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1. 发明申请

US20100227423A1 LED BACKLIGHT UNIT WITHOUT PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：没有印刷电路板的LED背光单元及其制造方法
公开(公告)号：US20100227423A1
公开(公告)日：2010-09-09
申请号：US12779695
申请日：2010-05-13
申请人： Gi Ho JEONG , Si Young Yang , Jae Wook Kwon , Jeong Hoon Park , Hyun Ju Yi , Choon Keun Lee
发明人： Gi Ho JEONG , Si Young Yang , Jae Wook Kwon , Jeong Hoon Park , Hyun Ju Yi , Choon Keun Lee
IPC分类号： H01L33/62 , H01L33/48
CPC分类号： H01L33/62 , H01L2224/48091 , H01L2924/01019 , H05K1/056 , H05K3/045 , H05K2201/0376 , H05K2201/09036 , H05K2201/10106 , H05K2203/0108 , H05K2203/025 , Y10T29/49158 , Y10T29/49172 , H01L2924/00014
摘要： Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 μm or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.
摘要翻译：本文公开了一种没有印刷电路板（PCB）的发光二极管（LED）背光单元。 LED背光单元包括底盘，绝缘树脂层和一个或多个光源模块。绝缘树脂层形成在底座上。电路图案形成在绝缘树脂层上。光源模块安装在绝缘树脂层上并电连接到电路图案。绝缘树脂层的厚度为200μm以下，通过在底盘上层叠固体膜绝缘树脂或者通过使用旋转涂布或刮刀涂布的成型方法将液体绝缘树脂施加到底架而形成。此外，通过用金属材料填充绝缘树脂层的雕刻电路图案来形成电路图案。

2. 发明授权

US08779561B2 LED backlight unit without printed circuit board and method of manufacturing the same 有权
标题翻译：没有印刷电路板的LED背光单元及其制造方法
公开(公告)号：US08779561B2
公开(公告)日：2014-07-15
申请号：US12779695
申请日：2010-05-13
申请人： Gi Ho Jeong , Si Young Yang , Jae Wook Kwon , Jeong Hoon Park , Hyun Ju Yi , Choon Keun Lee
发明人： Gi Ho Jeong , Si Young Yang , Jae Wook Kwon , Jeong Hoon Park , Hyun Ju Yi , Choon Keun Lee
IPC分类号： H01L23/58
CPC分类号： H01L33/62 , H01L2224/48091 , H01L2924/01019 , H05K1/056 , H05K3/045 , H05K2201/0376 , H05K2201/09036 , H05K2201/10106 , H05K2203/0108 , H05K2203/025 , Y10T29/49158 , Y10T29/49172 , H01L2924/00014
摘要： Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 μm or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.
摘要翻译：本文公开了一种没有印刷电路板（PCB）的发光二极管（LED）背光单元。 LED背光单元包括底盘，绝缘树脂层和一个或多个光源模块。绝缘树脂层形成在底座上。电路图案形成在绝缘树脂层上。光源模块安装在绝缘树脂层上并电连接到电路图案。绝缘树脂层的厚度为200μm以下，通过在底盘上层叠固体膜绝缘树脂或者通过使用旋转涂布或刮刀涂布的成型方法将液体绝缘树脂施加到底架而形成。此外，通过用金属材料填充绝缘树脂层的雕刻电路图案来形成电路图案。

3. 发明申请

US20070221942A1 LED backlight unit without printed circuit board and method of manufacturing the same 审中-公开
标题翻译：没有印刷电路板的LED背光单元及其制造方法
公开(公告)号：US20070221942A1
公开(公告)日：2007-09-27
申请号：US11723235
申请日：2007-03-19
申请人： Gi Ho Jeong , Si Young Yang , Jae Wook Kwon , Jeong Hoon Park , Hyun Ju Yi , Choon Keun Lee
发明人： Gi Ho Jeong , Si Young Yang , Jae Wook Kwon , Jeong Hoon Park , Hyun Ju Yi , Choon Keun Lee
IPC分类号： H01L33/00 , H01L29/22
CPC分类号： H01L33/62 , H01L2224/48091 , H01L2924/01019 , H05K1/056 , H05K3/045 , H05K2201/0376 , H05K2201/09036 , H05K2201/10106 , H05K2203/0108 , H05K2203/025 , Y10T29/49158 , Y10T29/49172 , H01L2924/00014
摘要： Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 μm or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.
摘要翻译：本文公开了一种没有印刷电路板（PCB）的发光二极管（LED）背光单元。 LED背光单元包括底盘，绝缘树脂层和一个或多个光源模块。绝缘树脂层形成在底座上。电路图案形成在绝缘树脂层上。光源模块安装在绝缘树脂层上并电连接到电路图案。绝缘树脂层的厚度为200μm以下，通过在底盘上层叠固体膜绝缘树脂或者通过使用旋转涂布或刮刀涂布的成型方法将液体绝缘树脂施加到底架而形成。此外，通过用金属材料填充绝缘树脂层的雕刻电路图案来形成电路图案。

4. 发明授权

US07795635B2 Backlight unit equipped with light emitting diodes 有权
标题翻译：背光单元配有发光二极管
公开(公告)号：US07795635B2
公开(公告)日：2010-09-14
申请号：US11714193
申请日：2007-03-06
申请人： Gi Ho Jeong , Jae Wook Kwon , Dong Jin Kim , Yoon Tak Yang , Hyeong Won Yun , Hyun Ho Lee , Jeong Hoon Park
发明人： Gi Ho Jeong , Jae Wook Kwon , Dong Jin Kim , Yoon Tak Yang , Hyeong Won Yun , Hyun Ho Lee , Jeong Hoon Park
IPC分类号： H01L33/64
CPC分类号： H05K1/0206 , F21K9/00 , G02F1/133603 , G02F2001/133628 , H01L2224/48091 , H05K3/0061 , H05K2201/10106 , H05K2201/10409 , H01L2924/00014
摘要： Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.
摘要翻译：这里公开了配备有LED的背光单元。背光源包括绝缘基板，多个LED封装，上部散热板和下部散热板。绝缘基板设置有预定的电路图案。 LED封装安装在绝缘基板上方，并且电连接到电路图案。上部散热板形成在绝缘基板上，并被配置为与电路图案接触并散热。下部散热板形成在绝缘基板上，构成为透过上部散热板透过的热量。上散热板和下散热板通过至少一个通孔彼此连接，并且通孔和上散热板具有预定的面积比。

5. 发明申请

US20070221941A1 Backlight unit equipped with light emitting diodes 有权
标题翻译：背光单元配有发光二极管
公开(公告)号：US20070221941A1
公开(公告)日：2007-09-27
申请号：US11714193
申请日：2007-03-06
申请人： Gi Ho Jeong , Jae Wook Kwon , Dong Jin Kim , Yoon Tak Yang , Hyeong Won Yun , Hyun Ho Lee , Jeong Hoon Park
发明人： Gi Ho Jeong , Jae Wook Kwon , Dong Jin Kim , Yoon Tak Yang , Hyeong Won Yun , Hyun Ho Lee , Jeong Hoon Park
IPC分类号： H01L33/00
CPC分类号： H05K1/0206 , F21K9/00 , G02F1/133603 , G02F2001/133628 , H01L2224/48091 , H05K3/0061 , H05K2201/10106 , H05K2201/10409 , H01L2924/00014
摘要： Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.
摘要翻译：这里公开了配备有LED的背光单元。背光源包括绝缘基板，多个LED封装，上部散热板和下部散热板。绝缘基板设置有预定的电路图案。 LED封装安装在绝缘基板上方，并且电连接到电路图案。上部散热板形成在绝缘基板上，并被配置为与电路图案接触并散热。下部散热板形成在绝缘基板上，构成为透过上部散热板透过的热量。上散热板和下散热板通过至少一个通孔彼此连接，并且通孔和上散热板具有预定的面积比。

6. 发明申请

US20100127281A1 BACKLIGHT UNIT EQUIPPED WITH LIGHT EMITTING DIODES 有权
标题翻译：背光单元配有发光二极管
公开(公告)号：US20100127281A1
公开(公告)日：2010-05-27
申请号：US12693994
申请日：2010-01-26
申请人： Gi Ho JEONG , Jae Wook Kwon , Dong Jin Kim , Yoon Tak Yang , Hyeong Won Yun , Hyun Ho Lee , Jeong Hoon Park
发明人： Gi Ho JEONG , Jae Wook Kwon , Dong Jin Kim , Yoon Tak Yang , Hyeong Won Yun , Hyun Ho Lee , Jeong Hoon Park
IPC分类号： H01L33/00
CPC分类号： H05K1/0206 , F21K9/00 , G02F1/133603 , G02F2001/133628 , H01L2224/48091 , H05K3/0061 , H05K2201/10106 , H05K2201/10409 , H01L2924/00014
摘要： Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.
摘要翻译：这里公开了配备有LED的背光单元。背光源包括绝缘基板，多个LED封装，上部散热板和下部散热板。绝缘基板设置有预定的电路图案。 LED封装安装在绝缘基板上方，并且电连接到电路图案。上部散热板形成在绝缘基板上，并被配置为与电路图案接触并散热。下部散热板形成在绝缘基板上，构成为透过上部散热板透过的热量。上散热板和下散热板通过至少一个通孔彼此连接，并且通孔和上散热板具有预定的面积比。

7. 发明授权

US08053804B2 Backlight unit equipped with light emitting diodes 有权
标题翻译：背光单元配有发光二极管
公开(公告)号：US08053804B2
公开(公告)日：2011-11-08
申请号：US12693994
申请日：2010-01-26
申请人： Gi Ho Jeong , Jae Wook Kwon , Dong Jin Kim , Yoon Tak Yang , Hyeong Won Yun , Hyun Ho Lee , Jeong Hoon Park
发明人： Gi Ho Jeong , Jae Wook Kwon , Dong Jin Kim , Yoon Tak Yang , Hyeong Won Yun , Hyun Ho Lee , Jeong Hoon Park
IPC分类号： H01L33/64
CPC分类号： H05K1/0206 , F21K9/00 , G02F1/133603 , G02F2001/133628 , H01L2224/48091 , H05K3/0061 , H05K2201/10106 , H05K2201/10409 , H01L2924/00014
摘要： Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.
摘要翻译：这里公开了配备有LED的背光单元。背光源包括绝缘基板，多个LED封装，上部散热板和下部散热板。绝缘基板设置有预定的电路图案。 LED封装安装在绝缘基板上方，并且电连接到电路图案。上部散热板形成在绝缘基板上，并被配置为与电路图案接触并散热。下部散热板形成在绝缘基板上，构成为透过上部散热板透过的热量。上散热板和下散热板通过至少一个通孔彼此连接，并且通孔和上散热板具有预定的面积比。

8. 发明授权

US09082333B2 Integrated circuit configured to detect a short circuit therein and apparatus having the same 有权
标题翻译：被配置为检测其中的短路的集成电路及其装置
公开(公告)号：US09082333B2
公开(公告)日：2015-07-14
申请号：US13236943
申请日：2011-09-20
申请人： Joo-Won Hwang , Jae Wook Kwon
发明人： Joo-Won Hwang , Jae Wook Kwon
IPC分类号： G09G3/00 , G09G3/20 , G01R31/28
CPC分类号： G09G3/006 , G01R31/2884 , G09G3/20 , G09G2310/0267 , G09G2310/0275 , G09G2310/0278 , G09G2330/12
摘要： An integrated circuit is provided. The integrated circuit includes a plurality of output pads, a plurality of test pads, and a plurality of channel shift switches respectively connected between the plurality of output pads and the plurality of test pads and operated by a plurality of channel shift switch enable signals. A short path between the plurality of output pads may be detected when each of the plurality of channel shift switch enable signals are simultaneously at a high level.
摘要翻译：提供集成电路。集成电路包括分别连接在多个输出焊盘和多个测试焊盘之间的多个输出焊盘，多个测试焊盘和多个通道移位开关，并由多个通道移位开关使能信号操作。当多个信道移位开关使能信号中的每一个同时处于高电平时，可以检测多个输出焊盘之间的短路径。

9. 发明申请

US20110063505A1 APPARATUS AND METHOD FOR DRIVING LIGHT SCANNER 有权
标题翻译：驱动光扫描仪的装置和方法
公开(公告)号：US20110063505A1
公开(公告)日：2011-03-17
申请号：US12991995
申请日：2009-05-15
申请人： Jung Hoon Seo , Jae Sung Kim , Jae Wook Kwon
发明人： Jung Hoon Seo , Jae Sung Kim , Jae Wook Kwon
IPC分类号： H03L7/00
CPC分类号： H04N9/3129 , H04N9/3194
摘要： An apparatus for driving a light scanner and method thereof are disclosed. The present invention includes an apparatus for driving a light scanner, which scans an image on a screen, the apparatus comprising the light scanner driven by a drive signal, a sensing unit sensing a driving of the light scanner, a pixel clock signal generating unit generating a pixel clock signal by detecting a 90-degree phase difference between the drive signal and a sensing signal sensed by the sensing unit, a sync signal adjusting unit adjusting vertical and horizontal sync signals of an input video according to the pixel clock signal and a driving unit driving the light scanner according to the adjusted horizontal and vertical sync signals.
摘要翻译：公开了一种用于驱动光扫描器的装置及其方法。本发明包括一种用于驱动光扫描器的装置，其扫描屏幕上的图像，该装置包括由驱动信号驱动的光扫描器，感测单元，用于感测光扫描器的驱动;像素时钟信号产生单元，通过检测驱动信号和感测单元检测到的感测信号之间的90度相位差来产生像素时钟信号;同步信号调整单元，根据像素时钟信号调整输入视频的垂直和水平同步信号，以及驱动单元根据调整的水平和垂直同步信号驱动光扫描器。

10. 发明授权

US07830356B2 Surface light source using LED and backlight unit having the surface light source 有权
标题翻译：使用具有表面光源的LED和背光单元的表面光源
公开(公告)号：US07830356B2
公开(公告)日：2010-11-09
申请号：US11485426
申请日：2006-07-13
申请人： Sang Yun Lee , Jae Wook Kwon
发明人： Sang Yun Lee , Jae Wook Kwon
IPC分类号： G09G3/36
CPC分类号： G09G3/3413 , G02F1/133603 , G02F2001/133613 , G02F2201/52 , G09G3/3426 , H05B33/0803 , H05B33/0857
摘要： A surface light source using LEDs is provided. The surface light source includes a substrate having a plurality of divided regions, a plurality of red, green and blue LEDs arranged on each divided region in a predetermined arrangement structure, and a plurality of LED driving units each having red, green and blue LED driving circuits for respectively driving the red, green and blue LEDs. Identical color LEDs in each divided region are interconnected in series. The series connections of the red, green and blue LEDs in one divided region are respectively connected to the series connections of the red, green and blue LEDs in one or more other divided regions in parallel. The parallel connections of the series connections are connected to corresponding color LED driving circuits.
摘要翻译：提供了使用LED的面光源。表面光源包括具有多个划分区域的基板，以预定布置结构布置在每个划分区域上的多个红色，绿色和蓝色LED，以及多个LED驱动单元，每个LED驱动单元均具有红色，绿色和蓝色LED驱动分别驱动红色，绿色和蓝色LED的电路。每个分割区域中相同的彩色LED串联。一个分割区域中的红色，绿色和蓝色LED的串联连接分别连接到一个或多个其它分割区域中的红色，绿色和蓝色LED的串联连接。串联连接的并联连接连接到相应的彩色LED驱动电路。

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