuit integrated on the substrate. The LED chip is flipped and bonded on the AC driving circuit chip by flip-chip technology and electrically connected to the rectifying circuit, and the AC driving circuit chip converts the AC into DC for supply to the LED chip. The present invention further relates to a method of manufacturing the light emitting device using AC, comprising the following steps of: (1) forming an LED chip; (2) integrating a rectifying circuit on a substrate, forming two power source connecting terminals on the substrate, and forming an AC driving circuit chip; and (3) flip-chip bonding the LED chip on the AC driving circuit chip and in electrical connection with the rectifying circuit on the substrate. The light emitting device according to the present invention can be used by being directly connected to AC without needing any external integrated circuit device or electronic parts, thereby saving the assembling space and improving flexibility in use and meanwhile enhancing use efficiency of the light emitting regions.
摘要翻译：本发明涉及一种使用AC的发光器件，包括：至少一个LED芯片和AC驱动电路芯片，其中所述AC驱动电路芯片包括集成在所述衬底上的衬底和整流电路。 LED芯片通过倒装芯片技术在AC驱动电路芯片上被翻转和接合，并且与整流电路电连接，并且AC驱动电路芯片将AC转换成DC以供给LED芯片。本发明还涉及使用AC制造发光器件的方法，包括以下步骤：（1）形成LED芯片; （2）将整流电路集成在基板上，在基板上形成两个电源连接端子，形成交流驱动电路芯片; 和（3）将LED芯片倒装芯片连接在AC驱动电路芯片上并与基板上的整流电路电连接。根据本发明的发光器件可以通过直接连接到AC而不需要任何外部集成电路器件或电子部件来使用，从而节省组装空间并提高使用的灵活性，同时提高发光区域的使用效率。

2. 发明授权

US07199036B2 Under-bump metallization layers and electroplated solder bumping technology for flip-chip 有权
标题翻译：凸块下金属化层和电镀焊料凸块技术用于倒装芯片
公开(公告)号：US07199036B2
公开(公告)日：2007-04-03
申请号：US10854174
申请日：2004-05-27
申请人： Chingho Philip Chan , Guowei David Xiao
发明人： Chingho Philip Chan , Guowei David Xiao
IPC分类号： H01L21/44
CPC分类号： H01L24/03 , H01L24/11 , H01L2224/0347 , H01L2224/03912 , H01L2224/03914 , H01L2224/0401 , H01L2224/05147 , H01L2224/1147 , H01L2224/11849 , H01L2224/119 , H01L2224/11901 , H01L2224/131 , H01L2224/29111 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/05042 , H01L2924/09701 , H01L2924/14 , H01L2924/30107 , H01L2924/3651 , H01L2224/13099
摘要： A series of improved processes and methods to manufacture solder bumps on the wafer which shrink the space among solder bumps and reduce the cost of manufacturing. A design method and a relevant manufacturing process are introduced to form an organic material or metal material layer, which is called a Bump-Reflow-Control Layer. The pad patterns can be defined by this method. A mechanical part is designed with a hermetic cover to improve the photoresist process. The series of photolithography process including the designing method of related photolithography mask is introduced to achieve the high quality and thick photoresist.
摘要翻译：一系列改进的在晶片上制造焊料凸块的工艺和方法，其缩小焊料凸块之间的空间并降低制造成本。引入了一种设计方法和相关的制造工艺，以形成一种称为凸块回流控制层的有机材料或金属材料层。可以通过该方法定义焊盘图案。机械部件设计有密封盖以改善光致抗蚀剂工艺。引入了包括相关光刻掩模的设计方法的光刻工艺系列，以实现高品质和厚光致抗蚀剂。

3. 发明授权

US08138515B2 Surface mounted LED structure and packaging method of integrating functional circuits on a silicon 有权
标题翻译：表面安装的LED结构和在硅上集成功能电路的封装方法
公开(公告)号：US08138515B2
公开(公告)日：2012-03-20
申请号：US13024083
申请日：2011-02-09
申请人： Zhaoming Zeng , Guowei David Xiao , Haiying Chen , Yugang Zhou , Yu Hou
发明人： Zhaoming Zeng , Guowei David Xiao , Haiying Chen , Yugang Zhou , Yu Hou
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L24/73 , H01L33/486 , H01L33/54 , H01L33/64 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention relates to a surface mounted LED structure of integrating functional circuits on a silicon substrate, comprising the silicon substrate and an LED chip. Said silicon substrate has an upper surface of planar structure without grooves. An oxide layer covers the upper surface of the silicon substrate, and metal electrode layers are arranged in the upper surface of the oxide layer. The upper surfaces of said metal electrode layers are arranged with metal bumps, and the LED chip is flip-chip mounted to the silicon substrate. Two conductive metal pads are arranged on the lower surface of said silicon substrate, said conductive metal pads are electrically connected to the metal electrode layers on the upper surface of the silicon substrate by a metal lead arranged on the side wall of the silicon substrate. A heat conduction metal pad is arranged on the corresponding lower, surface of the silicon substrate just below the LED chip. Peripheral functional circuits required by LED are integrated on the upper surface of said silicon substrate. The structure of the present invention has advantages of good heat dissipation effect and small volume, and direct integration of functional circuits such as protection and drive circuits etc. in the silicon substrate achieves large-scale production package of wafer level, reducing the cost of packaging and lighting fixture.
摘要翻译：本发明涉及一种在硅衬底上集成功能电路的表面安装LED结构，包括硅衬底和LED芯片。所述硅衬底具有没有凹槽的平面结构的上表面。氧化物层覆盖硅衬底的上表面，金属电极层设置在氧化物层的上表面。所述金属电极层的上表面配置有金属凸块，将LED芯片倒装安装在硅基板上。在所述硅衬底的下表面上布置两个导电金属焊盘，所述导电金属焊盘通过布置在硅衬底的侧壁上的金属引线电连接到硅衬底的上表面上的金属电极层。在LED芯片正下方的硅衬底的相对的下表面上布置有导热金属焊盘。 LED所需的外围功能电路集成在所述硅衬底的上表面上。本发明的结构具有散热效果好，体积小的优点，硅衬底等保护和驱动电路等功能电路的直接集成实现了晶片级的大规模生产封装，降低了封装成本和照明灯具。

4. 发明申请

US20120025242A1 SURFACE MOUNTED LED STRUCTURE AND PACKAGING METHOD OF INTEGRATING FUNCTIONAL CIRCUITS ON A SILICON 有权
标题翻译：在硅上集成功能电路的表面安装LED结构和封装方法
公开(公告)号：US20120025242A1
公开(公告)日：2012-02-02
申请号：US13024083
申请日：2011-02-09
申请人： Zhaoming ZENG , Guowei David XIAO , Haiying CHEN , Yugang ZHOU , Yu HOU
发明人： Zhaoming ZENG , Guowei David XIAO , Haiying CHEN , Yugang ZHOU , Yu HOU
IPC分类号： H01L33/58 , H01L33/62
CPC分类号： H01L33/62 , H01L24/73 , H01L33/486 , H01L33/54 , H01L33/64 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention relates to a surface mounted LED structure of integrating functional circuits on a silicon substrate, comprising the silicon substrate and an LED chip. Said silicon substrate has an upper surface of planar structure without grooves. An oxide layer covers the upper surface of the silicon substrate, and metal electrode layers are arranged in the upper surface of the oxide layer. The upper surfaces of said metal electrode layers are arranged with metal bumps, and the LED chip is flip-chip mounted to the silicon substrate. Two conductive metal pads are arranged on the lower surface of said silicon substrate, said conductive metal pads are electrically connected to the metal electrode layers on the upper surface of the silicon substrate by a metal lead arranged on the side wall of the silicon substrate. A heat conduction metal pad is arranged on the corresponding lower, surface of the silicon substrate just below the LED chip. Peripheral functional circuits required by LED are integrated on the upper surface of said silicon substrate. The structure of the present invention has advantages of good heat dissipation effect and small volume, and direct integration of functional circuits such as protection and drive circuits etc. in the silicon substrate achieves large-scale production package of wafer level, reducing the cost of packaging and lighting fixture.
摘要翻译：本发明涉及一种在硅衬底上集成功能电路的表面安装LED结构，包括硅衬底和LED芯片。所述硅衬底具有没有凹槽的平面结构的上表面。氧化物层覆盖硅衬底的上表面，金属电极层设置在氧化物层的上表面。所述金属电极层的上表面配置有金属凸块，将LED芯片倒装安装在硅基板上。在所述硅衬底的下表面上布置两个导电金属焊盘，所述导电金属焊盘通过布置在硅衬底的侧壁上的金属引线电连接到硅衬底的上表面上的金属电极层。在LED芯片正下方的硅衬底的相对的下表面上布置有导热金属焊盘。 LED所需的外围功能电路集成在所述硅衬底的上表面上。本发明的结构具有散热效果好，体积小的优点，硅衬底等保护和驱动电路等功能电路的直接集成实现了晶片级的大规模生产封装，降低了封装成本和照明灯具。

5. 发明申请

US20120025241A1 SURFACE MOUNTED LED PACKAGING STRUCTURE AND METHOD BASED ON A SILICON SUBSTRATE 审中-公开
标题翻译：基于硅衬底的表面安装LED封装结构和方法
公开(公告)号：US20120025241A1
公开(公告)日：2012-02-02
申请号：US13019508
申请日：2011-02-02
申请人： Guowei David XIAO , Zhaoming ZENG , Haiying CHEN , Yugang ZHOU , Yu HOU
发明人： Guowei David XIAO , Zhaoming ZENG , Haiying CHEN , Yugang ZHOU , Yu HOU
IPC分类号： H01L33/58
CPC分类号： H01L33/64 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2924/10253 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A surface mounted LED packaging structure based on a silicon substrate includes the silicon substrate, an LED chip, an annular convex wall and a lens. The silicon substrate has an upper surface of planar structure and without grooves. An oxide layer covers the upper surface of the silicon substrate. Metal electrode layers are arranged in the upper surface of the oxide layer, and the upper surfaces of the metal electrode layers are arranged with metal bumps. Vias through the silicon substrate are provided under the metal electrode layers. An insulating layer covers the inner wall of the vias and a part of the lower surface of the silicon substrate. A metal connection layer covers the insulating layer surface within the vias. Two conductive metal pads are respectively arranged under the lower surface of the silicon substrate and insulated from the silicon substrate. A heat conduction metal pad is arranged on the lower surface of the silicon substrate. The LED chip is flip-chip mounted on the silicon substrate. The annular convex wall and the lens cause the LED chip and the metal electrode layers therein to be isolated from environment. The structure of the present invention has its advantages of good heat dissipation effect and small volume, while packaging without gold wires makes the structure highly reliable and achieves large-scale production of wafer level, resulting in the reduction of the packaging cost.
摘要翻译：基于硅衬底的表面贴装LED封装结构包括硅衬底，LED芯片，环形凸壁和透镜。硅衬底具有平面结构的上表面并且没有凹槽。氧化物层覆盖硅衬底的上表面。金属电极层配置在氧化物层的上表面，金属电极层的上表面配置有金属凸块。通过硅衬底的通孔设置在金属电极层的下方。绝缘层覆盖通孔的内壁和硅衬底的下表面的一部分。金属连接层覆盖通孔内的绝缘层表面。两个导电金属焊盘分别布置在硅衬底的下表面下方并与硅衬底绝缘。在硅衬底的下表面上设置导热金属焊盘。 LED芯片被倒装安装在硅衬底上。环形凸壁和透镜使得LED芯片和其中的金属电极层与环境隔离。本发明的结构具有散热效果好，体积小的优点，而没有金线的包装使结构高度可靠，实现了晶片级的大规模生产，从而降低了封装成本。

6. 发明授权

US07135355B2 Stencil mask design method and under bump metallurgy for C4 solder bump 有权
标题翻译： C4焊锡凸块的模板掩模设计方法和凸块下冶金
公开(公告)号：US07135355B2
公开(公告)日：2006-11-14
申请号：US10859089
申请日：2004-06-03
申请人： Chingho Philip Chan , Guowei David Xiao
发明人： Chingho Philip Chan , Guowei David Xiao
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05571 , H01L2224/05644 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2224/05099
摘要： A method for the fine-pitch stencil mask design for stencil printing bumping technology for eutectic Sn/Pb and lead-free solder material is described. In the method, a reflowing enhancement layer is introduced to improve the solder quality and reduce the pitch of solder bumps. The method of forming the layer is described as well as the forming method of matching under-bump metallurgy layer. The method of stencil mask design can match various sizes and pitch of the solder bumps. The designed mask is fixed on the stencil printer to deposit the solder materials with the required patterns. This method can increase the solder paste volume to increase the height of solder bumps after the reflowing process.
摘要翻译：描述了用于共晶Sn / Pb和无铅焊料材料的模版印刷凸起技术的精细间距模板掩模设计的方法。在该方法中，引入回流增强层以改善焊料质量并降低焊料凸块的间距。描述形成该层的方法以及匹配凸块下冶金层的形成方法。模板掩模设计的方法可以匹配焊料凸块的各种尺寸和间距。将设计的掩模固定在模版印刷机上，以便以所需的图案沉积焊料。该方法可以增加焊膏体积，以便在回流过程之后增加焊料凸块的高度。

7. 发明申请

US20120025214A1 LED PACKAGING STRUCTURE AND PACKAGING METHOD 审中-公开
标题翻译： LED包装结构和包装方法
公开(公告)号：US20120025214A1
公开(公告)日：2012-02-02
申请号：US13020466
申请日：2011-02-03
申请人： Chenghai RUAN , Zhaoming ZENG , Haiying CHEN , Guowei David XIAO
发明人： Chenghai RUAN , Zhaoming ZENG , Haiying CHEN , Guowei David XIAO
IPC分类号： H01L27/15 , H01L33/56
CPC分类号： H01L33/54 , H01L25/0753 , H01L2924/0002 , H01L2933/005 , H01L2924/00
摘要： The present invention relates to an LED packaging structure and packaging method. Said packaging structure includes a substrate, an LED chip, one or more convex walls and a colloid lens shaped by the restriction of the convex walls. Said convex walls are arranged on the substrate, at least one LED chip is arranged on the substrate within an area surrounded by the convex walls, and the colloid lens enclosing the LED chip is arranged within the area surrounded by the convex walls. The colloid lens is formed with desired colloid shape by placing a liquid colloid within the area confined by the convex walls and utilizing surface tension of the liquid, and is cured. Compared to prior art, the LED packaging structure of the present invention is simple and reasonable, with simple production process and lower costs.
摘要翻译：本发明涉及LED封装结构和封装方法。所述包装结构包括基板，LED芯片，一个或多个凸壁和通过限制凸壁成形的胶体透镜。所述凸壁布置在基板上，至少一个LED芯片布置在由凸壁包围的区域内的基板上，并且包围LED芯片的胶体透镜布置在由凸壁包围的区域内。通过将液体胶体放置在由凸壁限制的区域内并利用液体的表面张力，胶体透镜形成所需的胶体形状，并被固化。与现有技术相比，本发明的LED封装结构简单合理，生产工艺简单，成本低廉。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式