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    • 2. 发明授权
    • Three dimensional multilayer circuit
    • 三维多层电路
    • US09324718B2
    • 2016-04-26
    • US13260019
    • 2010-01-29
    • Wei WuR. Stanley Williams
    • Wei WuR. Stanley Williams
    • H01L25/00H03K19/177H01L21/46H01L21/4763H01L27/10H01L27/02H01L27/06H01L27/24
    • H01L27/101H01L27/0207H01L27/0688H01L27/24
    • A three dimensional multilayer circuit (600) includes a plurality of crossbar arrays (512) made up of intersecting crossbar segments (410, 420) and programmable crosspoint devices (514) interposed between the intersecting crossbar segments (410, 420). Shift pins (505, 510) are used to shift connection domains (430) of the intersecting crossbar segments (410, 420) between stacked crossbar arrays (512) such that the programmable crosspoint devices (514) are uniquely addressed. The shift pins (505, 510) make electrical connections between crossbar arrays (512) by passing vertically between crossbar segments (410, 510) in the first crossbar array (512) and crossbar segments in a second crossbar array. A method for transforming multilayer circuits is also described.
    • 三维多层电路(600)包括由相交的横杆段(410,420)和插入在相交的横杆段(410,420)之间的可编程交叉点装置(514)组成的多个横杆阵列(512)。 移位销(505,510)用于使堆叠的横杆阵列(512)之间的交叉横截面段(410,420)的连接区域(430)移位,使得可编程交叉点设备(514)被唯一地寻址。 换档销(505,510)通过在第一交叉杆阵列(512)中的横杆段(410,510)和第二横杆阵列中的横杆段之间垂直地穿过横杆阵列(512)之间进行电连接。 还描述了用于转换多层电路的方法。
    • 5. 发明授权
    • Hierarchical on-chip memory
    • 分层片上存储器
    • US08885422B2
    • 2014-11-11
    • US13256242
    • 2009-06-12
    • Gilberto Medeiros RibeiroR. Stanley WilliamsMatthew D. Pickett
    • Gilberto Medeiros RibeiroR. Stanley WilliamsMatthew D. Pickett
    • G11C7/00G11C5/06G11C5/02
    • G11C5/02G11C5/063G11C2213/71
    • A hierarchical on-chip memory (400) includes an area distributed CMOS layer (310) comprising input/output functionality and volatile memory and via array (325, 330), the area distributed CMOS layer (310) configured to selectively address the via array (325, 330). A crossbar memory (305) overlies the area distributed CMOS layer (310) and includes programmable crosspoint devices (315) which are uniquely accessed through the via array (325, 330). A method for utilizing hierarchical on-chip memory (400) includes storing frequently rewritten data in a volatile memory and storing data which is not frequently rewritten in a non-volatile memory (305), where the volatile memory is contained within an area distributed CMOS layer (310) and the non-volatile memory (305) is formed over and accessed through the area distributed CMOS layer (310).
    • 分层片上存储器(400)包括包括输入/​​输出功能的区域分布式CMOS层(310)和易失性存储器和通孔阵列(325,330),所述区域分布式CMOS层(310)被配置为选择性地寻址通孔阵列 (325,330)。 交叉开关存储器(305)覆盖区域分布式CMOS层(310),并且包括通过通孔阵列(325,330)唯一访问的可编程交叉点设备(315)。 一种用于利用分层片上存储器(400)的方法包括:将经常重写的数据存储在易失性存储器中,并将非频繁重写的数据存储在非易失性存储器(305)中,其中易失性存储器包含在区域分布式CMOS 层(310)和非易失性存储器(305)形成在区域分布式CMOS层(310)上并通过区域分布式CMOS层(310)访问。
    • 8. 发明授权
    • Memcapacitor
    • 电容器
    • US08750024B2
    • 2014-06-10
    • US13256245
    • 2009-06-18
    • Alexandre M. BratkovskiR. Stanley Williams
    • Alexandre M. BratkovskiR. Stanley Williams
    • G11C11/24
    • G11C11/24G11C13/0002H01G4/1272H01G4/255H01G4/33H01L27/101H01L28/40
    • A memcapacitor device (100) includes a first electrode (104) and a second electrode (106) and a memcapacitive matrix (102) interposed between the first electrode (104) and the second electrode (106). Mobile dopants (111) are contained within the memcapacitive matrix (102) and are repositioned within the memcapacitive matrix (102) by the application of a programming voltage (126) across the first electrode (104) and second electrode (106) to alter the capacitance of the memcapacitor (100). A method for utilizing a memcapacitive device (100) includes applying a programming voltage (126) across a memcapacitive matrix (102) such that mobile ions (111) contained within a memcapacitive matrix (102) are redistributed and alter a capacitance of the memcapacitive device (100), then removing the programming voltage (126) and applying a reading voltage to sense the capacitance of the memcapacitive device (100).
    • 电容器装置(100)包括插入在第一电极(104)和第二电极(106)之间的第一电极(104)和第二电极(106)和存储电容矩阵(102)。 移动掺杂剂(111)被包含在存储器电容矩阵(102)内,并且通过跨越第一电极(104)和第二电极(106)施加编程电压(126)而重新定位在存储电容矩阵(102)内,以改变 电容器(100)的电容。 一种利用存储电容器件(100)的方法包括跨越存储电容矩阵(102)施加编程电压(126),使得包含在存储电容矩阵(102)内的移动离子(111)被重新分配并改变存储器件的电容 (100),然后去除所述编程电压(126)并施加读取电压以感测所述存储器件(100)的电容。