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1. 发明授权

US06692588B1 Method and apparatus for simultaneously cleaning and annealing a workpiece 失效
标题翻译：同时清洁和退火工件的方法和装置
公开(公告)号：US06692588B1
公开(公告)日：2004-02-17
申请号：US09351868
申请日：1999-07-12
申请人： Cyprian Emeka Uzoh , Homayoun Talieh
发明人： Cyprian Emeka Uzoh , Homayoun Talieh
IPC分类号： B08B310
CPC分类号： H01L21/324 , C25D5/50 , H01L21/288 , H01L21/321 , H01L21/67051 , H01L21/67109 , Y10S438/906
摘要： The present invention is directed to a method and apparatus for simultaneously cleaning and annealing a plated semiconductor workpiece. A chamber for simultaneously cleaning and annealing a semiconductor workpiece is provided herein. The method according to the present invention includes the steps rinsing the workpiece with mineral acids and DI water, then simultaneously cleaning/annealing the workpiece with heated deoxygenated DI water. By this present method, tool cross contamination by way of plated metal is greatly reduced, and also grain recovery and grain growth at room temperature is greatly accelerated. Thus, the annealing time of grain growth is dramatically reduced using the present method and apparatus.
摘要翻译：本发明涉及同时清洗和退火镀覆的半导体工件的方法和装置。本文提供了用于同时清洁和退火半导体工件的腔室。根据本发明的方法包括用无机酸和去离子水冲洗工件的步骤，然后用加热的脱氧去离子水同时清洗/退火工件。通过本方法，大大减少了通过电镀金属的工具交叉污染，并且大大加速了室温下的晶粒恢复和晶粒生长。因此，使用本方法和装置，晶粒生长的退火时间显着减少。

2. 发明授权

US06681499B2 Substrate drying method for use with a surface tension effect dryer with porous vessel walls 失效
标题翻译：用于表面张力效应干燥器与多孔容器壁的基板干燥方法
公开(公告)号：US06681499B2
公开(公告)日：2004-01-27
申请号：US10336193
申请日：2003-01-03
申请人： Dana Scranton , Ian Sharp
发明人： Dana Scranton , Ian Sharp
IPC分类号： B08B310
CPC分类号： H01L21/67034 , B08B3/06 , B08B3/10 , B08B3/12 , H01L21/67028
摘要： A processor and method for rinsing and drying of semiconductor substrates includes a process vessel contained within an outer containment vessel. A diluted organic vapor creates a Marangoni effect flow along the surface of processing liquid contained within the process vessel. The process vessel includes porous walls that allow residual chemicals, organic species, and other unwanted materials to flow from the process vessel to the outer containment vessel. The porous walls allow for the maintenance of a stable surface tension gradient to sustain a consistent Marangoni force for even drying. Replacement processing fluid is preferably introduced to the process vessel to prevent the build up of organic species in the surface layer of the processing fluid.
摘要翻译：用于冲洗和干燥半导体衬底的处理器和方法包括容纳在外部容纳容器内的处理容器。稀释的有机蒸气沿着包含在处理容器内的处理液体的表面产生马兰戈尼效应流。处理容器包括多孔壁，其允许残留的化学物质，有机物质和其它不需要的物质从处理容器流到外部容器。多孔壁允许维持稳定的表面张力梯度，以维持一致的马兰戈尼力，以使其均匀干燥。替代处理流体优选地引入到处理容器中，以防止加工流体的表面层中的有机物质的积聚。

3. 发明授权

US06652665B1 Method of removing silicone polymer deposits from electronic components 有权
标题翻译：从电子部件去除有机硅聚合物沉积物的方法
公开(公告)号：US06652665B1
公开(公告)日：2003-11-25
申请号：US10160627
申请日：2002-05-31
申请人： Krishna G. Sachdev , Umar M. Ahmad , Chon C. Lei
发明人： Krishna G. Sachdev , Umar M. Ahmad , Chon C. Lei
IPC分类号： B08B310
CPC分类号： C11D7/261 , B08B3/02 , B08B3/102 , C11D7/263 , C11D7/266 , C11D7/3209 , C11D7/5022 , C11D11/0047 , H01L2224/73204 , H01L2224/73253 , H01L2924/16152 , H05K3/288
摘要： A method of removing cured silicone polymer deposits from electronic components. The components are immersed in a preheated solution of a quaternary ammonium fluoride in a hydrophobic non-hydroxylic aprotic solvent with agitation. The components are then immersed in a preheated solvent consisting essentially of a hydrophobic aprotic solvent with agitation. This is followed by a rinse and spray of the components with a hydrophilic, essentially water soluble solvent, with agitation. The components are then immersed in a water bath and then rinsed with a pressurized spray of water and then dried with a N2 blow dry.
摘要翻译：从电子部件去除固化的硅氧烷聚合物沉积物的方法。将组分浸入预热的季铵氟化物在疏水非羟基非质子溶剂中并搅拌。然后将组分浸入基本上由疏水性非质子溶剂组成的预热溶剂中并搅拌。随后在搅拌下用亲水性，基本上水溶性的溶剂冲洗和喷雾组分。然后将组分浸入水浴中，然后用加压喷雾水冲洗，然后用N 2吹干干燥。

4. 发明授权

US06575178B1 Cleaning and drying method and apparatus 失效
标题翻译：清洗干燥方法及装置
公开(公告)号：US06575178B1
公开(公告)日：2003-06-10
申请号：US09690024
申请日：2000-10-16
申请人： Yuji Kamikawa
发明人： Yuji Kamikawa
IPC分类号： B08B310
CPC分类号： H01L21/02054 , B08B3/10 , G11B23/505 , H01L21/67028 , Y10S134/902
摘要： An enclosure 23A that defines a drying chamber 23 is configured of a pair of enclosing elements 23c and 23d and a base element 23b. When wafers enter or leave the drying chamber 23, the enclosing elements 23c and 23d are lifted upward by vertical air cylinders 42 to separate them from the base element 23b. The enclosing elements 23c and 23d are then moved in directions that mutually separate them. To dry wafers within the drying chamber 23, the enclosing elements and the base element 23b are mutually engaged to form a hermetic seal, in the opposite sequence. The present invention reduces the dimensions of the drying chamber without impeding the work of moving wafers into and out of the drying chamber. This makes it possible to reduce the internal volume of the drying chamber, achieving a reduction is the consumption of drying gas, an improvement in the drying efficiency, and a reduction in overall size of the apparatus.
摘要翻译：限定干燥室23的外壳23A由一对封闭元件23c和23d以及基座元件23b构成。当晶片进入或离开干燥室23时，封闭元件23c和23d被垂直气缸42向上提升，以将它们与基座元件23b分开。然后，封闭元件23c和23d沿相互分开的方向移动。为了在干燥室23内干燥晶片，封闭元件和基底元件23b以相反的顺序相互接合以形成气密密封。本发明减小了干燥室的尺寸，而不会阻碍将晶片移入和离开干燥室。这使得可以减小干燥室的内部容积，实现干燥气体的消耗减少，干燥效率的提高和装置的总体尺寸的减小。

5. 发明授权

US06564810B1 Cleaning of semiconductor processing chambers 有权
标题翻译：半导体处理室的清洁
公开(公告)号：US06564810B1
公开(公告)日：2003-05-20
申请号：US09536590
申请日：2000-03-28
申请人： Ivo Raaijmakers , Franciscus B. Van Bilsen
发明人： Ivo Raaijmakers , Franciscus B. Van Bilsen
IPC分类号： B08B310
CPC分类号： H01J37/32862 , B08B7/0035 , B08B9/08 , C23C16/4405 , Y10S134/902 , Y10S438/905
摘要： A method of removing deposits from selected areas of a substrate-processing chamber comprising applying RF energy to a coil located around selected areas of the chamber is provided. Also provided is a substrate-processing chamber with improved cleaning properties having a coil capable of being coupled with an RF field disposed at selected areas of the chamber.
摘要翻译：提供了从衬底处理室的选定区域去除沉积物的方法，包括将RF能量施加到位于室的选定区域周围的线圈。还提供了具有改进的清洁特性的衬底处理室，其具有能够与设置在腔室的选定区域处的RF场耦合的线圈。

6. 发明授权

US06539959B1 Cleaning apparatus for plate-like part and method thereof 失效
标题翻译：板状零件清洗装置及其方法
公开(公告)号：US06539959B1
公开(公告)日：2003-04-01
申请号：US09498355
申请日：2000-02-04
申请人： Noriyuki Ohroku , Yuichirou Tanaka , Yoichi Takahara , Tomonori Saeki , Susumu Aiuchi , Hitoshi Oka , Fumio Morita , Masataka Fujiki , Akinobu Yamaoka
发明人： Noriyuki Ohroku , Yuichirou Tanaka , Yoichi Takahara , Tomonori Saeki , Susumu Aiuchi , Hitoshi Oka , Fumio Morita , Masataka Fujiki , Akinobu Yamaoka
IPC分类号： B08B310
CPC分类号： H01L21/67051 , B08B3/04 , B08B3/10 , G11B23/505 , Y10S134/902
摘要： At a time of cleaning a plate-like part such as a wafer or the like while rotating, for the purpose of reducing a contamination, a damage and an unevenness of process of the plate-like part which are caused by an amount of charged electricity of the plate-like part, chuck pins (chuck members) 201 which chuck the plate-like part 1 such as the wafer or the like and upper and lower cleaning plates 101 and 121 which oppose to the plate-like part 1 are constituted by a resin material containing carbon powders, and a desired potential difference is applied to a portion between the plate-like part and the cleaning plates by a voltage control unit 601 which is provided in an outer portion.
摘要翻译：在旋转时清洁诸如晶片等的板状部件的时候，为了减少由电荷量引起的污染，板状部件的过程的损坏和不均匀性板状部分夹住板状部分等板状部分1的卡盘销（卡盘部件）201和与板状部分1相对的上下清扫板101和121构成为：含有碳粉末的树脂材料，并且通过设置在外部的电压控制单元601将期望的电位差施加到板状部分和清洁板之间的部分。

7. 发明授权

US06491045B2 Apparatus for and method of cleaning object to be processed 有权
公开(公告)号：US06491045B2
公开(公告)日：2002-12-10
申请号：US09970696
申请日：2001-10-05
申请人： Yuji Kamikawa , Kinya Ueno , Satoshi Nakashima
发明人： Yuji Kamikawa , Kinya Ueno , Satoshi Nakashima
IPC分类号： B08B310
CPC分类号： H01L21/67028 , B08B3/08 , Y10S134/902
摘要： A method for cleaning an object to be processed in which the atmosphere in a drying chamber is replaced by an inert gas prior to placing an object to be cleaned from an external environment into the chamber. The object is then transported by an elongated retaining member from the drying chamber through a lower opening in the chamber into a processing bath disposed below the chamber. The object is then cleaned in the processing bath. The object is then transported from the processing bath to the drying chamber where it is dried by filling the atmosphere of the drying chamber with organic solvent. The cleaning process in the cleaning bath is carried out while the bath is screened by a nitrogen-gas curtain. The method also includes opening a lid of the chamber prior to insertion of the object into the chamber and closing the lid after insertion of the object, as well as the opening and closing of the lower opening in the chamber. The method may also include exhausting an atmosphere in the drying chamber while supplying inert gas, decompressing the atmosphere in the drying chamber as well as chemical cleaning, water cleaning, and ozone cleaning of the object.

8. 发明授权

US06460552B1 Method and apparatus for cleaning flat workpieces 失效
标题翻译：用于清洁扁平工件的方法和设备
公开(公告)号：US06460552B1
公开(公告)日：2002-10-08
申请号：US09166819
申请日：1998-10-05
申请人： D'Arcy H. Lorimer
发明人： D'Arcy H. Lorimer
IPC分类号： B08B310
CPC分类号： H01L21/67167 , H01L21/67051 , H01L21/67207 , H01L21/67219 , H01L2924/0002 , Y10S134/902 , H01L2924/00
摘要： A semiconductor deposition system in accordance with the present invention includes a CMP apparatus operative to planarize an active surface of a semiconductor wafer, and a wafer cleaner for cleaning wafer after the CMP process. The wafer cleaner preferably includes a wafer rotating mechanism, a steam inlet for applying steam to the active surface of the wafer as it is rotated and a liquid inlet for simultaneously applying a liquid to the back side surface of the wafer. A method for manufacturing an integrated circuit in accordance with the present invention includes subjecting an active surface of the wafer to a plurality of processes selected from a group including deposition, patterning, doping, planarization, ashing and etching, and steam cleaning the active surface at least once before, during, and after the plurality of processes. Preferably, an aqueous vapor phase is applied to the first surface of the wafer as an aqueous liquid phase is applied to the other surface of the wafer. Spinning the wafer urges condensate from the vapor phase to move toward the edge of the wafer as the wafer surfaces are cleaned.
摘要翻译：根据本发明的半导体沉积系统包括可操作以平坦化半导体晶片的有源表面的CMP装置和用于在CMP处理之后清洁晶片的晶片清洁器。晶片清洗器优选地包括晶片旋转机构，用于在旋转晶片时将蒸汽施加到晶片的有源表面的蒸汽入口以及用于同时向液晶的背面施加液体的液体入口。根据本发明的用于制造集成电路的方法包括使晶片的有效表面经历从包括沉积，图案化，掺杂，平坦化，灰化和蚀刻的组中选择的多个工艺，以及将活性表面蒸汽清洗在多个处理之前，期间和之后至少一次。优选地，当将水相液相施加到晶片的另一个表面时，将水相气相施加到晶片的第一表面。当晶片表面被清洁时，旋转晶片促使来自气相的冷凝物向晶片的边缘移动。

9. 发明授权

US06367491B1 Apparatus for contaminant removal using natural convection flow and changes in solubility concentration by temperature 失效
标题翻译：使用自然对流和污染物浓度随温度变化的污染物去除装置
公开(公告)号：US06367491B1
公开(公告)日：2002-04-09
申请号：US09663526
申请日：2000-09-15
申请人： Mary C. Marshall , John G. Franjione , Christopher J. Freitas
发明人： Mary C. Marshall , John G. Franjione , Christopher J. Freitas
IPC分类号： B08B310
CPC分类号： B08B7/0021 , B08B7/0064
摘要： Apparatus and methods are described for removing contaminants from an article using a supercritical or near supercritical solvent fluid held at substantially constant pressure in a pressure vessel. The article to be cleaned is first contacted with a solvent fluid in which the contaminant is soluble at a first supercritical or near-supercritical temperature. The contaminant-containing fluid is then cooled or heated to a second supercritical or near supercritical temperature to lower the solubility of the contaminant in the supercritical fluid and thereby precipitate or phase separate the contaminant. The contaminant is then recovered. Movement of the solvent fluid within the pressure vessel is preferably by convection induced by heating and cooling means in the vessel.
摘要翻译：描述了使用在压力容器中以基本恒定压力保持的超临界或近超临界溶剂流体从制品中除去污染物的装置和方法。待清洗的物品首先与污染物在第一超临界或接近超临界温度下溶解的溶剂流体接触。然后将含污染物的流体冷却或加热至第二超临界或接近超临界温度以降低污染物在超临界流体中的溶解度，从而沉淀或相分离污染物。然后回收污染物。溶剂流体在压力容器内的移动优选地通过在容器中由加热和冷却装置引起的对流。

10. 发明授权

US06245158B1 Wet processing methods for the manufacture of electronic components using liquids of varying temperature 失效
标题翻译：使用不同温度的液体制造电子部件的湿法加工方法
公开(公告)号：US06245158B1
公开(公告)日：2001-06-12
申请号：US09324813
申请日：1999-06-02
申请人： Steven Verhaverbeke
发明人： Steven Verhaverbeke
IPC分类号： B08B310
CPC分类号： H01L21/02052
摘要： The present invention is directed to wet processing methods for the manufacture of electronic component precursors, such as semiconductor wafers used in integrated circuits. More specifically, this invention relates to methods of manufacturing electronic component precursors using liquids of varying temperature.
摘要翻译：本发明涉及用于制造电子元件前体（例如集成电路中使用的半导体晶片）的湿法加工方法。更具体地，本发明涉及使用不同温度的液体制造电子元件前体的方法。

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