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1. 发明专利

JP2012156476A Light source module and manufacturing method thereof 审中-公开
标题翻译：光源模块及其制造方法
公开(公告)号：JP2012156476A
公开(公告)日：2012-08-16
申请号：JP2011078433
申请日：2011-03-31
申请人： Getac Technology Corporation , 神基科技股▲ふん▼有限公司
发明人： CHEN MING-HUA , CHEN CHAO-YI , HUAN TZU-PIN
IPC分类号： H01L33/64 , F21S2/00 , F21V29/00 , F21Y101/02
CPC分类号： H01L25/0753 , H01L33/642 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a light source module which can effectively mitigate a problem of the thermal resistance, and a manufacturing method thereof.SOLUTION: A light source module and a manufacturing method thereof are disclosed. A circuit substrate and at least one light-emitting diode die are disposed on a heatsink substrate in sequence, and then a packaging material is formed on the light-emitting diode die. The circuit substrate has at least one through-hole thereon, and the light-emitting diode die is buried in the through-hole on the circuit substrate so that the light-emitting diode die is in direct contact with the heatsink substrate, so as to reduce the thermal resistance between the light-emitting diode die and the heatsink substrate, thus effectively dissipating the thermal energy of the light-emitting diode die through the heatsink substrate.
摘要翻译：要解决的问题：提供一种可以有效地缓解热阻问题的光源模块及其制造方法。解决方案：公开了一种光源模块及其制造方法。依次将电路基板和至少一个发光二极管管芯设置在散热片基板上，然后在发光二极管管芯上形成封装材料。电路基板上具有至少一个通孔，发光二极管管芯埋在电路基板上的通孔中，使得发光二极管管芯与散热基板直接接触，从而降低发光二极管管芯和散热基板之间的热阻，从而有效地散发发光二极管管芯通过散热基板的热能。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2006245577A Forced air-cooling chip cooler and its manufacturing process 审中-公开
标题翻译：强制冷却芯片冷却器及其制造工艺
公开(公告)号：JP2006245577A
公开(公告)日：2006-09-14
申请号：JP2006051279
申请日：2006-02-27
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , LEE PING-FENG , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/467 , H01L23/36
CPC分类号： H01L23/427 , B23P2700/10 , C25D7/00 , C25D15/02 , H01L23/3732 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To enhance thermal conductivity of a cooling piece in a forced air-cooling chip cooler. SOLUTION: The forced air-cooling chip cooler comprises a cooling piece for conducting heat by touching the chip plane of a semiconductor device, a cooling fin having a plurality of cooling fins arranged on the bottom side and forming a passage of air flow between the bottom side and the opposing upper side, a pipe for conducting heat by touching the surface of the cooling piece and the bottom face arranged with the cooling fins at the opposite ends thereof, and a fan having an outlet opposing the inlet of the air flow passage of the cooling fin wherein the cooling piece is produced by coating a metal mixed with fine carbon powder of diamond-like structure or a molding of a metal mixed or not mixed with fine carbon powder of diamond-like structure with carbon of diamond-like structure. Aluminium, copper, and other metals of high thermal conductivity are applicable as that metal. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提高强制风冷芯片冷却器中的冷却片的导热性。解决方案：强制风冷芯片冷却器包括通过触摸半导体器件的芯片平面来传导热量的冷却片，具有布置在底侧上的多个冷却翅片并形成空气流通道的冷却翅片在底侧和相对的上侧之间，通过接触冷却片的表面和与其相对的端部布置有冷却翅片的底面来传导热量的管，以及具有与空气入口相对的出口的风扇冷却翅片的流动通道，其中冷却片通过涂覆与金刚石结构的细碳粉末混合的金属或与金刚石结构的细碳粉末混合或不混合的金属的模制品制成金刚石 - 像结构。铝，铜等导热系数高的金属适用于金属。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2006270068A Semiconductor chip cooling system, structure and manufacturing method of heat exchange device for the same 审中-公开
标题翻译：半导体芯片冷却系统，其交换装置的结构和制造方法
公开(公告)号：JP2006270068A
公开(公告)日：2006-10-05
申请号：JP2006043033
申请日：2006-02-20
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , LEE PING-FENG , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/473
CPC分类号： H01L23/473 , H01L23/3736 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a cooling system of a CPU semiconductor chip or the like, a heat exchange device and its manufacturing method. SOLUTION: A semiconductor chip cooling system comprises a fluid-cooled heat sink 23, a heat exchange device 31, a pumping device 25, and conduits 211 and 251 constituting the circulation path of a cooling fluid. This heat sink dissipates the heat generated of a semiconductor chip 21 to cool it. The heat exchange device blast-cools the heat of the cooling fluid, circulated via the conduits from the heat sink by the pumping device by a fan 241. The cooling fins and the heat sink pieces of the heat exchange device are formed, by coating the surface of a cast of carbon fine powders of a metal material having proper thermal conductivity and of a diamond-like structure or a molding formed of the metal material having proper thermal conductivity with carbons of a diamond-like structure. The carbons of the diamond-like structure are superior in thermal conductivity and can improve the cooling capacity. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供CPU半导体芯片等的冷却系统，热交换装置及其制造方法。解决方案：半导体芯片冷却系统包括流体冷却的散热器23，热交换装置31，泵送装置25以及构成冷却流体的循环路径的导管211和251。该散热器散发半导体芯片21产生的热量以使其冷却。热交换装置通过风扇241对冷却流体的热量进行喷射冷却，通过泵送装置经由导管从导热管循环。热交换装置的散热片和散热片通过涂覆具有适当导热性和金刚石结构的金属材料的铸造碳细粉末的表面或由具有类金刚石结构的碳的具有适当导热性的金属材料形成的模制品的表面。类金刚石结构的碳导热性优良，可提高制冷量。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2006245561A Thin film structure on heat dissipation metal surface and its production process 审中-公开
标题翻译：散热金属表面薄膜结构及其生产工艺
公开(公告)号：JP2006245561A
公开(公告)日：2006-09-14
申请号：JP2006027578
申请日：2006-02-03
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/373
CPC分类号： H01L23/3732 , F28F13/18 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a thin film structure on the surface of a heat dissipation metal exhibiting excellent heat dissipation effect, and to provide its production process. SOLUTION: A thin film 52 composed of carbon of a diamond structure is formed on the surface of a heat dissipation metal 51. A lower surface of the heat dissipation metal is arranged in tight contact with the heat dissipation surface of a heat generation source such as a semiconductor chip, and heat is dissipated from the thin film structure on the surface of the heat dissipation metal by heat conduction. Since a heat dissipation surface composed of carbon of a diamond structure is employed, thermal conduction characteristics are enhanced and high heat dissipation action is exhibited by infrared radiation activity. The thin film composed of carbon of diamond structure is formed by chemical vapor deposition or physical vapor deposition. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：在散热金属的表面上提供薄膜结构，具有优异的散热效果，并提供其制造工艺。解决方案：在散热金属51的表面上形成由金刚石结构的碳构成的薄膜52.散热金属的下表面与发热的散热面紧密接触源如半导体芯片，并且热量通过热传导从散热金属的表面上的薄膜结构消散。由于采用由金刚石结构的碳组成的散热表面，所以热传导特性得到提高，并且通过红外辐射活性表现出高的散热作用。由金刚石结构的碳组成的薄膜通过化学气相沉积或物理气相沉积形成。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2006270088A Thermal interface material structure and its manufacturing method 审中-公开
标题翻译：热接口材料结构及其制造方法
公开(公告)号：JP2006270088A
公开(公告)日：2006-10-05
申请号：JP2006051277
申请日：2006-02-27
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/373
CPC分类号： C09J9/00 , C08L63/00 , C08L79/08 , C09J11/04 , H01L23/373 , H01L23/3732 , H01L23/3737 , H01L23/473 , H01L24/29 , H01L2224/2929 , H01L2224/29393 , H01L2224/32245 , H01L2224/73253 , H01L2924/01068
摘要： PROBLEM TO BE SOLVED: To provide a thermal interface material that is interposed between a semiconductor device or the like and its cooling apparatus so as to achieve thermal conduction, and its manufacturing method. SOLUTION: Fine carbon powder having a diamond-like structure is uniformly dispersed and mixed into a plastic material to obtain a thermal interface material. As the plastic material, highly thermal conductive metal particles of aluminum, copper or the like are mixed into a thermally conductive resin to obtain a metal colloid, and then fine carbon powder having a diamond-like structure is uniformly dispersed and mixed into the plastic material, and subsequently the mixture is rolled into a sheet. The thermal interface material bonds a semiconductor chip and its cooling heatsink so as to offer excellent thermal conduction properties. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供介于半导体器件等之间的热界面材料及其冷却装置以实现热传导及其制造方法。解决方案：具有类金刚石结构的细碳粉末被均匀地分散并混合到塑料材料中以获得热界面材料。作为塑料材料，将铝，铜等的高导热性金属颗粒混合到导热树脂中以获得金属胶体，然后将具有类金刚石结构的细小碳粉均匀地分散并混合到塑料材料，随后将该混合物卷成片材。热界面材料结合半导体芯片及其冷却散热片，以提供优异的导热性能。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006245568A System for cooling semiconductor chip, and structure and manufacturing method of cooling device 审中-公开
标题翻译：用于冷却半导体芯片的系统，以及冷却装置的结构和制造方法
公开(公告)号：JP2006245568A
公开(公告)日：2006-09-14
申请号：JP2006043032
申请日：2006-02-20
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , LEE PING-FENG , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/473
CPC分类号： F28D15/00 , F28F3/048 , F28F3/12 , F28F13/18 , F28F21/00 , F28F21/02 , F28F2255/143 , H01L23/3732 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a system for cooling a semiconductor chip having high cooling efficiency, and a structure and a manufacturing method of a cooling device. SOLUTION: The system has a cooling device 33, heat exchanger device 34, pump device 35, and a tube 351 for circulating a cooling fluid between the cooling device and the heat exchanger device. The cooling device is disposed in contact with a semiconductor chip and receives waste heat of the chip, and formed of a heat conduction material so that it cools the fluid flowing in the cooling device and the heat exchanger device in a circulating manner by the pump device. The heat conduction material may be a mixture of a metal material and carbon having a tetrahedron structure, or a material having a structure where a surface of a metal material is covered with the carbon having the tetrahedron structure, or a combination of them. The carbon having the tetrahedron structure has a property of high heat conductivity, improving a heat conduction effect of the heat conduction material. In a method of manufacturing the heat conduction material, the material is prepared by a chemical vapor deposition process, a physical vapor deposition process, a melting process, or other material manufacturing methods, and the carbon having the tetrahedron structure may be provided covering the surface of the metal material, or may be mixed into the metal material. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于冷却具有高冷却效率的半导体芯片的系统，以及冷却装置的结构和制造方法。解决方案：该系统具有用于在冷却装置和热交换器装置之间循环冷却流体的冷却装置33，热交换装置34，泵装置35和管351。冷却装置设置成与半导体芯片接触并且接收芯片的废热，并且由导热材料形成，使得其通过泵装置以循环方式冷却在冷却装置和热交换器装置中流动的流体。导热材料可以是具有四面体结构的金属材料和碳的混合物，或具有金属材料的表面被具有四面体结构的碳或其组合覆盖的结构的材料的混合物。具有四面体结构的碳具有高导热性，改善导热材料的导热效果。在制造导热材料的方法中，通过化学气相沉积法，物理气相沉积法，熔融法或其他材料制造方法制备材料，并且可以提供覆盖表面的具有四面体结构的碳的金属材料，或者可以混合到金属材料中。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2006245560A Structure of heat dissipation fin and its manufacturing process 审中-公开
标题翻译：散热结构及其制造工艺
公开(公告)号：JP2006245560A
公开(公告)日：2006-09-14
申请号：JP2006027577
申请日：2006-02-03
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , LEE PING-FENG , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/36 , H01L23/373
CPC分类号： F28F1/10 , B23P2700/10 , C25D7/00 , C25D15/02 , G06F1/20 , H01L23/3732 , H01L23/467 , H01L2224/73253
摘要： PROBLEM TO BE SOLVED: To enhance thermal conductivity of heat dissipation fins for cooling a semiconductor chip, or the like.
SOLUTION: The structure of heat dissipation fins comprises a connector 22 and a plurality of heat dissipation fins 21. The heat dissipation fins and the connector are a heat conduction material composed of a metal and carbon having a diamond structure, and a heat generation source such as a semiconductor device is applied tightly to the lower surface of the connector in order to dissipate heat by heat conduction. The connector and the heat dissipation fins are formed by die casting a metal such as aluminium or copper containing fine carbon particles of diamond structure. Alternatively, a film composed of carbon of diamond structure may be formed by CVD on the surface of the connector and the heat dissipation fins made of metal. Carbon of a diamond structure has extremely high thermal conductivity and enhances heat dissipation effect.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提高用于冷却半导体芯片的散热片的导热性等。散热片的结构包括连接器22和多个散热翅片21.散热翅片和连接器是由具有金刚石结构的金属和碳组成的导热材料和热量诸如半导体器件的发生源被紧密地施加到连接器的下表面，以便通过热传导来散热。连接器和散热片通过压铸金属如铝或含有金刚石结构的细小碳颗粒的铜形成。或者，可以通过CVD在金属结构的表面上形成由金刚石结构的碳构成的膜和由金属制成的散热片。金刚石结构的碳具有极高的导热性和增强的散热效果。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2006229220A Cooling structure for semiconductor device or like, and manufacturing method for same 审中-公开
标题翻译：用于半导体器件等的冷却结构及其制造方法
公开(公告)号：JP2006229220A
公开(公告)日：2006-08-31
申请号：JP2006027579
申请日：2006-02-03
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , LEE PING-FENG , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/36 , H01L23/02
CPC分类号： H01L23/3736 , H01L23/10 , H01L23/3675 , H01L23/3732 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/15312 , H01L2924/16152 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a chip cooling structure which is composed of a substrate, a semiconductor chip, and a package and characterized in that the package is made of metal and carbon in diamond structure as a heat-conductive material and the carbon in diamond structure has a high coefficient of heat conduction and improve the heat conduction effect of the heat-conductive material. SOLUTION: This cooling structure has an electric circuit structure and comprises the substrate 12 on which the semiconductor chip is mounted, the semiconductor chip 13, and the package 15. The semiconductor chip is electrically connected onto the substrate 12 by a flip-chip structure, and its generated heat is conducted to the metallic package 15 through heat conductive layer 14 from a rear side 131 to cool the semiconductor chip. The heat conductivity is improved by forming a carbon coating layer in diamond structure on the surface of the metallic package 15 which comes into contact with the semiconductor chip by CVD, sputtering, etc. Further, those structures may be formed on the metallic package by electroplating method using an electrolyte in which particulate carbon in diamond structure is suspended or a die-casting method wherein its particulates are mixed. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供由基板，半导体芯片和封装构成的芯片冷却结构，其特征在于，所述封装由金刚石结构中的金属和碳制成，作为导热材料，金刚石结构中的碳具有高的导热系数，并且提高导热材料的导热效果。解决方案：该冷却结构具有电路结构，并且包括其上安装有半导体芯片的基板12，半导体芯片13和封装15.半导体芯片通过触发器电连接到基板12上，芯片结构，并且其产生的热量通过来自后侧131的导热层14传导到金属封装15，以冷却半导体芯片。通过在通过CVD，溅射等与半导体芯片接触的金属封装15的表面上形成金刚石结构中的碳涂层来提高导热性。此外，这些结构可以通过电镀形成在金属封装上使用其中悬浮金刚石结构中的颗粒碳的电解质的方法或其混合其颗粒的压铸方法。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2006245576A Bonding material and its production process 审中-公开
标题翻译：粘接材料及其生产工艺
公开(公告)号：JP2006245576A
公开(公告)日：2006-09-14
申请号：JP2006051278
申请日：2006-02-27
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/373 , H01L23/36 , H05K7/20
CPC分类号： H01L21/4882 , B23K35/22 , B23K35/327 , C09J1/00 , H01L23/3732 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a bonding material being employed in a member of a cooler for a semiconductor device and exhibiting excellent thermal conductivity, and to provide its production process.
SOLUTION: The bonding material for bonding a cooling piece being bonded to a semiconductor device and receiving heat generated therefrom, and a cooling means such as fins at a mutual bonding part such as a conduit for conducting heat and enhancing thermal conductivity, comprises a metal of good thermal conductivity such as aluminium or copper and fine carbon powder of diamond-like structure. The metal is melted and dispersed and mixed uniformly with fine carbon powder of diamond-like structure, and a rodlike bonding material is produced from the molten by flocculation pulling method. Since diamond exhibits excellent thermal conductivity and wideband optical transparency, cooling performance of the cooler by heat conduction is enhanced.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于半导体器件的冷却器的构件中并且显示出优异的导热性的接合材料，并提供其制造工艺。解决方案：用于接合粘合到半导体器件并接收由其产生的热的冷却片的接合材料以及诸如用于传导热量并增强导热性的导管等相互接合部分的翅片的冷却装置包括具有良好导热性的金属如铝或铜以及类金刚石结构的细碳粉末。金属与金刚石结构的细碳粉末熔融分散和均匀混合，并通过絮凝拉制法从熔融生产棒状粘合材料。由于金刚石具有优异的导热性和宽带光学透明性，所以通过热传导提高了冷却器的冷却性能。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2006245575A Printed circuit board structure and its manufacturing method 审中-公开
标题翻译：印刷电路板结构及其制造方法
公开(公告)号：JP2006245575A
公开(公告)日：2006-09-14
申请号：JP2006051276
申请日：2006-02-27
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H05K1/09 , H01L23/14 , H01L23/373 , H05K1/05 , H05K3/44
CPC分类号： H05K3/28 , H05K1/0203 , H05K1/0306 , H05K1/05 , H05K2201/0179 , H05K2201/0323 , Y10T428/24917 , Y10T428/24926 , Y10T428/30
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board structure which efficiently conducts heat generated from a semiconductor device, and its manufacturing method. SOLUTION: The printed circuit board supports electronic parts 25 in a circuit, and conducts and dissipates heat generated from the electronic parts and its related equipment. The printed circuit board mounting the semiconductor device comprises a layer structure 31, and the layer structure is composed of a conductive layer 32 and an insulating base 33. The conductive layer has thermal conductivity, and forms a diamond-like structure carbon coat on a metal in which diamond-like structure carbon fine powder is mixed in scattering, or on a metal surface in which metal or diamond-like structure fine powder is dispersed and mixed. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种有效地传导由半导体器件产生的热的印刷电路板结构及其制造方法。
解决方案：印刷电路板支持电路中的电子部件25，并且传导和散发由电子部件及其相关设备产生的热量。安装半导体器件的印刷电路板包括层结构31，并且层结构由导电层32和绝缘基底33组成。导电层具有导热性，并且在金属上形成类金刚石结构的碳涂层其中金刚石结构碳细粉末散射混合，或金属或类金刚石结构细粉末分散和混合的金属表面。版权所有（C）2006，JPO＆NCIPI

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