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1. 发明申请

US20150270596A1 POWER DIVIDER AND METHOD OF FABRICATING THE SAME 有权
标题翻译：功率分配器及其制造方法
公开(公告)号：US20150270596A1
公开(公告)日：2015-09-24
申请号：US14436940
申请日：2012-10-25
申请人： Bo ZHOU , Kun LIU , Junyou CHEN , TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)
发明人： Bo Zhou , Kun Liu , Junyou Chen
IPC分类号： H01P5/12 , H01P11/00
CPC分类号： H01P5/12 , H01P5/16 , H01P11/003 , H01P11/006
摘要： The invention provides a power divider, comprising: a plurality of transmission stages and a plurality of ground layers alternately arranged on respective ones of a plurality of dielectric layers, a first transmission stage being arranged on a first dielectric layer, and a last transmission stage being arranged below a last dielectric layer; wherein the plurality of transmission stages are arrayed vertically, each consisting of a loop formed by a transmission line; the first transmission stage has a first opening connected by a resistor, and each of the remaining transmission stages has the first opening connected by the resistor and a second opening without a resistor; two ends of the first opening of one of the adjacent transmission stages are connected to two ends of the second opening of the other one of the adjacent transmission stages by via transitions, in a top-to-bottom direction; and each ground layer has clearances through which the via transitions pass. The invention also provides a method of fabricating the power divider.
摘要翻译：本发明提供了一种功率分配器，包括：交替布置在多个电介质层中的多个电介质层上的多个发射级和多个接地层，第一传输级布置在第一介电层上，最后的传输级为布置在最后的介电层下面; 其中所述多个传输级垂直排列，每个由传输线形成的环路组成; 第一传输级具有由电阻器连接的第一开口，并且每个剩余的传输级具有通过电阻器连接的第一开口和没有电阻器的第二开口; 一个相邻传动级的第一开口的两端通过上下方向的过渡而连接到另一个相邻传动级的第二开口的两端; 并且每个接地层具有通孔经过的间隙。本发明还提供一种制造功率分配器的方法。

2. 发明申请

US20150214594A1 BANDPASS FILTER AND METHOD OF FABRICATING THE SAME 有权
标题翻译： BANDPASS过滤器及其制造方法
公开(公告)号：US20150214594A1
公开(公告)日：2015-07-30
申请号：US14406211
申请日：2012-06-21
申请人： Bo Zhou , Junyou Chen , Kun Liu
发明人： Bo Zhou , Junyou Chen , Kun Liu
IPC分类号： H01P1/203
CPC分类号： H01P1/20309 , H01P1/20345 , H01P5/028 , H01P11/007
摘要： The invention provides a bandpass filter, comprising: a substrate with a plurality of dielectric layers; a plurality of resonators; and a plurality of ground layers each having one slot arranged on; wherein the plurality of resonators are arrayed vertically each on respective one of the plurality of dielectric layers alternately without any of offsets, and each of the plurality of ground layers is between adjacent dielectric layers. Adjacent slots are arranged in opposite sides of the ground layers. The invention also provides a method of fabricating the bandpass filter.
摘要翻译：本发明提供了一种带通滤波器，包括：具有多个电介质层的衬底; 多个谐振器; 以及多个接地层，每个接地层具有布置在其上的一个槽; 其中所述多个谐振器在所述多个电介质层中的相应一个电介质层上垂直地排列，而没有任何偏移，并且所述多个接地层中的每一个在相邻的电介质层之间。相邻的槽布置在接地层的相对侧。本发明还提供一种制造带通滤波器的方法。

3. 发明授权

US09780427B2 Bandpass filter and method of fabricating the same 有权
公开(公告)号：US09780427B2
公开(公告)日：2017-10-03
申请号：US14406211
申请日：2012-06-21
申请人： Bo Zhou , Junyou Chen , Kun Liu
发明人： Bo Zhou , Junyou Chen , Kun Liu
IPC分类号： H01P3/08 , H01P1/203 , H01P11/00 , H01P5/02
CPC分类号： H01P1/20309 , H01P1/20345 , H01P5/028 , H01P11/007
摘要： The invention provides a bandpass filter, comprising: a substrate with a plurality of dielectric layers; a plurality of resonators; and a plurality of ground layers each having one slot arranged on; wherein the plurality of resonators are arrayed vertically each on respective one of the plurality of dielectric layers alternately without any of offsets, and each of the plurality of ground layers is between adjacent dielectric layers. Adjacent slots are arranged in opposite sides of the ground layers. The invention also provides a method of fabricating the bandpass filter.

4. 发明申请

US20160192487A1 Via Transition and Method of Fabricating the Same 审中-公开
标题翻译：通过过渡及其制作方法
公开(公告)号：US20160192487A1
公开(公告)日：2016-06-30
申请号：US14911410
申请日：2013-08-12
申请人： TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)
发明人： Bo Zhou , Kun Liu , Junyou Chen
IPC分类号： H05K1/11 , H05K3/46 , H05K3/10 , H05K3/40 , H05K1/09 , H05K1/03
CPC分类号： H05K1/115 , H01P1/2039 , H01P5/028 , H05K1/0251 , H05K1/0306 , H05K1/0313 , H05K1/09 , H05K1/116 , H05K1/162 , H05K3/10 , H05K3/4038 , H05K3/46 , H05K3/4629 , H05K3/4632 , H05K2201/0141 , H05K2201/0175 , H05K2201/09672
摘要： The present disclosure provides a via transition, comprising: two end segments; high-impedance segments and low-impedance segments. The high-impedance segments and the low-impedance segments are alternately arranged between the two end segments, and the via transition is formed in a substrate. The disclosure also provides a power divider comprising the via transition and a method of fabricating the low-pass via transition.
摘要翻译：本公开提供了一种通孔转换，包括：两个端部段; 高阻抗段和低阻抗段。高阻抗段和低阻抗段交替地布置在两个端段之间，并且通孔转变形成在衬底中。本公开还提供了包括通孔转换的功率分配器和制造低通通孔转换的方法。

5. 发明授权

US09685686B2 Power divider and method of fabricating the same 有权
公开(公告)号：US09685686B2
公开(公告)日：2017-06-20
申请号：US14436940
申请日：2012-10-25
申请人： Telefonaktiebolaget L M Ericsson (publ)
发明人： Bo Zhou , Kun Liu , Junyou Chen
IPC分类号： H03H7/30 , H01P5/12 , H01P11/00 , H01P5/16
CPC分类号： H01P5/12 , H01P5/16 , H01P11/003 , H01P11/006
摘要： The invention provides a power divider, comprising: a plurality of transmission stages and a plurality of ground layers alternately arranged on respective ones of a plurality of dielectric layers, a first transmission stage being arranged on a first dielectric layer, and a last transmission stage being arranged below a last dielectric layer; wherein the plurality of transmission stages are arrayed vertically, each consisting of a loop formed by a transmission line; the first transmission stage has a first opening connected by a resistor, and each of the remaining transmission stages has the first opening connected by the resistor and a second opening without a resistor; two ends of the first opening of one of the adjacent transmission stages are connected to two ends of the second opening of the other one of the adjacent transmission stages by via transitions, in a top-to-bottom direction; and each ground layer has clearances through which the via transitions pass. The invention also provides a method of fabricating the power divider.

6. 发明授权

US09839118B2 Method and arrangement for board-to-board interconnection 有权
公开(公告)号：US09839118B2
公开(公告)日：2017-12-05
申请号：US15031369
申请日：2013-11-01
申请人： TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)
发明人： Bo Zhou , Junyou Chen , Kun Liu
IPC分类号： H01P3/08 , H01P5/08 , H05K1/14 , H05K1/02 , H01Q1/38 , H01Q1/22 , H01Q1/48 , H05K3/10 , H05K3/46 , H05K1/11
CPC分类号： H05K1/0237 , H01L2924/19107 , H01P3/081 , H01P5/028 , H01Q1/2283 , H01Q1/38 , H01Q1/48 , H05K1/0213 , H05K1/025 , H05K1/117 , H05K1/14 , H05K1/142 , H05K3/10 , H05K3/4644 , H05K2201/04 , H05K2201/0979 , H05K2203/049
摘要： A wide bandwidth circuit board arrangement includes two coplanar substrates separated by a predetermined gap, and at least one bond wire arranged across the gap and interconnecting a respective conducting microstrip line on a first side of each respective substrate. Further, the arrangement includes at least one open stub arrangement configured on the first side of each respective substrate, each open stub arrangement comprising a microstrip extending at an angle from an end of each conducting strip on each respective substrate. Finally, the arrangement includes a ground layer on a second side of each respective substrate, and a defected ground structure arranged on the second side of each respective substrate and laterally overlapping each respective open stub arrangement arranged on the first side.

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