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    • 1. 发明授权
    • Surface tension effect dryer with porous vessel walls
    • 表面张力效应干燥器与多孔容器壁
    • US06502591B1
    • 2003-01-07
    • US09590724
    • 2000-06-08
    • Dana ScrantonIan Sharp
    • Dana ScrantonIan Sharp
    • B08B306
    • H01L21/67034B08B3/06B08B3/10B08B3/12H01L21/67028
    • A processor for rinsing and drying of semiconductor substrates includes a process vessel contained within an outer containment vessel. A diluted organic vapor creates a Marangoni effect flow along the surface of processing liquid contained within the process vessel. The process vessel includes porous walls that allow residual chemicals, organic species, and other unwanted materials to flow from the process vessel to the outer containment vessel. The porous walls allow for the maintenance of a stable surface tension gradient to sustain a consistent Marangoni force for even drying. Replacement processing fluid is preferably introduced to the process vessel to prevent the build up of organic species in the surface layer of the processing fluid.
    • 用于冲洗和干燥半导体衬底的处理器包括容纳在外部容纳容器内的处理容器。 稀释的有机蒸气沿着包含在处理容器内的处理液体的表面产生马兰戈尼效应流。 处理容器包括多孔壁,其允许残留的化学物质,有机物质和其它不需要的物质从处理容器流到外部容器。 多孔壁允许维持稳定的表面张力梯度,以维持一致的马兰戈尼力,以使其均匀干燥。 替代处理流体优选地引入到处理容器中,以防止加工流体的表面层中的有机物质的积聚。
    • 2. 发明授权
    • Substrate drying method for use with a surface tension effect dryer with porous vessel walls
    • 用于表面张力效应干燥器与多孔容器壁的基板干燥方法
    • US06681499B2
    • 2004-01-27
    • US10336193
    • 2003-01-03
    • Dana ScrantonIan Sharp
    • Dana ScrantonIan Sharp
    • B08B310
    • H01L21/67034B08B3/06B08B3/10B08B3/12H01L21/67028
    • A processor and method for rinsing and drying of semiconductor substrates includes a process vessel contained within an outer containment vessel. A diluted organic vapor creates a Marangoni effect flow along the surface of processing liquid contained within the process vessel. The process vessel includes porous walls that allow residual chemicals, organic species, and other unwanted materials to flow from the process vessel to the outer containment vessel. The porous walls allow for the maintenance of a stable surface tension gradient to sustain a consistent Marangoni force for even drying. Replacement processing fluid is preferably introduced to the process vessel to prevent the build up of organic species in the surface layer of the processing fluid.
    • 用于冲洗和干燥半导体衬底的处理器和方法包括容纳在外部容纳容器内的处理容器。 稀释的有机蒸气沿着包含在处理容器内的处理液体的表面产生马兰戈尼效应流。 处理容器包括多孔壁,其允许残留的化学物质,有机物质和其它不需要的物质从处理容器流到外部容器。 多孔壁允许维持稳定的表面张力梯度,以维持一致的马兰戈尼力,以使其均匀干燥。 替代处理流体优选地引入到处理容器中,以防止加工流体的表面层中的有机物质的积聚。
    • 6. 发明申请
    • Side-specific cleaning apparatus
    • 侧面清洁装置
    • US20050199277A1
    • 2005-09-15
    • US11054739
    • 2005-02-09
    • Dana Scranton
    • Dana Scranton
    • B08B3/12H01L21/00
    • H01L21/67057B08B3/12
    • An apparatus for cleaning of a microelectronic workpiece having a front side, a back side, and an edge includes a chamber and a fixture within the chamber that is adapted to hold one or more microelectronic workpieces. At least one transducer is located within the chamber and preferably adjacent to the edge of the microelectronic workpiece. The method includes the steps of immersing the front side, back side, and edge of the microelectronic workpiece in a first processing fluid while preferably rotating the microelectronic workpiece. The microelectronic workpiece is then rinsed and dried and immersed in a second processing fluid such that the back side and edge of the microelectronic workpiece are immersed in the second processing fluid, while preferably rotating the microelectronic workpiece, without exposing the front surface of the microelectronic workpiece to the second processing fluid. Vibrational energy, preferably in the form of megasonics, is introduced during at least one of the immersions steps.
    • 用于清洁具有前侧,后侧和边缘的微电子工件的设备包括腔室和室内的固定器,其适于容纳一个或多个微电子工件。 至少一个换能器位于腔室内并且优选地邻近微电子工件的边缘。 该方法包括以下步骤:将微电子工件的正面,背面和边缘浸入第一处理流体中,同时优选地旋转微电子工件。 然后将微电子工件冲洗并干燥并浸入第二处理流体中,使得微电子工件的背面和边缘浸入第二处理流体中,同时优选地旋转微电子工件,而不暴露微电子工件的前表面 到第二处理流体。 优选以兆声波形式的振动能量在至少一个浸入步骤期间引入。
    • 9. 发明授权
    • Single semiconductor wafer processor
    • 单个半导体晶圆处理器
    • US06374837B2
    • 2002-04-23
    • US09859930
    • 2001-05-17
    • Dana ScrantonGary L. Curtis
    • Dana ScrantonGary L. Curtis
    • B08B300
    • H01L21/67034Y10S134/902
    • An apparatus for processing or drying a semiconductor wafer includes a rotor for holding a wafer and for spinning the wafer about a first axis. A pivot arm supports the rotor, so that the rotor can pivot about a second axis that is substantially perpendicular to the first axis. A basin holding a processing fluid is located below the rotor, with the rotor vertically movable into and out of the processing fluid via an elevator supporting the pivot arm. The rotor is pivotable into a position where it holds the wafer at an inclined angle so that the wafer may be withdrawn from the processing fluid at said inclined angle to facilitate drying of the wafer.
    • 用于处理或干燥半导体晶片的装置包括用于保持晶片并围绕第一轴旋转晶片的转子。 枢转臂支撑转子,使得转子可围绕基本上垂直于第一轴线的第二轴线枢转。 保持加工流体的盆地位于转子下方,其中转子可通过支撑枢转臂的电梯竖直移动和移出加工流体。 转子可枢转到其以倾斜角度保持晶片的位置,使得晶片可以以所述倾斜角度从处理流体中取出,以促进晶片的干燥。