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    • 7. 发明授权
    • Substrate impedance measurement
    • 基板阻抗测量
    • US06717423B1
    • 2004-04-06
    • US10267814
    • 2002-10-09
    • Aritharan ThurairajaratnamMohan R. Nagar
    • Aritharan ThurairajaratnamMohan R. Nagar
    • G01R3102
    • G01R31/2805G01R1/07314G01R27/04
    • A probe structure with a connector connecting the probe structure to a time domain reflectometry tester, where the connector has a signal conductor and a ground conductor. A back side layer is connected to the connector. A probe side layer with contacts is sandwiched with the back side layer in a layered substrate. The probe side layer has a centrally disposed signal contact and surrounding ground contacts. A conductive layer is disposed between the back side layer and the probe side layer. The conductive layer is connected to the ground conductor of the connector and to the ground contacts of the probe side layer contacts. A via extends from the back side layer to the probe side layer. The via is connected to the signal conductor of the connector, and is also connected to the centrally disposed signal contact of the probe side layer contacts. The via does not make connection with the conductive layer. A first of pins is connected to the signal contact, for making a connection with a structure to be tested on the package substrate. Others of the pins are connected to the ground contacts, for making connections with structures on the package substrate that surround the structure to be tested.
    • 探针结构,其具有将探针结构连接到时域反射测试仪的连接器,其中连接器具有信号导体和接地导体。 背面层连接到连接器。 具有触点的探针侧层与层叠基板中的背面层夹持。 探头侧层具有中心设置的信号触点和周围的接地触点。 导电层设置在背侧层和探针侧层之间。 导电层连接到连接器的接地导体和探头侧层触点的接地触头。 通孔从背侧层延伸到探针侧层。 通孔连接到连接器的信号导体,并且还连接到探头侧层触点的中心布置的信号触点。 通孔不与导电层连接。 第一个引脚连接到信号触点,用于与封装衬底上要测试的结构进行连接。 其他引脚连接到接地触点,用于与围绕待测结构的封装基板上的结构进行连接。
    • 10. 发明授权
    • Substrate impedance measurement
    • 基板阻抗测量
    • US06891392B2
    • 2005-05-10
    • US10371386
    • 2003-02-21
    • Mohan R. NagarAritharan Thurairajaratnam
    • Mohan R. NagarAritharan Thurairajaratnam
    • G01R1/073G01R31/26H01H31/02
    • G01R1/07314
    • A probe structure for testing impedance of a package substrate using time domain reflectometry. A connector electrically connects the probe structure to a time domain reflectometry tester, where the connector has a signal conductor and a ground conductor. An electrically conductive cantilever signal pin is electrically connected to the signal conductor. The electrically conductive cantilever signal pin has a tip for making an electrical connection with an electrically conductive structure to be tested on the package substrate. The electrically conductive cantilever signal pin is electrically isolated by and sheathed within a ground shield that is electrically connected to at least one of the ground conductor and electrically conductive cantilever ground pins. The electrically conductive cantilever ground pins are electrically connected to the ground conductor. The electrically conductive cantilever ground pins also have tips, for making electrical connections with electrically conductive structures on the package substrate that surround the electrically conductive structure to be tested on the package substrate.
    • 用于使用时域反射测试来测试封装衬底的阻抗的探针结构。 连接器将探针结构电连接到时域反射测试仪,其中连接器具有信号导体和接地导体。 导电悬臂信号引脚电连接到信号导体。 导电悬臂信号销具有用于与要在导体上进行测试的导电结构进行电连接的尖端。 导电悬臂信号引脚在接地屏蔽内电隔离并被电连接到接地导体和导电悬臂接地引脚中的至少一个。 导电悬臂接地引脚电连接到接地导体。 导电悬臂接地引脚还具有尖端,用于与围绕要在封装衬底上测试的导电结构的封装衬底上的导电结构进行电连接。