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1. 外观设计

USD967315S1 Golf putting mat 有权
公开(公告)号：USD967315S1
公开(公告)日：2022-10-18
申请号：US29791392
申请日：2022-01-10
申请人： Haiying Chen
设计人： Haiying Chen

2. 发明申请

US20130108530A1 PROCESS FOR PRODUCING CERIA-ZIRCONIA-ALUMINA COMPOSITE OXIDES AND APPLICATIONS THEREOF 审中-公开
标题翻译：生产氧化锆 - 氧化铝复合氧化物的方法及其应用
公开(公告)号：US20130108530A1
公开(公告)日：2013-05-02
申请号：US13283123
申请日：2011-10-27
申请人： Hsiao-Lan Chang , Scott Daniel Cauffman , Haiying Chen , Paul Joseph Andersen
发明人： Hsiao-Lan Chang , Scott Daniel Cauffman , Haiying Chen , Paul Joseph Andersen
IPC分类号： B01J21/06 , B01D53/94
CPC分类号： B01D53/945 , B01D2255/1023 , B01D2255/1025 , B01D2255/2065 , B01D2255/20715 , B01D2255/2092 , B01D2255/407 , B01D2255/908 , B01J23/002 , B01J23/10 , B01J23/40 , B01J35/023 , B01J35/1014 , B01J37/0045 , B01J37/009 , B01J37/035 , B01J37/06 , B01J37/088 , B01J2523/00 , Y02T10/22 , B01J2523/31 , B01J2523/3712 , B01J2523/48 , B01J2523/3706
摘要： A process for producing a ceria-zirconia-alumina composite oxide is disclosed. The process comprises combining a cerium (IV) compound and a zirconium (IV) compound with a slurry of aluminum oxide at a temperature greater than 40° C. to produce a reaction slurry, then contacting the reaction slurry with a precipitating agent to precipitate insoluble cerium and zirconium compounds onto the aluminum oxide and form cerium-zirconium-aluminum oxide particles, and calcining the cerium-zirconium-aluminum oxide particles to produce a ceria-zirconia-alumina composite oxide. The process to produce ceria-zirconia-alumina composite oxides provides a material having a high oxygen storage/release capacity that is suitable for a catalyst with enhanced cleaning of the exhaust gases from internal combustion engines.
摘要翻译：公开了二氧化铈 - 氧化锆 - 氧化铝复合氧化物的制造方法。该方法包括在大于40℃的温度下将铈（IV）化合物和锆（IV）化合物与氧化铝浆料组合以产生反应浆料，然后使反应浆料与沉淀剂接触以沉淀出不溶物铈和锆化合物在氧化铝上形成铈 - 锆 - 氧化铝颗粒，并煅烧铈 - 锆 - 氧化铝颗粒以制备二氧化铈 - 氧化锆 - 氧化铝复合氧化物。生产二氧化铈 - 氧化锆 - 氧化铝复合氧化物的方法提供了具有高氧储存/释放能力的材料，其适用于具有增强的来自内燃机的废气清洁的催化剂。

3. 发明申请

US20120025214A1 LED PACKAGING STRUCTURE AND PACKAGING METHOD 审中-公开
标题翻译： LED包装结构和包装方法
公开(公告)号：US20120025214A1
公开(公告)日：2012-02-02
申请号：US13020466
申请日：2011-02-03
申请人： Chenghai RUAN , Zhaoming ZENG , Haiying CHEN , Guowei David XIAO
发明人： Chenghai RUAN , Zhaoming ZENG , Haiying CHEN , Guowei David XIAO
IPC分类号： H01L27/15 , H01L33/56
CPC分类号： H01L33/54 , H01L25/0753 , H01L2924/0002 , H01L2933/005 , H01L2924/00
摘要： The present invention relates to an LED packaging structure and packaging method. Said packaging structure includes a substrate, an LED chip, one or more convex walls and a colloid lens shaped by the restriction of the convex walls. Said convex walls are arranged on the substrate, at least one LED chip is arranged on the substrate within an area surrounded by the convex walls, and the colloid lens enclosing the LED chip is arranged within the area surrounded by the convex walls. The colloid lens is formed with desired colloid shape by placing a liquid colloid within the area confined by the convex walls and utilizing surface tension of the liquid, and is cured. Compared to prior art, the LED packaging structure of the present invention is simple and reasonable, with simple production process and lower costs.
摘要翻译：本发明涉及LED封装结构和封装方法。所述包装结构包括基板，LED芯片，一个或多个凸壁和通过限制凸壁成形的胶体透镜。所述凸壁布置在基板上，至少一个LED芯片布置在由凸壁包围的区域内的基板上，并且包围LED芯片的胶体透镜布置在由凸壁包围的区域内。通过将液体胶体放置在由凸壁限制的区域内并利用液体的表面张力，胶体透镜形成所需的胶体形状，并被固化。与现有技术相比，本发明的LED封装结构简单合理，生产工艺简单，成本低廉。

4. 发明申请

US20090178396A1 EGR catalyzation with reduced EGR heating 审中-公开
标题翻译：减少EGR加热的EGR催化
公开(公告)号：US20090178396A1
公开(公告)日：2009-07-16
申请号：US12286001
申请日：2008-09-26
申请人： Aleksey Yezerets , Neal W. Currier , Bradlee J. Stroia , Haiying Chen , Howard Hess , Mahesh Konduru
发明人： Aleksey Yezerets , Neal W. Currier , Bradlee J. Stroia , Haiying Chen , Howard Hess , Mahesh Konduru
IPC分类号： F01N3/10
CPC分类号： F01N3/08 , F01N2370/04 , F01N2570/12 , F02B29/0406 , F02B37/00 , F02M26/05 , F02M26/28 , F02M26/35
摘要： One embodiment is a unique system of EGR catalyzation with reduced EGR heating. Further embodiments, forms, objects, features, advantages, aspects, and benefits shall become apparent from the following description and drawings.
摘要翻译：一个实施例是具有减少的EGR加热的EGR催化的独特系统。从以下说明和附图，其他实施例，形式，目的，特征，优点，方面和优点将变得显而易见。

5. 发明授权

US11117865B2 Inhibitors of bromodomain-containing protein 4 (BRD4) 有权
公开(公告)号：US11117865B2
公开(公告)日：2021-09-14
申请号：US16442526
申请日：2019-06-16
申请人： Jia Zhou , Allan R. Brasier , Bing Tian , Zhiqing Liu , Haiying Chen , Erik Rytting
发明人： Jia Zhou , Allan R. Brasier , Bing Tian , Zhiqing Liu , Haiying Chen , Erik Rytting
IPC分类号： A61K9/14 , A61P29/00 , C07D311/00 , C07D215/38 , C07D207/48 , C07D241/04 , C07D311/30 , C07D401/06 , C07D401/12 , C07D401/14 , C07D405/12 , C07D413/04 , C07D413/06 , C07D413/14 , C07D471/04
摘要： Certain embodiments are directed to small molecule selective inhibitors of the BRD4 bromodomain. Compounds described herein can be used to modulate the bronchiolar NFkB-BRD4 axis, which plays a role in acute neutrophilic response to viral molecular patterns. Compounds described herein can be developed as preventive and therapeutic agents for various human diseases and conditions.

6. 外观设计

USD965719S1 Golf hitting mat 有权
公开(公告)号：USD965719S1
公开(公告)日：2022-10-04
申请号：US29790651
申请日：2021-12-07
申请人： Haiying Chen
设计人： Haiying Chen

7. 发明授权

US08138515B2 Surface mounted LED structure and packaging method of integrating functional circuits on a silicon 有权
标题翻译：表面安装的LED结构和在硅上集成功能电路的封装方法
公开(公告)号：US08138515B2
公开(公告)日：2012-03-20
申请号：US13024083
申请日：2011-02-09
申请人： Zhaoming Zeng , Guowei David Xiao , Haiying Chen , Yugang Zhou , Yu Hou
发明人： Zhaoming Zeng , Guowei David Xiao , Haiying Chen , Yugang Zhou , Yu Hou
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L24/73 , H01L33/486 , H01L33/54 , H01L33/64 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention relates to a surface mounted LED structure of integrating functional circuits on a silicon substrate, comprising the silicon substrate and an LED chip. Said silicon substrate has an upper surface of planar structure without grooves. An oxide layer covers the upper surface of the silicon substrate, and metal electrode layers are arranged in the upper surface of the oxide layer. The upper surfaces of said metal electrode layers are arranged with metal bumps, and the LED chip is flip-chip mounted to the silicon substrate. Two conductive metal pads are arranged on the lower surface of said silicon substrate, said conductive metal pads are electrically connected to the metal electrode layers on the upper surface of the silicon substrate by a metal lead arranged on the side wall of the silicon substrate. A heat conduction metal pad is arranged on the corresponding lower, surface of the silicon substrate just below the LED chip. Peripheral functional circuits required by LED are integrated on the upper surface of said silicon substrate. The structure of the present invention has advantages of good heat dissipation effect and small volume, and direct integration of functional circuits such as protection and drive circuits etc. in the silicon substrate achieves large-scale production package of wafer level, reducing the cost of packaging and lighting fixture.
摘要翻译：本发明涉及一种在硅衬底上集成功能电路的表面安装LED结构，包括硅衬底和LED芯片。所述硅衬底具有没有凹槽的平面结构的上表面。氧化物层覆盖硅衬底的上表面，金属电极层设置在氧化物层的上表面。所述金属电极层的上表面配置有金属凸块，将LED芯片倒装安装在硅基板上。在所述硅衬底的下表面上布置两个导电金属焊盘，所述导电金属焊盘通过布置在硅衬底的侧壁上的金属引线电连接到硅衬底的上表面上的金属电极层。在LED芯片正下方的硅衬底的相对的下表面上布置有导热金属焊盘。 LED所需的外围功能电路集成在所述硅衬底的上表面上。本发明的结构具有散热效果好，体积小的优点，硅衬底等保护和驱动电路等功能电路的直接集成实现了晶片级的大规模生产封装，降低了封装成本和照明灯具。

8. 发明授权

US06143681A NO.sub.x reduction catalyst 失效
标题翻译： NOx还原催化剂
公开(公告)号：US06143681A
公开(公告)日：2000-11-07
申请号：US112997
申请日：1998-07-10
申请人： Wolfgang M. H. Sachtler , Haiying Chen
发明人： Wolfgang M. H. Sachtler , Haiying Chen
IPC分类号： B01D53/94 , B01J29/06 , B01J29/072 , B01J37/02 , B01J37/06 , B01J21/00
CPC分类号： B01J37/06 , B01D53/9418 , B01J29/061 , B01J29/072 , B01J37/0238 , B01D2251/208 , B01D2255/2063 , B01D2255/20738 , B01D2255/504
摘要： A volatile metal halide is sublimed over a zeolite, which is then exposed to water, dried and calcined. A promoter may then be incorporated into the zeolite structure by adding the zeolite to a solution of a rare earth salt resulting in a metal exchanged zeolite such as La-Fe/ZSM-5. Contacting exhaust gas with NO.sub.x over the catalyst results in reduction of the NO.sub.x to N.sub.2. The spent catalyst may be regenerated by heating in an oxygen atmosphere.
摘要翻译：挥发性金属卤化物在沸石上升华，然后将其暴露于水中，干燥并煅烧。然后通过将沸石加入到产生金属交换的沸石如La-Fe / ZSM-5的稀土盐溶液中，将促进剂引入沸石结构中。在催化剂上将废气与NOx接触导致NOx还原成N2。废催化剂可以通过在氧气氛中加热来再生。

9. 发明申请

US20120025242A1 SURFACE MOUNTED LED STRUCTURE AND PACKAGING METHOD OF INTEGRATING FUNCTIONAL CIRCUITS ON A SILICON 有权
标题翻译：在硅上集成功能电路的表面安装LED结构和封装方法
公开(公告)号：US20120025242A1
公开(公告)日：2012-02-02
申请号：US13024083
申请日：2011-02-09
申请人： Zhaoming ZENG , Guowei David XIAO , Haiying CHEN , Yugang ZHOU , Yu HOU
发明人： Zhaoming ZENG , Guowei David XIAO , Haiying CHEN , Yugang ZHOU , Yu HOU
IPC分类号： H01L33/58 , H01L33/62
CPC分类号： H01L33/62 , H01L24/73 , H01L33/486 , H01L33/54 , H01L33/64 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention relates to a surface mounted LED structure of integrating functional circuits on a silicon substrate, comprising the silicon substrate and an LED chip. Said silicon substrate has an upper surface of planar structure without grooves. An oxide layer covers the upper surface of the silicon substrate, and metal electrode layers are arranged in the upper surface of the oxide layer. The upper surfaces of said metal electrode layers are arranged with metal bumps, and the LED chip is flip-chip mounted to the silicon substrate. Two conductive metal pads are arranged on the lower surface of said silicon substrate, said conductive metal pads are electrically connected to the metal electrode layers on the upper surface of the silicon substrate by a metal lead arranged on the side wall of the silicon substrate. A heat conduction metal pad is arranged on the corresponding lower, surface of the silicon substrate just below the LED chip. Peripheral functional circuits required by LED are integrated on the upper surface of said silicon substrate. The structure of the present invention has advantages of good heat dissipation effect and small volume, and direct integration of functional circuits such as protection and drive circuits etc. in the silicon substrate achieves large-scale production package of wafer level, reducing the cost of packaging and lighting fixture.
摘要翻译：本发明涉及一种在硅衬底上集成功能电路的表面安装LED结构，包括硅衬底和LED芯片。所述硅衬底具有没有凹槽的平面结构的上表面。氧化物层覆盖硅衬底的上表面，金属电极层设置在氧化物层的上表面。所述金属电极层的上表面配置有金属凸块，将LED芯片倒装安装在硅基板上。在所述硅衬底的下表面上布置两个导电金属焊盘，所述导电金属焊盘通过布置在硅衬底的侧壁上的金属引线电连接到硅衬底的上表面上的金属电极层。在LED芯片正下方的硅衬底的相对的下表面上布置有导热金属焊盘。 LED所需的外围功能电路集成在所述硅衬底的上表面上。本发明的结构具有散热效果好，体积小的优点，硅衬底等保护和驱动电路等功能电路的直接集成实现了晶片级的大规模生产封装，降低了封装成本和照明灯具。

10. 发明申请

US20120025241A1 SURFACE MOUNTED LED PACKAGING STRUCTURE AND METHOD BASED ON A SILICON SUBSTRATE 审中-公开
标题翻译：基于硅衬底的表面安装LED封装结构和方法
公开(公告)号：US20120025241A1
公开(公告)日：2012-02-02
申请号：US13019508
申请日：2011-02-02
申请人： Guowei David XIAO , Zhaoming ZENG , Haiying CHEN , Yugang ZHOU , Yu HOU
发明人： Guowei David XIAO , Zhaoming ZENG , Haiying CHEN , Yugang ZHOU , Yu HOU
IPC分类号： H01L33/58
CPC分类号： H01L33/64 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2924/10253 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A surface mounted LED packaging structure based on a silicon substrate includes the silicon substrate, an LED chip, an annular convex wall and a lens. The silicon substrate has an upper surface of planar structure and without grooves. An oxide layer covers the upper surface of the silicon substrate. Metal electrode layers are arranged in the upper surface of the oxide layer, and the upper surfaces of the metal electrode layers are arranged with metal bumps. Vias through the silicon substrate are provided under the metal electrode layers. An insulating layer covers the inner wall of the vias and a part of the lower surface of the silicon substrate. A metal connection layer covers the insulating layer surface within the vias. Two conductive metal pads are respectively arranged under the lower surface of the silicon substrate and insulated from the silicon substrate. A heat conduction metal pad is arranged on the lower surface of the silicon substrate. The LED chip is flip-chip mounted on the silicon substrate. The annular convex wall and the lens cause the LED chip and the metal electrode layers therein to be isolated from environment. The structure of the present invention has its advantages of good heat dissipation effect and small volume, while packaging without gold wires makes the structure highly reliable and achieves large-scale production of wafer level, resulting in the reduction of the packaging cost.
摘要翻译：基于硅衬底的表面贴装LED封装结构包括硅衬底，LED芯片，环形凸壁和透镜。硅衬底具有平面结构的上表面并且没有凹槽。氧化物层覆盖硅衬底的上表面。金属电极层配置在氧化物层的上表面，金属电极层的上表面配置有金属凸块。通过硅衬底的通孔设置在金属电极层的下方。绝缘层覆盖通孔的内壁和硅衬底的下表面的一部分。金属连接层覆盖通孔内的绝缘层表面。两个导电金属焊盘分别布置在硅衬底的下表面下方并与硅衬底绝缘。在硅衬底的下表面上设置导热金属焊盘。 LED芯片被倒装安装在硅衬底上。环形凸壁和透镜使得LED芯片和其中的金属电极层与环境隔离。本发明的结构具有散热效果好，体积小的优点，而没有金线的包装使结构高度可靠，实现了晶片级的大规模生产，从而降低了封装成本。

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