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1. 发明授权

US08832929B2 Method of manufacturing a flexible printed circuit board 有权
标题翻译：柔性印刷电路板的制造方法
公开(公告)号：US08832929B2
公开(公告)日：2014-09-16
申请号：US13472937
申请日：2012-05-16
申请人： Kyung Ho Lee , Se Min Oh , Chang Hwan Choi , Choon Keun Lee , Jeong Yeol Moon , Jong Rip Kim
发明人： Kyung Ho Lee , Se Min Oh , Chang Hwan Choi , Choon Keun Lee , Jeong Yeol Moon , Jong Rip Kim
IPC分类号： H05K3/00 , H05K1/02
CPC分类号： H05K1/028 , H05K1/0218 , H05K2201/0191 , H05K2201/0352 , H05K2201/0715 , H05K2201/09736 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126
摘要： A method of manufacturing a flexible printed circuit board including determining an elastic modulus of a conductive portion and an elastic modulus of first and second dielectric portions, determining a thickness of the conductive portion and the first and second dielectric portions so that a neutral plane is located within a predetermined range of the thickness of the conductive portion, the neutral plane being substantially free from tension or compression in response to bending of the flexible printed circuit board, and insulating the conductive portion according to the determined thickness and the determined elastic modulus.
摘要翻译：一种制造柔性印刷电路板的方法，包括确定导电部分的弹性模量和第一和第二电介质部分的弹性模量，确定导电部分和第一和第二电介质部分的厚度，使得中性平面位于在导电部分的厚度的预定范围内，响应于柔性印刷电路板的弯曲，中性面基本上不受张力或压缩，并且根据确定的厚度和确定的弹性模量来绝缘导电部分。

2. 发明申请

US20120125667A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20120125667A1
公开(公告)日：2012-05-24
申请号：US13159866
申请日：2011-06-14
申请人： Hyung Mi JUNG , Jae Choon Cho , Choon Keun Lee
发明人： Hyung Mi JUNG , Jae Choon Cho , Choon Keun Lee
IPC分类号： H05K1/02 , H05K3/00
CPC分类号： H05K3/4644 , H05K3/06 , H05K3/4602 , H05K3/4652 , H05K2201/0347 , H05K2203/1152 , Y10T29/49155
摘要： There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board includes a first circuit pattern formed on a core substrate; an insulating layer stacked on the core substrate to cover the first circuit pattern and having a uniform surface roughness on a nano scale; a second circuit pattern formed on the insulating layer; and a via pattern electrically connecting the first circuit pattern to the second circuit pattern and penetrating through the insulating layer.
摘要翻译：提供了一种印刷电路板及其制造方法。印刷电路板包括形成在芯基板上的第一电路图案; 堆叠在所述芯基板上以覆盖所述第一电路图案并且具有纳米尺度的均匀表面粗糙度的绝缘层; 形成在所述绝缘层上的第二电路图案; 以及将第一电路图案电连接到第二电路图案并穿透绝缘层的通孔图案。

3. 发明申请

US20120090172A1 Method of manufacturing printed circuit boad 审中-公开
标题翻译：制造印刷电路板的方法
公开(公告)号：US20120090172A1
公开(公告)日：2012-04-19
申请号：US12929461
申请日：2011-01-26
申请人： Moon Soo Park , Sung Hyun Kim , Choon Keun Lee , Song Hee Jung
发明人： Moon Soo Park , Sung Hyun Kim , Choon Keun Lee , Song Hee Jung
IPC分类号： H05K3/22
CPC分类号： H05K3/4644 , H05K3/383 , H05K3/385 , H05K2203/0315 , H05K2203/122 , Y10T29/49155
摘要： Disclosed herein is a method of manufacturing a printed circuit board, including: forming a first circuit wiring layer on a substrate; forming an organic metal compound layer on the surface of the first circuit wiring layer; performing a surface treatment on the surface of the organic metal compound layer; forming an insulating layer on the first circuit wiring layer including the organic metal compound layer; and forming a second circuit wiring layer on the insulating layer.
摘要翻译：本文公开了一种制造印刷电路板的方法，包括：在基板上形成第一电路布线层; 在所述第一电路布线层的表面上形成有机金属化合物层; 在有机金属化合物层的表面进行表面处理; 在包括有机金属化合物层的第一电路布线层上形成绝缘层; 以及在所述绝缘层上形成第二电路布线层。

4. 发明申请

US20120018008A1 Apparatus for supplying source 审中-公开
标题翻译：用于供应源的装置
公开(公告)号：US20120018008A1
公开(公告)日：2012-01-26
申请号：US12926823
申请日：2010-12-10
申请人： Dong Joo Shin , Sung Taek Lim , Choon Keun Lee
发明人： Dong Joo Shin , Sung Taek Lim , Choon Keun Lee
IPC分类号： F99Z99/00
CPC分类号： B05C1/0813 , B05C1/0804 , B05C1/0808 , B05C1/0817 , B05C1/0826 , B29C39/18 , B29C39/44 , Y10T137/7287
摘要： Disclosed herein is an apparatus for supplying a source for constantly maintaining a film source water level in a source reservoir.The apparatus for supplying a source according to the present invention includes a source reservoir into which a liquid-phase film source is injected; a carrier film that is horizontally delivered from one side of the source reservoir; a casting roller that is rotated along the delivery direction of the carrier film and applies the liquid-phase film source injected into the source reservoir to the carrier film; a water level control plate that is vertically driven in the source reservoir to control the liquid-phase film source level; and a plate driving unit that moves the water level control plate up and down.
摘要翻译：本文公开了一种用于供应源以持续保持源储罐中的膜源水位的装置。根据本发明的用于供应源的装置包括其中注入液相膜源的源储存器; 从源储存器的一侧水平地传送的载体膜; 沿着载体膜的传送方向旋转的浇铸辊，将注入到所述源容器中的液相膜源施加到载体膜上; 水位控制板，其在源储液器中垂直驱动以控制液相膜源水平; 以及上下移动水位控制板的板驱动单元。

5. 发明授权

US07644496B2 Manufacturing method for imprinting stamper 失效
标题翻译：打印压模的制造方法
公开(公告)号：US07644496B2
公开(公告)日：2010-01-12
申请号：US11907288
申请日：2007-10-10
申请人： Jeong-Bok Kwak , Seung-Hyun Ra , Choon-Keun Lee , Jae-Choon Cho , Sang-Moon Lee
发明人： Jeong-Bok Kwak , Seung-Hyun Ra , Choon-Keun Lee , Jae-Choon Cho , Sang-Moon Lee
IPC分类号： H05K3/02
CPC分类号： H05K3/0014 , C25D1/10 , C25D1/20 , H05K3/005 , H05K3/107 , H05K2203/0108 , Y10T29/49117 , Y10T29/4913 , Y10T29/49155 , Y10T29/49162
摘要： A manufacturing method for imprinting stamper is disclosed. The manufacturing method includes forming a plurality of concave patterns on an insulation layer, forming a stamper by filling copper in the concave patterns, separating the stamper from the insulation layer, providing roughness on the surface of the stamper, can separate the stamper from the insulation layer, can prevent the deformation of the stamper and can manufacture pluralities of stampers repeatedly.
摘要翻译：公开了一种用于压印压模的制造方法。该制造方法包括在绝缘层上形成多个凹形图案，通过在凹形图案中填充铜形成压模，将压模与绝缘层分离，在压模表面上提供粗糙度，可将压模与绝缘体分离可以防止压模的变形，并且可以反复制造多个冲压机。

6. 发明申请

US20090183903A1 Printed circuit board 审中-公开
标题翻译：印刷电路板
公开(公告)号：US20090183903A1
公开(公告)日：2009-07-23
申请号：US12382560
申请日：2009-03-18
申请人： Choon-Keun Lee , Myeong-Ho Hong , Senug-Hyun Ra
发明人： Choon-Keun Lee , Myeong-Ho Hong , Senug-Hyun Ra
IPC分类号： H05K1/09
CPC分类号： H05K3/1258 , H05K3/0014 , H05K3/005 , H05K3/107 , H05K3/125 , H05K2201/09036 , H05K2203/0108 , H05K2203/013 , H05K2203/1189 , Y10T29/49128 , Y10T29/49131 , Y10T29/49135 , Y10T29/49155
摘要： A printed circuit board print (PCB) having an insulation layer; an intaglio pattern formed by depressing a part of the insulation layer corresponding to a location where a circuit pattern is to be formed; and conductive ink forming the circuit pattern by filling the intaglio pattern. A method of manufacturing the PCB includes providing an imprinting stamper with a relievo pattern formed in correspondence with a circuit pattern data using the circuit pattern data, forming an intaglio pattern corresponding to the relievo pattern by pressing the imprinting stamper on an insulation layer, and forming a circuit pattern by printing conductive ink in the intaglio pattern by an ink-jet method using the circuit pattern data, allows the forming of a circuit pattern to a required thickness by injecting conductive ink in a groove processed by the imprint method, and prevents the spreading of ink and the distortion of the pattern shape in the curing process for conductive ink containing metal. Also, the circuit pattern CAD data used in the manufacturing of an imprinting stamper can be utilized again in the ink-jet printing process.
摘要翻译：具有绝缘层的印刷电路板印刷（PCB）通过按压与要形成电路图案的位置相对应的绝缘层的一部分而形成的凹版图案; 以及通过填充凹版图案形成电路图案的导电油墨。一种制造PCB的方法包括：使用电路图案数据，使印模压模与电路图形数据相对应地形成一个减压图案，通过将压印模压在绝缘层上形成与减压图案对应的凹版图案，并形成通过使用电路图案数据的喷墨法将导电油墨印刷在凹版图案中的电路图案允许通过在通过压印方法处理的凹槽中注入导电油墨而将电路图案形成所需厚度，并且防止在含金属的导电油墨的固化过程中油墨的扩散和图案形状的变形。此外，在喷墨打印过程中可以再次使用用于制造压印压模的电路图案CAD数据。

7. 发明申请

US20080008824A1 Method for manufacturing printed circuit board using imprinting 有权
标题翻译：使用印记制造印刷电路板的方法
公开(公告)号：US20080008824A1
公开(公告)日：2008-01-10
申请号：US11819720
申请日：2007-06-28
申请人： Jae-Choon Cho , Myeong-Ho Hong , Senug-Hyun Ra , Hyuk-Soo Lee , Jeong-Bok Kwak , Jung-Woo Lee , Choon-Keun Lee , Sang-Moon Lee
发明人： Jae-Choon Cho , Myeong-Ho Hong , Senug-Hyun Ra , Hyuk-Soo Lee , Jeong-Bok Kwak , Jung-Woo Lee , Choon-Keun Lee , Sang-Moon Lee
IPC分类号： H05K3/46
CPC分类号： H05K1/09 , H05K3/0014 , H05K3/107 , H05K2201/0329 , H05K2203/0108 , H05K2203/0796
摘要： The present invention relates to a method for manufacturing a printed circuit board, more particularly to a method for manufacturing a printed circuit board, in which an oxidant capable of polymerizing conductive polymers is selectively marked on a board using imprinting, and the monomer of a conductive polymer is filled in the selected pattern and polymerized, to provide a conductive polymer wiring pattern. With the method for manufacturing a printed circuit board according to certain aspects of the invention as set forth above, a printed circuit board can be given finer wiring widths to allow a highly integrated, highly efficient printed circuit board. Thus, a printed circuit board (PCB) or a flexible printed circuit boards (FPCB) can be manufactured that is applicable to industrial, clerical, and domestic electric electronic products, by a new technique of forming conductive polymer wiring using imprinting.
摘要翻译：本发明涉及一种印刷电路板的制造方法，更具体地说，涉及一种印刷电路板的制造方法，其中使用压印法在基板上选择性地标记导电聚合物聚合的氧化剂，并且导电的单体聚合物以选定的图案填充并聚合，以提供导电聚合物布线图案。根据如上所述的根据本发明的某些方面的印刷电路板的制造方法，印刷电路板可以被给予更细的布线宽度，以允许高度集成的高效印刷电路板。因此，可以通过使用压印形成导电聚合物布线的新技术，制造适用于工业，文书和家用电子电子产品的印刷电路板（PCB）或柔性印刷电路板（FPCB）。

8. 发明授权

US08840967B2 Method for manufacturing printed circuit board including flame retardant insulation layer 有权
标题翻译：制造包含阻燃绝缘层的印刷电路板的方法
公开(公告)号：US08840967B2
公开(公告)日：2014-09-23
申请号：US13235060
申请日：2011-09-16
申请人： Jae-Choon Cho , Myeong-Ho Hong , Hwa-Young Lee , Hee-Sun Chun , Choon-Keun Lee
发明人： Jae-Choon Cho , Myeong-Ho Hong , Hwa-Young Lee , Hee-Sun Chun , Choon-Keun Lee
IPC分类号： B05D5/12 , B05D3/10 , C09K21/14 , H05K1/03
CPC分类号： C09K21/14 , C08G59/182 , C08K3/00 , C08K3/36 , C08L63/00 , H05K1/0326 , H05K1/036 , H05K1/0373 , H05K1/0393 , H05K2201/012 , H05K2201/0145 , H05K2201/0209
摘要： The present invention relates to a method for manufacturing a printed circuit board including a flame retardant insulation layer. The printed circuit board of the present invention exhibits excellent thermal stability and excellent mechanical strength, is suitable for imprinting lithography process, provides improved reliability by reducing coefficient of thermal expansion, and has excellent adhesion between circuit patterns and an insulation layer.
摘要翻译：本发明涉及包含阻燃绝缘层的印刷电路板的制造方法。本发明的印刷电路板显示出优异的热稳定性和优异的机械强度，适用于压印光刻工艺，通过降低热膨胀系数提供改进的可靠性，并且在电路图案和绝缘层之间具有优异的粘附性。

9. 发明授权

US08198542B2 Flexible printed circuit board and method of manufacturing the same 有权
标题翻译：柔性印刷电路板及其制造方法
公开(公告)号：US08198542B2
公开(公告)日：2012-06-12
申请号：US12213570
申请日：2008-06-20
申请人： Kyung Ho Lee , Se Min Oh , Chang Hwan Choi , Choon Keun Lee , Jeong Yeol Moon , Jong Rip Kim
发明人： Kyung Ho Lee , Se Min Oh , Chang Hwan Choi , Choon Keun Lee , Jeong Yeol Moon , Jong Rip Kim
IPC分类号： H05K1/02
CPC分类号： H05K1/028 , H05K1/0218 , H05K2201/0191 , H05K2201/0352 , H05K2201/0715 , H05K2201/09736 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126
摘要： An FPCB and a method of manufacturing the same, in which an electrical signal-conductive portion of the FPCB is subjected to little stress so as not to be broken by fatigue in spite of repeated bending of the FPCB, thereby increasing the lifetime of the FPCB.
摘要翻译： FPCB及其制造方法，其中FPCB的电信号传导部分经受很小的应力，以便尽管FPCB的反复弯曲而不会被疲劳破坏，从而增加FPCB的寿命。

10. 发明申请

US20120111618A1 FLAME RETARDANT RESIN COMPOSITION FOR MULTILAYER WIRING BOARD AND MULTILAYER WIRING BOARD INCLUDING THE SAME 有权
标题翻译：用于多层布线板和包括其的多层布线板的阻燃树脂组合物
公开(公告)号：US20120111618A1
公开(公告)日：2012-05-10
申请号：US13161760
申请日：2011-06-16
申请人： Hyung Mi Jung , Jae Choon Cho , Choon Keun Lee
发明人： Hyung Mi Jung , Jae Choon Cho , Choon Keun Lee
IPC分类号： H05K1/02 , C08L63/04 , C08L63/10 , C08L63/00
CPC分类号： H05K1/0353 , C08G59/08 , C08G59/182 , C08G59/186 , C08G59/304 , C08G59/621 , H05K1/0326 , H05K3/4655 , H05K2201/012 , Y10T428/12396
摘要： There are provided a flame-retardant resin composition for a multilayer wiring board and a multilayer wiring board having the same. The flame-retardant resin composition for a multilayer wiring board according to an exemplary embodiment of the present invention includes a composite epoxy resin including a naphthalene modified epoxy resin, a cresol novolac epoxy resin, a rubber modified epoxy resin and a phosphorous-based epoxy resin, as well as a flame retardant represented by a specific chemical formula. The flame-retardant resin composition for a multilayer wiring board and the multilayer wiring board having the same disclosed herein exhibits excellent flame retardancy, moisture resistance and peel strength.
摘要翻译：提供了一种用于多层布线板的阻燃树脂组合物和具有该阻燃树脂组合物的多层布线板。根据本发明的示例性实施方案的用于多层布线板的阻燃树脂组合物包括包含萘改性环氧树脂，甲酚酚醛环氧树脂，橡胶改性环氧树脂和磷基环氧树脂的复合环氧树脂，以及由特定化学式表示的阻燃剂。用于多层布线板的阻燃树脂组合物和其中所公开的多层布线板具有优异的阻燃性，耐湿性和剥离强度。

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