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    • 4. 发明专利
    • Vertical type light emitting diode and its manufacture
    • 垂直型发光二极管及其制造
    • JP2007081360A
    • 2007-03-29
    • JP2006000118
    • 2006-01-04
    • Shi-Ming ChenEpitech Technology Corpエピテック テクノロジー コーポレーションシーミン チェン
    • CHEN SHI-MING
    • H01L33/32
    • H01L33/0079
    • PROBLEM TO BE SOLVED: To provide a vertical type light emitting diode at a reduced cost by reinforcing an operation reliability of a device and improving a production yield, and a method for manufacturing it. SOLUTION: This method comprises following steps. A sapphire substrate 200 is prepared. A light emitting epitaxial structure 202 is formed on the sapphire substrate 200. Then a first conductive type electrode 204 is formed on the surface of the light emitting epitaxial structure 202. Then, a local removing step is performed to remove a part of the sapphire substrate from the surface of the light emitting epitaxial structure 202 so that a part of the surface is exposed. Then a second conductive type electrode 210 is formed on the exposed part of the surface of the light emitting epitaxial structure 202. The conductive type of the first conductive type electrode 204 is opposite to that of the second conductive type electrode 210. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:通过增强装置的操作可靠性和提高生产成本,以降低的成本提供垂直型发光二极管及其制造方法。

      解决方案:该方法包括以下步骤。 制备蓝宝石衬底200。 在蓝宝石衬底200上形成发光外延结构202.然后在发光外延结构202的表面上形成第一导电型电极204.然后,执行局部去除步骤以去除蓝宝石衬底的一部分 从发光外延结构202的表面,使得表面的一部分露出。 然后在发光外延结构202的表面的暴露部分上形成第二导电型电极210.第一导电类型电极204的导电类型与第二导电类型电极210的导电类型相反。 (C)2007,JPO&INPIT

    • 7. 再颁专利
    • Fabrication method of transparent electrode on visible light-emitting diode
    • 可见光发光二极管上透明电极的制作方法
    • USRE43426E1
    • 2012-05-29
    • US13152124
    • 2011-06-02
    • Tse-Liang YingShi-Ming Chen
    • Tse-Liang YingShi-Ming Chen
    • H01L21/00
    • H01L33/42Y10S438/956
    • A method for forming a transparent electrode on a visible light-emitting diode is described. A visible light-emitting diode element is provided, and the visible light-emitting diode element has a substrate, an epitaxial structure and a metal electrode. The metal electrode and the epitaxial structure are located on the same side of the substrate, or located respectively on the different sides of the substrate. An ohmic metal layer is formed on a surface of the epitaxial structure. The ohmic metal layer is annealed. The ohmic metal layer is removed to expose the surface of the epitaxial structure. A transparent electrode layer is formed on the exposed surface. A metal pad is formed on the transparent electrode layer.
    • 描述了在可见光发光二极管上形成透明电极的方法。 提供了可见光发光二极管元件,可见光发光二极管元件具有基板,外延结构和金属电极。 金属电极和外延结构位于基板的同一侧,或分别位于基板的不同侧。 在外延结构的表面上形成欧姆金属层。 欧姆金属层退火。 去除欧姆金属层以露出外延结构的表面。 在露出的表面上形成透明电极层。 在透明电极层上形成金属焊盘。
    • 10. 发明申请
    • Fabrication Method of Transparent Electrode on Visible Light-Emitting Diode
    • 透明电极在可见光发光二极管上的制作方法
    • US20070148798A1
    • 2007-06-28
    • US11684540
    • 2007-03-09
    • Tse-Liang YINGShi-Ming Chen
    • Tse-Liang YINGShi-Ming Chen
    • H01L21/00
    • H01L33/42Y10S438/956
    • A method for forming a transparent electrode on a visible light-emitting diode is described. A visible light-emitting diode element is provided, and the visible light-emitting diode element has a substrate, an epitaxial structure and a metal electrode. The metal electrode and the epitaxial structure are located on the same side of the substrate, or located respectively on the different sides of the substrate. An ohmic metal layer is formed on a surface of the epitaxial structure. The ohmic metal layer is annealed. The ohmic metal layer is removed to expose the surface of the epitaxial structure. A transparent electrode layer is formed on the exposed surface. A metal pad is formed on the transparent electrode layer.
    • 描述了在可见光发光二极管上形成透明电极的方法。 提供了可见光发光二极管元件,可见光发光二极管元件具有基板,外延结构和金属电极。 金属电极和外延结构位于基板的同一侧,或分别位于基板的不同侧。 在外延结构的表面上形成欧姆金属层。 欧姆金属层退火。 去除欧姆金属层以露出外延结构的表面。 在露出的表面上形成透明电极层。 在透明电极层上形成金属焊盘。