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1. 发明申请

US20080079017A1 Method of uniform phosphor chip coating and led package fabricated using method 有权
标题翻译：使用方法制造的均匀磷光体芯片涂层和LED封装的方法
公开(公告)号：US20080079017A1
公开(公告)日：2008-04-03
申请号：US11881683
申请日：2007-07-27
申请人： Ban Loh , Nicholas Medendorp , Peter Andrews , Yankun Fu , Micheal Laughner , Ronan Letoquin
发明人： Ban Loh , Nicholas Medendorp , Peter Andrews , Yankun Fu , Micheal Laughner , Ronan Letoquin
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L33/505 , H01L33/54 , H01L2224/48091 , H01L2924/19107 , H01L2933/0041 , H01L2933/005 , H01L2924/00014
摘要： Methods for fabricating LED packages comprising providing an LED chip and covering at least part of it with a liquid medium. An optical element is provided and placed on the liquid medium. The optical element is allowed to settle to a desired level and the liquid medium is cured. LED packages are also disclosed that are fabricated using the disclosed methods.
摘要翻译：制造LED封装的方法包括提供LED芯片并用液体介质覆盖其至少一部分。提供光学元件并放置在液体介质上。允许光学元件沉降至所需水平并且液体介质固化。还公开了使用所公开的方法制造的LED封装。

2. 发明申请

US20080054286A1 Light emitting device packages, light emitting diode (LED) packages and related methods 有权
标题翻译：发光器件封装，发光二极管（LED）封装及相关方法
公开(公告)号：US20080054286A1
公开(公告)日：2008-03-06
申请号：US11895795
申请日：2007-08-27
申请人： Ban Loh , Peter Andrews , Nicholas Medendorp
发明人： Ban Loh , Peter Andrews , Nicholas Medendorp
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/52 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2224/48471 , H01L2924/00014
摘要： Light emitting device packages, light emitting diode (LED) packages and related methods are disclosed. According to one aspect, a light emitting device package is provided. The package includes a mounting pad adapted for attachment of a light emitting device. A lens coupler is attached to the mounting pad and defines an opening for containing the light emitting device and a quantity of encapsulant. The lens coupler includes a surface defining a depression which comprises at least one edge that shapes an outer surface of the encapsulant.
摘要翻译：公开了发光器件封装，发光二极管（LED）封装和相关方法。根据一个方面，提供一种发光器件封装。该包装包括适于附接发光装置的安装垫。透镜耦合器附接到安装焊盘并且限定用于容纳发光器件的开口和一定数量的密封剂。透镜耦合器包括限定凹陷的表面，其包括形成密封剂的外表面的至少一个边缘。

3. 发明申请

US20080012036A1 Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices 有权
标题翻译：用于固态发光器件的基于引线框的封装以及用于形成固态发光器件的基于引线框的封装的方法
公开(公告)号：US20080012036A1
公开(公告)日：2008-01-17
申请号：US11657347
申请日：2007-01-24
申请人： Ban Loh , Nicholas Medendorp , Eric Tarsa , Bernd Keller
发明人： Ban Loh , Nicholas Medendorp , Eric Tarsa , Bernd Keller
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/483 , H01L23/49861 , H01L24/73 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/01322 , H01L2924/3011 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed.
摘要翻译：用于发光器件的模块化封装包括引线框架，该引线框架包括具有顶表面，底表面和第一厚度的第一区域和具有小于第一厚度的顶表面，底表面和第二厚度的第二区域。引线框还包括从第二区域横向延伸的电引线，并且封装件还包括在引线框上并围绕第一区域的热固性封装主体。热固性封装体可以在第二区域的顶表面和底表面上。泄漏屏障可以在引线框架上，并且封装主体可以在泄漏屏障上。还公开了在引线框架上形成包括热固性封装体的模块化封装的方法。

4. 发明申请

US20070274667A1 Methods and apparatus for directing light emitting diode output light 有权
标题翻译：用于引导发光二极管输出光的方法和装置
公开(公告)号：US20070274667A1
公开(公告)日：2007-11-29
申请号：US11431304
申请日：2006-05-10
申请人： Ban Loh , Nicholas Medendorp
发明人： Ban Loh , Nicholas Medendorp
IPC分类号： G02B6/10
CPC分类号： H01L33/54 , G02F1/133603 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： Sideways emission enhancements are described for light emitting diode (LED) lighting solutions having a wide variety of applications. While a typical LED lighting device has a substantial portion of its light emitted near a normal to the semiconductor photonic chip emitting the light, the present approach may suitable provide a compact, easily manufacturable device with good thermal design characteristics and a changed emission pattern without changing the horizontal mounting plane of the semiconductor photonic chip.
摘要翻译：针对具有各种应用的发光二极管（LED）照明解决方案描述了侧向发射增强。虽然典型的LED照明装置的光的大部分发射在发射光的半导体光子芯片的正常附近，但是本方法可以适合提供具有良好的热设计特性和改变的发射图案的紧凑的，易于制造的装置，而不改变半导体光子芯片的水平安装平面。

5. 发明申请

US20070253209A1 Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same 有权
标题翻译：用于半导体发光器件封装的底座以及包括其的半导体发光器件封装
公开(公告)号：US20070253209A1
公开(公告)日：2007-11-01
申请号：US11412381
申请日：2006-04-27
申请人： Ban Loh , Nicholas Medendorp , Bernd Keller
发明人： Ban Loh , Nicholas Medendorp , Bernd Keller
IPC分类号： B60Q1/124
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/19107 , H01L2924/00014
摘要： A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.
摘要翻译：一种用于固体照明包装的基座，包括具有上表面和下表面的支撑构件，第一侧表面和与第一侧表面相对的第二侧表面，位于支撑构件的上表面上的第一电接合垫，接合区域靠近支撑构件的第一侧表面，以及第二接合区域，其朝着支撑构件的第二侧表面延伸，并且在支撑构件的上表面上的第二电接合板具有靠近第一侧表面的模具安装区域并且延伸到所述支撑构件的第二侧表面的延伸区域。第二电接合板的管芯安装区域可以被配置为接收电子设备。底座还包括位于支撑构件的上表面上并位于支撑构件的第二侧表面和第二电接合垫的模具安装区域之间的第三电接合板。

6. 发明申请

US20070200127A1 POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE 有权
标题翻译：功率表面安装发光包装
公开(公告)号：US20070200127A1
公开(公告)日：2007-08-30
申请号：US11689868
申请日：2007-03-22
申请人： Peter Andrews , Ban Loh
发明人： Peter Andrews , Ban Loh
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/58 , H01L33/62 , H01L33/64 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/0102 , H01L2924/01025 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014
摘要： A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.
摘要翻译：提供一种发光管芯封装，其包括在第一表面上具有第一表面和第一导电引线的金属基板。第一导电引线通过绝缘膜与基板绝缘。第一导电引线形成用于安装发光器件的安装焊盘。该封装包括电连接到第一导电引线并远离第一表面延伸的金属引线。

7. 外观设计

USD594827S1 Lamp package 有权
公开(公告)号：USD594827S1
公开(公告)日：2009-06-23
申请号：US29250973
申请日：2006-12-07
申请人： Ban Loh , Nicholas W. Medendorp, Jr. , Bernd Keller , Eric Tarsa
设计人： Ban Loh , Nicholas W. Medendorp, Jr. , Bernd Keller , Eric Tarsa

8. 发明申请

US20060292747A1 Top-surface-mount power light emitter with integral heat sink 审中-公开
标题翻译：顶表面贴装功率发光器，带集成散热器
公开(公告)号：US20060292747A1
公开(公告)日：2006-12-28
申请号：US11168018
申请日：2005-06-27
申请人： Ban Loh
发明人： Ban Loh
IPC分类号： H01L21/00 , H01L23/48
CPC分类号： H01L33/64 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01S5/02212 , H01L2924/00
摘要： A light emitting apparatus is disclosed. The light emitting apparatus includes a substrate, a heat sink, a dielectric layer, conductive traces, a reflector, and at least one photonic device. The substrate has a top surface and a bottom surface, a portion of the top surface defining a mounting pad. The heat sink is equipped with cooling fins to cool the substrate. The conductive traces are on the top surface of the substrate and extend from the mounting pad to a side edge of the substrate. The reflector is attached to the top surface of the substrate. The reflector surrounds the mounting pad partially covering the top surface of the substrate. The photonic device is attached to the substrate at the mounting pad, the photonic device connected to at least one conductive trace. The light emitting apparatus can be mounted on a board having connection traces. The connection traces of the board are aligned with the conductive trace of the light emitting apparatus to effect electrical connection.
摘要翻译：公开了一种发光装置。发光装置包括衬底，散热器，电介质层，导电迹线，反射器和至少一个光子器件。衬底具有顶表面和底表面，顶表面的一部分限定了安装垫。散热片配有散热片以冷却基板。导电迹线位于基板的顶表面上，并从安装垫延伸到基板的侧边缘。反射器附接到基板的顶表面。反射器围绕安装衬垫部分地覆盖衬底的顶表面。光子器件在安装焊盘处附接到衬底，光子器件连接到至少一个导电迹线。发光装置可以安装在具有连接迹线的板上。板的连接迹线与发光装置的导电迹线对准以实现电连接。

9. 发明申请

US20050051789A1 Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same 有权
标题翻译：用于半导体发光器件的固体金属块安装基板及其制造方法
公开(公告)号：US20050051789A1
公开(公告)日：2005-03-10
申请号：US10659108
申请日：2003-09-09
申请人： Gerald Negley , Ban Loh
发明人： Gerald Negley , Ban Loh
IPC分类号： H01L33/48 , H01L29/22
CPC分类号： H01L33/486 , H01L2224/48091 , H01L2924/00014
摘要： A mounting substrate for a semiconductor light emitting device includes a solid metal block having a cavity in a face thereof that is configured for mounting a semiconductor light emitting device therein. An insulating coating is provided in the cavity, and first and second spaced apart conductive traces are provided on the insulating coating in the cavity that are configured for connection to a semiconductor light emitting device. The mounting substrate may be fabricated by providing a solid aluminum block including a cavity in a face thereof that is configured for mounting a semiconductor light emitting device therein. The solid aluminum block is oxidized to form an aluminum oxide coating thereon. The first and second spaced apart electrical traces are fabricated on the aluminum oxide coating in the cavity.
摘要翻译：用于半导体发光器件的安装基板包括其表面上具有用于将半导体发光器件安装在其中的腔体的固体金属块。绝缘涂层设置在空腔中，并且第一和第二间隔开的导电迹线设置在空腔中的被配置为连接到半导体发光器件的绝缘涂层上。可以通过提供一种固体铝块来制造安装基板，该固体铝块包括其表面中的腔体，其被构造用于在其中安装半导体发光器件。将固体铝块氧化，在其上形成氧化铝涂层。第一和第二间隔开的电迹线在空腔中的氧化铝涂层上制造。

10. 发明授权

US07183587B2 Solid metal block mounting substrates for semiconductor light emitting devices 有权
标题翻译：用于半导体发光器件的固体金属块安装基板
公开(公告)号：US07183587B2
公开(公告)日：2007-02-27
申请号：US10659108
申请日：2003-09-09
申请人： Gerald H. Negley , Ban Loh
发明人： Gerald H. Negley , Ban Loh
IPC分类号： H01L29/22
CPC分类号： H01L33/486 , H01L2224/48091 , H01L2924/00014
摘要： A mounting substrate for a semiconductor light emitting device includes a solid metal block having a cavity in a face thereof that is configured for mounting a semiconductor light emitting device therein. An insulating coating is provided in the cavity, and first and second spaced apart conductive traces are provided on the insulating coating in the cavity that are configured for connection to a semiconductor light emitting device. The mounting substrate may be fabricated by providing a solid aluminum block including a cavity in a face thereof that is configured for mounting a semiconductor light emitting device therein. The solid aluminum block is oxidized to form an aluminum oxide coating thereon. The first and second spaced apart electrical traces are fabricated on the aluminum oxide coating in the cavity.
摘要翻译：用于半导体发光器件的安装基板包括其表面上具有用于将半导体发光器件安装在其中的腔体的固体金属块。绝缘涂层设置在空腔中，并且第一和第二间隔开的导电迹线设置在空腔中的被配置为连接到半导体发光器件的绝缘涂层上。可以通过提供一种固体铝块来制造安装基板，该固体铝块包括其表面中的腔体，其被构造用于在其中安装半导体发光器件。将固体铝块氧化，在其上形成氧化铝涂层。第一和第二间隔开的电迹线在空腔中的氧化铝涂层上制造。

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