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    • 4. 发明申请
    • SENSOR DEVICE
    • 传感器设备
    • US20140167781A1
    • 2014-06-19
    • US14235933
    • 2011-08-03
    • Satoshi AsanoMasahiro MatsumotoHIroshi NakanoKeiji Hanzawa
    • Satoshi AsanoMasahiro MatsumotoHIroshi NakanoKeiji Hanzawa
    • G01R1/18G01D7/00
    • G01R1/18B81B3/0086G01D7/00
    • An objective of the present invention is to provide a sensor device with an increased accuracy. In order to achieve the objective, provided is a sensor device includes: an external terminal 2 to which an external device is connected; a ground terminal 3 connected to the ground; an internal circuit 4 that generates a sensor output signal; and a protection circuit 5 having a resistive element 6 and a capacitative element 7 between the external terminal and the internal circuit, in which the capacitative element is formed of a pair of electrodes having different conductivities from each other and a lower-conductive electrode 7a of the electrodes which has a smaller conductivity is connected to the external terminal and the internal circuit.
    • 本发明的目的是提供一种具有更高精度的传感器装置。 为了实现该目的,提供了一种传感器装置,包括:连接有外部装置的外部端子2; 连接到地面的接地端子3; 产生传感器输出信号的内部电路4; 以及保护电路5,其在外部端子和内部电路之间具有电阻元件6和电容元件7,其中电容元件由彼此具有不同电导率的一对电极形成,并且电容元件7的下导电电极7a 具有较小导电性的电极连接到外部端子和内部电路。
    • 5. 发明申请
    • Thermal Flow Meter
    • 热流量计
    • US20130199280A1
    • 2013-08-08
    • US13813094
    • 2011-07-28
    • Hiroshi NakanoMasahiro MatsumotoSatoshi AsanoKeiji Hanzawa
    • Hiroshi NakanoMasahiro MatsumotoSatoshi AsanoKeiji Hanzawa
    • G01F1/692
    • G01F1/692G01F1/6842G01F1/699
    • An object of the present invention is to provide a thermal type flow rate sensor that offers high sensitivity and improved reliability. A sensor element according to the present invention includes a semiconductor substrate, a cavity portion formed on the semiconductor substrate, a heating resistor formed on the cavity portion via an electrically insulating film, a heating temperature sensor for detecting heating temperature of the heating resistor, and a driving circuit for controlling the heating temperature of the heating resistor using the temperature detected by the heating temperature sensor. The heating temperature sensor comprises temperature-sensitive resistors having resistance values varying according to temperature and disposed upstream and downstream of a direction of flow of a fluid to be measured relative to the heating resistor and on upper and lower sides in a direction perpendicular to the direction of flow of the fluid to be measured relative to the heating resistor.
    • 本发明的目的是提供一种提供高灵敏度和改善的可靠性的热式流量传感器。 根据本发明的传感器元件包括半导体衬底,形成在半导体衬底上的空腔部分,通过电绝缘膜形成在空腔部分上的发热电阻器,用于检测加热电阻器的加热温度的加热温度传感器,以及 使用由加热温度传感器检测到的温度来控制加热电阻器的加热温度的驱动电路。 加热温度传感器包括具有根据温度变化的电阻值的温度敏感电阻器,并且设置在相对于加热电阻器的被测量流体的流动方向的上游和下游以及垂直于该方向的方向上下侧 要测量的流体相对于加热电阻器的流动。
    • 7. 发明授权
    • Thermal humidity sensor
    • 热湿度传感器
    • US08359919B2
    • 2013-01-29
    • US12855347
    • 2010-08-12
    • Masahiro MatsumotoHiroshi NakanoKeiji HanzawaMasamichi Yamada
    • Masahiro MatsumotoHiroshi NakanoKeiji HanzawaMasamichi Yamada
    • G01N27/12G01N27/18G01F1/69
    • G01N27/18
    • Provided is a high-precision, mechanically robust thermal humidity sensor. A detecting element 1 of the thermal humidity sensor of the present invention has a diaphragm (a bridge structure) 2 formed on a planar substrate which is formed from a material with high thermal conductivity such as silicon or ceramic. Formed on the diaphragm 2 are temperature detecting resistors 4, 5, 6, and 7 and a heating resistor 3 arranged in a manner surrounding the temperature detecting resistors. Humidity is detected based on the outputs of the temperature detecting resistors 4, 5, 6, and 7. Accordingly, humidity measurement errors that can possibly occur due to the leakage of heat through the diaphragm 2 to the planar substrate can be reduced.
    • 提供了一种高精度,机械坚固的热湿度传感器。 本发明的热湿度传感器的检测元件1具有形成在由诸如硅或陶瓷等导热性高的材料形成的平面基板上的隔膜(桥结构)2。 形成在隔膜2上的是温度检测电阻4,5,6和7以及围绕温度检测电阻器布置的加热电阻3。 基于温度检测电阻4,5,6和7的输出检测湿度。因此,可以减少由于通过隔膜2的热量泄漏到平面基板而可能发生的湿度测量误差。
    • 10. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US08232650B2
    • 2012-07-31
    • US13180202
    • 2011-07-11
    • Hiroyuki ChibaharaAtsushi IshiiNaoki IzumiMasahiro Matsumoto
    • Hiroyuki ChibaharaAtsushi IshiiNaoki IzumiMasahiro Matsumoto
    • H01L23/48
    • H01L23/02H01L23/522H01L23/585H01L2924/0002H01L2924/00
    • A semiconductor device wherein destruction of a sealing ring caused by cracking of an interlayer dielectric film is difficult to occur, as well as a method for manufacturing the semiconductor device, are provided. A first laminate comprises first interlayer dielectric films having a first mechanical strength. A second laminate comprises second interlayer dielectric films having a mechanical strength higher than the first mechanical strength. A first region includes first metallic layers and vias provided within the first laminate. A second region includes second metallic layers and vias provided within the second laminate. When seen in plan, the second region overlaps at least a part of the first region, is not coupled with the first region by vias, and sandwiches the second interlayer dielectric film between it and the first region.
    • 提供了难以发生由层间电介质膜的破裂引起的密封环破坏的半导体装置,以及半导体装置的制造方法。 第一层压板包括具有第一机械强度的第一层间绝缘膜。 第二层压体包括具有高于第一机械强度的机械强度的第二层间介电膜。 第一区域包括设置在第一层压体内的第一金属层和通孔。 第二区域包括设置在第二层压体内的第二金属层和通孔。 当在平面图中看到时,第二区域与第一区域的至少一部分重叠,不通过通孔与第一区域耦合,并且在其与第一区域之间夹住第二层间电介质膜。