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1. 发明申请

WO2012142126A2 METHOD OF MAKING RADIATION-SENSITIVE SOL-GEL MATERIALS 审中-公开
标题翻译：制造辐射敏感性溶胶凝胶材料的方法
公开(公告)号：WO2012142126A2
公开(公告)日：2012-10-18
申请号：PCT/US2012/033073
申请日：2012-04-11
申请人： BREWER SCIENCE INC. , LIN, Qin , WANG, Yubao , FLAIM, Tony D.
发明人： LIN, Qin , WANG, Yubao , FLAIM, Tony D.
IPC分类号： H01L21/027
CPC分类号： G03F7/075 , G03F7/0045 , G03F7/038 , G03F7/0757 , G03F7/11 , G03F7/20
摘要： Radiation-sensitive sol-gel compositions are provided, along with methods of forming microelectronic structures and the structures thus formed. The compositions comprise a sol-gel compound and a base generator dispersed or dissolved in a solvent system. The sol-gel compound comprises recurring monomeric units comprising silicon with crosslinkable moieties bonded to the silicon. Upon exposure to radiation, the base generator generates a strong base, which crosslinks the sol-gel compound in the compositions to yield a crosslinked layer that is insoluble in developers or solvents. The unexposed portions of the layer can be removed to yield a patterned sol-gel layer. The invention can be used to form patterns from sol-gel materials comprising features having feature sizes of less than about 1 m.
摘要翻译：提供了辐射敏感的溶胶 - 凝胶组合物，以及形成微电子结构和如此形成的结构的方法。组合物包含分散或溶解在溶剂体系中的溶胶 - 凝胶化合物和碱产生剂。溶胶 - 凝胶化合物包括具有与硅结合的可交联部分的包含硅的重复单体单元。暴露于辐射后，基底发生器产生强碱，其使组合物中的溶胶 - 凝胶化合物交联，得到不溶于显影剂或溶剂的交联层。可以除去该层的未曝光部分以产生图案化的溶胶 - 凝胶层。本发明可以用于形成包含特征尺寸小于约1μm的特征的溶胶 - 凝胶材料的图案。

2. 发明申请

WO2013006865A3 METHODS OF TRANSFERRING DEVICE WAFERS OR LAYERS BETWEEN CARRIER SUBSTRATES AND OTHER SURFACES 审中-公开
公开(公告)号：WO2013006865A3
公开(公告)日：2013-01-10
申请号：PCT/US2012/045980
申请日：2012-07-09
申请人： BREWER SCIENCE INC. , MCCUTCHEON, Jeremy , FLAIM, Tony D. , BAILEY, Susan
发明人： MCCUTCHEON, Jeremy , FLAIM, Tony D. , BAILEY, Susan
IPC分类号： H01L21/301 , H01L21/02
摘要： New temporary bonding methods and articles formed from those methods are provided. In one embodiment, the methods comprise coating a device or other ultrathin layer on a growth substrate with a rigid support layer and then bonding that stack to a carrier substrate. The growth substrate can then be removed and the ultrathin layer mounted on a final support. In another embodiment, the invention provides methods of handling device layers during processing that must occur on both sides of the fragile layer without damaging it. This is accomplished via the sequential use of two carriers, one on each side of the device layer, bonded with different bonding compositions for selective debonding.

3. 发明申请

WO2021026035A1 PERMANENT BONDING AND PATTERNING MATERIAL 审中-公开
公开(公告)号：WO2021026035A1
公开(公告)日：2021-02-11
申请号：PCT/US2020/044634
申请日：2020-07-31
申请人： BREWER SCIENCE, INC.
发明人： SEJOUBSARI, Reihaneh , FLAIM, Tony D. , LIU, Xiao
IPC分类号： C09J201/08 , C09J11/00 , C08K5/12 , C08K5/00 , B32B7/12
摘要： Methods are disclosed to prepare permanent materials that can be coated onto microelectronic substrates or used for other structural or optical applications. The materials are thermally stable to at least about 300°C, curable using a photo or thermal process, exhibit good chemical resistance (including during metal passivation), and have a lifespan of at least about 5 years, preferably at least about 10 years, in the final device. Advantageously, these materials can also be bonded at room temperature. The materials exhibit no movement or squeeze-out after bonding and adhere to a variety of substrate types.

4. 发明申请

WO2016014648A2 POLYIMIDES AS LASER RELEASE MATERIALS FOR 3-D IC APPLICATIONS 审中-公开
标题翻译： POLYIMIDES作为3-D IC应用的激光释放材料
公开(公告)号：WO2016014648A2
公开(公告)日：2016-01-28
申请号：PCT/US2015/041505
申请日：2015-07-22
申请人： BREWER SCIENCE INC.
发明人： LIU, Xiao , BAI, Dongshun , FLAIM, Tony D. , ZHONG, Xing-Fu , WU, Qi
CPC分类号： B32B7/06 , B05D3/007 , B32B27/06 , B32B37/14 , B32B2255/26 , B32B2307/412 , B32B2405/00 , B32B2457/00 , C08G73/1014 , C08G73/1039 , C08G73/1067 , C09D179/08 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10S156/93 , Y10S156/941 , Y10T156/1158 , Y10T156/1917
摘要： The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250°C to about 350°C for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.
摘要翻译：本发明广泛涉及在微电子制造期间能够实现薄晶片处理的释放层组合物。优选的剥离层由包含溶解或分散在溶剂体系中的聚酰胺酸或聚酰亚胺的组合物形成，然后在约250℃至约350℃下固化和/或除去溶剂少于约10分钟，产生薄膜。该方法将释放组合物形成为可用于临时粘合工艺的聚酰亚胺剥离层，并且在进行所需的加工之后进行激光剥离。

5. 发明申请

WO2018013976A1 LASER ABLATIVE DIELECTRIC MATERIAL 审中-公开
标题翻译：激光消融介电材料
公开(公告)号：WO2018013976A1
公开(公告)日：2018-01-18
申请号：PCT/US2017/042225
申请日：2017-07-14
申请人： BREWER SCIENCE INC.
发明人： MATOS-PEREZ, Cristina R. , FLAIM, Tony D. , SOUTHARD, Arthur O. , KIRCHNER, Lisa M. , BLUMENSHINE, Deborah
IPC分类号： H01L21/02 , H01L21/768 , H01L21/324
摘要： Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the group consisting of polyureas, polyurethane, and polyacylhydrazones. New methods to prepare suitable polyacylhydrazones are also provided. Those methods involve mild conditions and result in a soluble polymer that is stable at room temperature and can be incorporated into formulations that can be coated onto microelectronic substrates. The dielectric materials exhibit high elongation, low CTE, low cure temperature, and leave little to no debris post-ablation.
摘要翻译：提出了用于激光烧蚀图案化的具有最佳机械性能的电介质材料。这些材料包括选自聚脲，聚氨酯和聚酰腙的聚合物。还提供了制备合适的聚酰腙的新方法。这些方法涉及温和条件并产生在室温下稳定的可溶性聚合物，并且可以掺入可涂布到微电子基材上的制剂中。介电材料表现出高伸长率，低CTE，低固化温度以及消融后很少或没有残余物。

6. 发明公开

EP3172762A2 POLYIMIDES AS LASER RELEASE MATERIALS FOR 3-D IC APPLICATIONS 审中-公开
标题翻译：聚酰亚胺作为三维IC应用的激光释放材料
公开(公告)号：EP3172762A2
公开(公告)日：2017-05-31
申请号：EP15824894.8
申请日：2015-07-22
申请人： Brewer Science, Inc.
发明人： LIU, Xiao , BAI, Dongshun , FLAIM, Tony D. , ZHONG, Xing-Fu , WU, Qi
IPC分类号： H01L21/58
CPC分类号： B32B7/06 , B05D3/007 , B32B27/06 , B32B37/14 , B32B2255/26 , B32B2307/412 , B32B2405/00 , B32B2457/00 , C08G73/1014 , C08G73/1039 , C08G73/1067 , C09D179/08 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10S156/93 , Y10S156/941 , Y10T156/1158 , Y10T156/1917
摘要： The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.
摘要翻译：本发明广泛地涉及在微电子制造过程中能够进行薄晶片处理的剥离层组合物。优选的释放层由包含溶解或分散在溶剂体系中的聚酰胺酸或聚酰亚胺的组合物形成，随后在约250℃至约350℃下固化和/或除去溶剂少于约10分钟，产生薄膜。该过程将释放组合物形成聚酰亚胺释放层，其可以用于临时粘合过程，并且在期望的处理已经进行之后激光剥离。

7. 发明公开

EP4007799A1 PERMANENT BONDING AND PATTERNING MATERIAL 审中-公开
公开(公告)号：EP4007799A1
公开(公告)日：2022-06-08
申请号：EP20851156.8
申请日：2020-07-31
申请人： Brewer Science Inc.
发明人： SEJOUBSARI, Reihaneh , FLAIM, Tony D. , LIU, Xiao
IPC分类号： C09J201/08 , C09J11/00 , C08K5/12 , C08K5/00 , B32B7/12

8. 发明公开

EP3485506A1 LASER ABLATIVE DIELECTRIC MATERIAL 审中-公开
公开(公告)号：EP3485506A1
公开(公告)日：2019-05-22
申请号：EP17828566.4
申请日：2017-07-14
申请人： Brewer Science Inc.
发明人： MATOS-PEREZ, Cristina R. , FLAIM, Tony D. , SOUTHARD, Arthur O. , KIRCHNER, Lisa M. , BLUMENSHINE, Deborah
IPC分类号： H01L21/02 , H01L21/768 , H01L21/324

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