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1. 发明申请

WO2010147244A3 EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD 审中-公开
标题翻译：曝光装置和装置制造方法
公开(公告)号：WO2010147244A3
公开(公告)日：2011-08-04
申请号：PCT/JP2010060924
申请日：2010-06-21
申请人： NIPPON KOGAKU KK , ICHINOSE GO
发明人： ICHINOSE GO
IPC分类号： G03F7/20
CPC分类号： G03F7/709 , G03F7/70775 , G03F7/70825 , G03F7/7085
摘要： Positional information of each of wafer stages (WST1 and WST2) during exposure and during alignment is measured directly under a projection optical system (PL) and directly under a primary alignment system (AL1), respectively, by a plurality of encoder heads, Z heads and the like, which a measurement bar (71) placed below surface plates (14A and 14B) has, using gratings placed on the lower surfaces of fine movement stages (WFS1 and WFS2). Consequently, high-precision measurement of the positional information of the wafer stages (WST1 and WST2) can be performed.
摘要翻译：在曝光和对准期间每个晶片台（WST1和WST2）的位置信息直接在投影光学系统（PL）下直接在主对准系统（AL1）下由多个编码器头，Z头使用放置在微动台（WFS1和WFS2）的下表面上的光栅，其中放置在表面板（14A和14B）之下的测量棒（71）具有。因此，可以进行晶片台（WST1和WST2）的位置信息的高精度测量。

2. 发明申请

WO2011040642A2 EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD 审中-公开
标题翻译：曝光装置，曝光方法及装置制造方法
公开(公告)号：WO2011040642A2
公开(公告)日：2011-04-07
申请号：PCT/JP2010/067602
申请日：2010-09-30
申请人： NIKON CORPORATION , ICHINOSE, Go
发明人： ICHINOSE, Go
IPC分类号： G03F7/20
CPC分类号： G03F7/70758 , G03F7/70716 , G03F7/70725 , G03F7/70733 , G03F7/70775 , G03F7/70783
摘要： A first driving section (84a, 94a) and a second driving section (84b, 94b) apply a drive force in an X-axis direction, a Y-axis direction, a Z-axis direction, and a θx direction, respectively, with respect to one end and the other end of a fine movement stage (WFS1) whose one end and the other end in the Y-axis direction are each supported, so that the fine movement stage is relatively movable with respect to a coarse movement stage (WCS1) within an XY plane. Accordingly, by the first and the second driving sections making drive forces in directions opposite to each other in a θx direction apply simultaneously to one end and the other end of the fine movement stage (WFS1) (refer to the black arrow in the drawing), the fine movement stage (WFS1) (and a wafer (W) held by the stage) can be deformed to a concave shape or a convex shape within a YZ plane.
摘要翻译：第一驱动部分（84a，94a）和第二驱动部分（84b，94b）沿着X轴方向，Y轴方向，Z轴方向施加驱动力，以及相对于Y轴方向的一端和另一端分别被支承的微动载台（WFS1）的一端和另一端分别具有θx方向，使得微动载台能够相对移动相对于XY平面内的粗略移动阶段（WCS1）。因此，通过第一驱动部和第二驱动部在θx方向上彼此相反方向上的驱动力同时施加到微动载台（WFS1）的一端和另一端（参照图中的黑色箭头），微动载台（WFS1）（以及由载台保持的晶片（W））可以在YZ平面内变形为凹形或凸形。

3. 发明申请

WO2011099646A2 MANUFACTURING METHOD OF EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD 审中-公开
标题翻译：曝光装置的制造方法和装置制造方法
公开(公告)号：WO2011099646A2
公开(公告)日：2011-08-18
申请号：PCT/JP2011/053432
申请日：2011-02-10
申请人： NIKON CORPORATION , ICHINOSE, Go
发明人： ICHINOSE, Go
IPC分类号： G03F7/20
CPC分类号： G03F7/70833 , G03F7/70825 , G03F7/70975 , Y10T29/49895
摘要： A manufacturing method of an exposure apparatus includes adjusting a positioning device that determines a positional relation at the time of docking between a body and a stage module such that a positional relation between an absolute reference surface of a metrology frame of the body and a stage position reference surface of the stage module becomes a desired relation (steps 412 to 418). Accordingly, after that, only by docking the body and the stage module with each other via the positioning device, the positional relation between the absolute reference surface of the body and the stage position reference surface of the stage module becomes a desired relation.
摘要翻译：曝光设备的制造方法包括调节定位装置，该定位装置确定主体和平台模块之间的对接时的位置关系，使得计量学的绝对参考表面主体的框架和舞台模块的舞台位置参考表面成为期望的关系（步骤412至418）。因此，在此之后，仅通过经由定位装置将本体和载物台模块彼此对接，本体的绝对基准表面与载置台模块的载物台位置基准表面之间的位置关系成为期望的关系。 p>

4. 发明申请

WO2011040642A3 EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD 审中-公开
标题翻译：曝光装置，曝光方法和装置制造方法
公开(公告)号：WO2011040642A3
公开(公告)日：2011-06-09
申请号：PCT/JP2010067602
申请日：2010-09-30
申请人： NIPPON KOGAKU KK , ICHINOSE GO
发明人： ICHINOSE GO
IPC分类号： G03F7/20
CPC分类号： G03F7/70758 , G03F7/70716 , G03F7/70725 , G03F7/70733 , G03F7/70775 , G03F7/70783
摘要： A first driving section (84a, 94a) and a second driving section (84b, 94b) apply a drive force in an X-axis direction, a Y-axis direction, a Z-axis direction, and a ?x direction, respectively, with respect to one end and the other end of a fine movement stage (WFS1) whose one end and the other end in the Y-axis direction are each supported, so that the fine movement stage is relatively movable with respect to a coarse movement stage (WCS1) within an XY plane. Accordingly, by the first and the second driving sections making drive forces in directions opposite to each other in a ?x direction apply simultaneously to one end and the other end of the fine movement stage (WFS1) (refer to the black arrow in the drawing), the fine movement stage (WFS1) (and a wafer (W) held by the stage) can be deformed to a concave shape or a convex shape within a YZ plane.
摘要翻译：第一驱动部（84a，94a）和第二驱动部（84b，94b）分别在X轴方向，Y轴方向，Z轴方向和θx方向上施加驱动力，相对于其一端和Y轴方向的另一端各自被支撑的微动载台（WFS1）的一端和另一端，使得微动载台相对于粗移动台相对移动（WCS1）在XY平面内。因此，通过第一驱动部和第二驱动部在θx方向上使彼此相反的驱动力同时施加到微动台（WFS1）的一端和另一端（参照图中的黑色箭头）），微移动台（WFS1）（以及由台架保持的晶片（W））可以在YZ平面内变形为凹形或凸形。

5. 发明申请

WO2011052703A1 EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD 审中-公开
标题翻译：曝光装置和装置制造方法
公开(公告)号：WO2011052703A1
公开(公告)日：2011-05-05
申请号：PCT/JP2010/069239
申请日：2010-10-25
申请人： NIKON CORPORATION , ICHINOSE, Go
发明人： ICHINOSE, Go
IPC分类号： G03F7/20
CPC分类号： G03F7/70991
摘要： An exposure apparatus is equipped with a wafer stage (WST1 (WST2)) which holds a wafer (W) and to which one ends of flat tubes (Ta 1 and Ta 2 (Tb 1 and Tb 2 )) having flexibility that transmit the power usage for exposure between the wafer stage and a predetermined external device are connected and which is movable along an XY plane, and a tube carrier (TCa 1 (TCb 1 )) which is placed on one side of the wafer stage in an X-axis direction, to which the other ends of the flat tubes are connected, and which moves along the XY plane according to movement of the wafer stage and also moves to the other side in the X-axis direction when the wafer stage moves to the one side in the X-axis direction. Accordingly, the wafer stage hardly receives the drag (tensile force) from the flat tubes and outward protrusion of the flat tubes in the X-axis direction can be restrained.
摘要翻译：曝光装置配备有保持晶片（W）的晶片载台（WST1（WST2）），并且具有柔性的扁平管（Ta1和Ta2（Tb1和Tb2））的一端具有将曝光的功率利用率晶片载台和预定的外部装置连接并且可沿XY平面移动;以及管架（TCa1（TCb1）），其放置在晶片载物台的X轴方向的一侧，另一方连接扁平管的端部，并且随着晶片台的移动而沿着XY平面移动，并且当晶片台沿X轴方向移动到一侧时也在X轴方向上移动到另一侧。因此，晶片台几乎不受到来自扁平管的阻力（拉伸力）的影响，并且能够抑制扁平管在X轴方向的向外突出。

6. 发明申请

WO2011040646A2 EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD 审中-公开
标题翻译：曝光装置和装置制造方法
公开(公告)号：WO2011040646A2
公开(公告)日：2011-04-07
申请号：PCT/JP2010/067608
申请日：2010-09-30
申请人： NIKON CORPORATION , ICHINOSE, Go
发明人： ICHINOSE, Go
IPC分类号： G03F7/20
CPC分类号： G03F7/7075 , G03F7/707
摘要： A wafer (W) is loaded on a wafer stage (WST1) and unloaded from the wafer stage (WST1), using a chuck member (102) which holds the wafer (W) from above in a non-contact manner. Accordingly, members and the like to load/unload the wafer (W) on/from the wafer stage (WST1) do not have to be provided, which can keep the stage from increasing in size and weight. Further, by using the chuck member (102) which holds the wafer (W) from above in a non-contact manner, a thin, flexible wafer can be loaded onto the wafer stage (WST1) as well as unloaded from the wafer stage (WST1) without any problems.
摘要翻译：使用从上方保持晶片（W）的夹持构件（102）以不接触的方式将晶片（W）装载在晶片台（WST1）上并从晶片台（WST1）卸载。因此，不需要设置在晶片载台（WST1）上装载/卸载晶片（W）的部件等，能够使台架的尺寸和重量保持不变。此外，通过以不接触的方式使用从上方保持晶片（W）的卡盘构件（102），可以将薄的柔性晶片加载到晶片台（WST1）上并且从晶片台卸载（WST1） WST1）没有任何问题。

7. 发明申请

WO2010147240A2 EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD 审中-公开
标题翻译：曝光装置和装置制造方法
公开(公告)号：WO2010147240A2
公开(公告)日：2010-12-23
申请号：PCT/JP2010/060920
申请日：2010-06-21
申请人： NIKON CORPORATION , ICHINOSE, Go
发明人： ICHINOSE, Go
IPC分类号： G03F7/20
CPC分类号： G03F7/7085 , G03F7/70341 , G03F7/70733 , G03F7/70775
摘要： When a liquid immersion area (liquid (Lq)) formed on a wafer stage (WST1 or WST2) is moved onto another wafer stage (WST2 or WST1), a fine movement stage position measuring system measures positional information of the wafer stage (WST1), interferometers (18YB 2 and 18XB 3 ) of a coarse movement stage position measuring system measure positional information of the another wafer stage (WST2), and interferometers (18YA 2 and 18XA 3 ) measure positional information of the wafer stage (WST1). Based on these measurement results, the wafer stages (WST1 and WST2) are made to be in proximity to each other and are driven while the scrum state is maintained, and thereby the liquid immersion area (liquid (Lq)) formed on the wafer stage (WST1 or WST2) can be moved onto the another wafer stage (WST2 or WST1).
摘要翻译：当形成在晶片载台（WST1或WST2）上的液浸区域（液体（Lq））移动到另一个晶片载台（WST2或WST1）上时，精细移动台位置测量系统测量晶片载台（WST1或WST2）的位置信息，，粗动位置测量系统的干涉仪（18YB2和18XB3）测量另一个晶片台（WST2）的位置信息，以及干涉仪（18YA2和18XA3）测量晶片台（WST1）的位置信息。基于这些测量结果，使晶片台（WST1和WST2）彼此靠近，并且在保持Scrum状态的同时被驱动，从而形成在晶片台上的液浸区域（液体（Lq））（WST1或WST2）可以移动到另一个晶片台（WST2或WST1）上。

8. 发明申请

WO2011040646A3 EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD 审中-公开
标题翻译：曝光装置和装置制造方法
公开(公告)号：WO2011040646A3
公开(公告)日：2011-05-26
申请号：PCT/JP2010067608
申请日：2010-09-30
申请人： NIPPON KOGAKU KK , ICHINOSE GO
发明人： ICHINOSE GO
IPC分类号： G03F7/20 , H01L21/683
CPC分类号： G03F7/7075 , G03F7/707
摘要： A wafer (W) is loaded on a wafer stage (WST1) and unloaded from the wafer stage (WST1), using a chuck member (102) which holds the wafer (W) from above in a non-contact manner. Accordingly, members and the like to load/unload the wafer (W) on/from the wafer stage (WST1) do not have to be provided, which can keep the stage from increasing in size and weight. Further, by using the chuck member (102) which holds the wafer (W) from above in a non-contact manner, a thin, flexible wafer can be loaded onto the wafer stage (WST1) as well as unloaded from the wafer stage (WST1) without any problems.
摘要翻译：使用从上方以非接触方式保持晶片（W）的卡盘部件（102），将晶片（W）装载在晶片台（WST1）上并从晶片台（WST1）卸载。因此，不需要提供用于将晶片（W）装载到晶片台（WST1）上/从晶片台（WST1）卸载晶片（WST）的构件等，这可以防止台增加尺寸和重量。此外，通过使用以非接触方式从上方保持晶片（W）的夹盘构件（102），可以将薄且柔性的晶片装载到晶片台（WST1）上并且从晶片台卸载（ WST1）没有任何问题。

9. 发明申请

WO2010147245A2 EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD 审中-公开
标题翻译：曝光装置和装置制造方法
公开(公告)号：WO2010147245A2
公开(公告)日：2010-12-23
申请号：PCT/JP2010/060925
申请日：2010-06-21
申请人： NIKON CORPORATION , ICHINOSE, Go
发明人： ICHINOSE, Go
IPC分类号： G03F7/20
CPC分类号： G03F7/7085 , G03F7/70341 , G03F7/70725 , G03F7/70733 , G03F7/70775 , G03F7/70825
摘要： At a measurement bar (71) on which a first measurement head group (72) that measures positional information of a fine movement stage (WFS1) that holds a wafer (W) is arranged, various types of measurement instruments, e.g. an aerial image measuring instrument (160) and the like, used in measurement related exposure such as the optical properties of a projection optical system (PL) are arranged. The measurement is performed using the various types of measurement instruments and the exposure conditions such as the optical properties of the projection optical system (PL) are adjusted based on the result of the measurement, as needed, and thereby the exposure processing can appropriately be performed on the wafer.
摘要翻译：在其上配置有测量保持晶片（W）的微动载台（WFS1）的位置信息的第一测量头组（72））的测量棒（71），各种测量仪器布置了诸如投影光学系统（PL）的光学特性的测量相关曝光中使用的空间图像测量仪器（160）等。使用各种测量仪器进行测量，并且根据需要根据测量结果调整投影光学系统（PL）的光学特性等曝光条件，从而适当地进行曝光处理在晶圆上。

10. 发明申请

WO2010147244A2 EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD 审中-公开
标题翻译：曝光装置和装置制造方法
公开(公告)号：WO2010147244A2
公开(公告)日：2010-12-23
申请号：PCT/JP2010/060924
申请日：2010-06-21
申请人： NIKON CORPORATION , ICHINOSE, Go
发明人： ICHINOSE, Go
IPC分类号： G03F7/20
CPC分类号： G03F7/709 , G03F7/70775 , G03F7/70825 , G03F7/7085
摘要： Positional information of each of wafer stages (WST1 and WST2) during exposure and during alignment is measured directly under a projection optical system (PL) and directly under a primary alignment system (AL1), respectively, by a plurality of encoder heads, Z heads and the like, which a measurement bar (71) placed below surface plates (14A and 14B) has, using gratings placed on the lower surfaces of fine movement stages (WFS1 and WFS2). Consequently, high-precision measurement of the positional information of the wafer stages (WST1 and WST2) can be performed.
摘要翻译：在曝光和对准期间每个晶片台（WST1和WST2）的位置信息直接在投影光学系统（PL）下直接在主对准系统（AL1）下由多个编码器头，Z头使用放置在微动台（WFS1和WFS2）的下表面上的光栅，其中放置在表面板（14A和14B）之下的测量棒（71）具有。因此，可以进行晶片台（WST1和WST2）的位置信息的高精度测量。

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