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    • 3. 发明授权
    • Process for adhesion using an epoxy resin adhesive composition
    • 使用环氧树脂粘合剂组合物的粘合方法
    • US5637179A
    • 1997-06-10
    • US534934
    • 1995-09-28
    • Akira NakayamaToshio Nagase
    • Akira NakayamaToshio Nagase
    • C08L63/00C08G59/18C09J151/04C09J163/00C09J163/02C09J163/04
    • C09J163/00C08G59/18C09J151/04
    • A process for adhesion using an epoxy rein adhesive composition which comprises coating surfaces for adhesion with a two component epoxy resin adhesive composition prepared immediately before the coating by mixing a mixture containing (A) resin powder prepared by ionic crosslinking of resin particles by addition of a metal cation and (B) an epoxy resin with (C) a curing agent of a room temperature curing type for epoxy resins, bringing the coated surfaces for adhesion into contact with each other, and subsequently heating the surfaces for adhesion. The resin particle is constituted with (a) a core formed with a (meth)acrylate polymer and/or a diene polymer which has a glass transition temperature of -30.degree. C. or lower and (b) a shell formed with a copolymer of a (meth)acrylate monomer and a radical polymerizable unsaturated carboxylic acid monomer having carboxyl group and 3 to 8 carbon atoms which has a glass transition temperature of 70.degree. C. or higher. The adhesive composition used in the process can be cured by heating at a moderate temperature of 40.degree. to 100.degree. C., and a high tensile shear strength and T-peeling strength can be achieved.
    • 一种使用环氧树脂粘合剂组合物的粘合方法,其包括通过混合包含(A)通过添加树脂颗粒的离子交联制备的树脂粉末的混合物将涂料表面粘附到紧接在涂布前制备的双组分环氧树脂粘合剂组合物 金属阳离子和(B)环氧树脂,(C)环氧树脂的室温固化型固化剂,使被粘接的表面彼此接触,然后加热表面进行粘合。 树脂颗粒由(a)由(甲基)丙烯酸酯聚合物和/或二烯聚合物形成的芯构成,其具有-30℃或更低的玻璃化转变温度,和(b)由共聚物形成的壳, (甲基)丙烯酸酯单体和玻璃化转变温度为70℃以上的羧基和碳原子数为3〜8的自由基聚合性不饱和羧酸单体。 该方法中使用的粘合剂组合物可以通过在40℃至100℃的中等温度下加热而固化,并且可以实现高拉伸剪切强度和T剥离强度。