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    • 3. 发明申请
    • SPUTTERING APPARATUS AND RECORDING MEDIUM FOR RECORDING CONTROL PROGRAM THEREOF
    • 用于记录控制程序的溅射装置和记录介质
    • US20110042209A1
    • 2011-02-24
    • US12934497
    • 2009-06-16
    • Nobuo YamaguchiKoji TsunekawaNaoki WatanabeMotomu Kosuda
    • Nobuo YamaguchiKoji TsunekawaNaoki WatanabeMotomu Kosuda
    • C23C14/34
    • C23C14/3492C23C14/225C23C14/3407C23C14/54
    • Disclosed is a sputtering device wherein a target (2) is disposed offset with respect to a substrate (7), wherein said sputtering device can ensure a uniform amount of deposition, even when a substrate support holder (6) has a low number of rotations of several rotations to several tens of rotations, and the amount of deposition is extremely small, such as a film thickness of 1 nm or less. A control unit (11) is provided to perform control using input of the values of a total whole number of rotations N and a fractional number of rotations α such that X=N+α (where N is the total whole number of rotations and is a positive whole number, and α is the fractional number of rotations and is a positive pure decimal) and, by input of the value of a deposition time T such that the rotational velocity V (rps) of the aforementioned substrate support holder (6) satisfies V·T=N+α when the total number of rotations of the aforementioned substrate support holder (6) is X, during the deposition time of T (seconds) for particles sputtered onto the surface of the aforementioned substrate (7) where a film is to be formed.
    • 公开了一种溅射装置,其中靶(2)相对于基板(7)偏置地设置,其中即使当基板支撑架(6)具有低转数时,也可以确保均匀的沉积量 几个旋转到几十个旋转,并且沉积量非常小,例如膜厚度为1nm以下。 提供控制单元(11),以使用总共转数N和分数转数α的值的输入来执行控制,使得X = N +α(其中N是总的总转数,并且是 正整数,α是分数旋转数,为正纯的十进制),通过输入沉积时间T,使得上述基板支撑保持架(6)的旋转速度V(rps) 在溅射到上述基板(7)的表面上的颗粒的沉积时间T(秒)期间,当上述基板支撑保持器(6)的总转数为X时,满足V·T = N +α,其中 电影将要成立。