专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06295683B1 Equipment for brushing the underside of a semiconductor wafer 失效
标题翻译：用于刷涂半导体晶片下侧的设备
公开(公告)号：US06295683B1
公开(公告)日：2001-10-02
申请号：US09457308
申请日：1999-12-09
申请人： Kuei-Si Lai , Shih-Hsun Chiou , Kuo-Feng Huang , Ching-Chih Cheng
发明人： Kuei-Si Lai , Shih-Hsun Chiou , Kuo-Feng Huang , Ching-Chih Cheng
IPC分类号： B08B104
CPC分类号： B08B1/04 , B08B3/02
摘要： The present invention provides equipment for brushing the underside of a semiconductorwafer that is placed on a rotary wafer chuck. The equipment comprises a brush rod, a brush with a channel in it mounted at an end point of the brush rod, a nozzle for spraying water on the underside of the semiconductor wafer, and a driving device connected to the brush rod for driving the brush rod in a reciprocating motion. The wafer chuck rotates the semiconductor wafer and, simultaneously, water drives the blade and the brush to raise and rotate so as to spray water over the underside of the semiconductor wafer. The driving device drives the brush to brush the underside of the semiconductor wafer along a radial direction of the semiconductor wafer.
摘要翻译：本发明提供了用于刷涂放置在旋转晶片卡盘上的半导体晶片的下侧的设备。该设备包括一个刷杆，一个刷子，其中安装在刷杆端部的通道，用于在半导体晶片的下侧喷水的喷嘴，以及连接到刷杆的驱动装置，用于驱动刷子杆往复运动。晶片卡盘旋转半导体晶片，同时，水驱动叶片和刷子以升高和旋转，以便在半导体晶片的下侧喷射水。驱动装置驱动刷子沿着半导体晶片的径向刷刷半导体晶片的下侧。

IPRDB

热门服务

关于我们

友情链接

联系方式