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    • 3. 发明申请
    • Method for manufacturing printed circuit board
    • 印刷电路板制造方法
    • US20080012168A1
    • 2008-01-17
    • US11826007
    • 2007-07-11
    • Senug-Hyun RaMyeong-Ho HongHyuk-Soo LeeChoon-Keun LeeSang-Moon LeeJae-Choon ChoJung-Woo LeeJeong-Bok Kwak
    • Senug-Hyun RaMyeong-Ho HongHyuk-Soo LeeChoon-Keun LeeSang-Moon LeeJae-Choon ChoJung-Woo LeeJeong-Bok Kwak
    • B29C43/20
    • B29C43/021B29C33/303B29C2043/025H05K3/0014H05K3/005H05K3/107H05K2203/0108H05K2203/167
    • A method for manufacturing printed circuit board is disclosed. With a method for manufacturing a printed circuit board which includes: (a) stacking an insulation substrate, in which a first align hole is perforated, onto a support plate, to one side of which a guide pin is joined, such that the guide pin is inserted into the first align hole, where the first align hole is formed in correspondence with the guide pin, (b) stacking an imprinting mold, in which a second align hole is perforated, onto the support plate, such that the guide pin is inserted into the second hole formed in correspondence with the guide pin, and (c) stacking and pressing a pressing plate onto the support plate, and compressing the insulation substrate and the imprinting mold together, where an intaglio pattern is formed in a surface of the insulation substrate facing the imprinting mold, in correspondence with a circuit pattern, and a raised pattern is formed in a surface of the imprinting mold facing the insulation substrate, in correspondence with the circuit pattern, the installation of expensive aligning equipment is unnecessary in aligning an imprinting mold and an insulation substrate, and it is possible to form the intaglio patterns by imprinting on several insulation substrates at the same time by collectively stacking the several imprinting molds and the insulation substrates and compressing, and to prevent defects caused by the expansion and contraction of the insulation substrate which occur during the forming of the intaglio patterns.
    • 公开了印刷电路板的制造方法。 一种用于制造印刷电路板的方法,包括:(a)将其中穿过第一对准孔的绝缘基板堆叠在支撑板上,导向销的一侧被连接到导向销 插入到第一对准孔中,其中第一对准孔对应于引导销形成,(b)将其中穿过第二对准孔的压印模具堆叠到支撑板上,使得引导销 插入到与引导销对应形成的第二孔中,(c)将压板堆叠并按压到支撑板上,并将绝缘基板和压印模压在一起,在该表面上形成凹版图案 绝缘基板面对压印模具,与电路图形对应,并且凸起图案形成在压印模具的面对绝缘基板的表面中,与电路图案对应, 在对准压印模具和绝缘基板时不需要安装昂贵的对准设备,并且可以通过将多个压印模具和绝缘基板共同堆叠同时压印在几个绝缘基板上来形成凹版图案, 并且防止在形成凹版图案期间发生的绝缘基板的膨胀和收缩引起的缺陷。
    • 10. 发明授权
    • Flash memory apparatus having single body type rotary cover
    • 具有单体型旋转盖的闪存装置
    • US06926544B2
    • 2005-08-09
    • US10346105
    • 2003-01-17
    • Jung-Woo Lee
    • Jung-Woo Lee
    • B65D43/16B65D55/16G06F3/06G06F12/00G06F13/40G06K19/00G06K19/077G11C29/00H01R13/44H01R13/447H01R13/52H05K5/02H05K7/16
    • H01R13/447H01R13/5213H05K5/0278
    • A flash memory apparatus having a single body type rotary cover, wherein a cover is not completely separated from a main body so that loss of the cover is prevented. The flash memory apparatus includes: a flash memory main body including a rectangular shaped case within which a memory element is mounted. A USB terminal piece is electrically connected with the memory element and is installed at a front end of the case to project therefrom and a hinge protuberance formed on at least one side of the case. A cover defined by a pair of parallel plate members facing each other with an interval corresponding to the thickness of the case is provided. The cover has an open front end and a closed rear end. Both lateral ends of the cover are open. The parallel plate members have a pair of hinge holes joined to the hinge protuberance, so that the cover is rotatable with respect to the flash memory main body, whereby the USB terminal piece is either received in an inner space of the cover or rotated for exposure to the outside of the cover.
    • 一种具有单体型旋转盖的闪存装置,其中盖子与主体不完全分离,从而防止了盖子的损失。 闪速存储装置包括:闪存主体,包括其中安装有存储元件的矩形壳体。 USB端子片与存储元件电连接并且安装在壳体的前端以从其突出并且形成在壳体的至少一侧上的铰链突起。 提供由一对平行板构件限定的盖子,该平板板构件面对彼此具有对应于壳体厚度的间隔。 盖子有一个敞开的前端和一个封闭的后端。 盖子的两个侧端均打开。 平行板构件具有连接到铰链突起的一对铰链孔,使得盖可相对于闪存主体旋转,由此USB端子件被接收在盖的内部空间中或旋转以进行曝光 到外面的封面。