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    • 2. 发明授权
    • Silicon carbide: germanium (SiC:Ge) heterojunction bipolar transistor; a new semiconductor transistor for high-speed, high-power applications
    • 碳化硅:锗(SiC:Ge)异质结双极晶体管; 一种用于高速,大功率应用的新型半导体晶体管
    • US06410396B1
    • 2002-06-25
    • US09825065
    • 2001-04-04
    • Jeffrey B. CasadyMichael S. MazzolaStephen E. Saddow
    • Jeffrey B. CasadyMichael S. MazzolaStephen E. Saddow
    • H01L21331
    • H01L29/7378H01L29/1608Y10S438/931
    • Devices and methods for fabricating wholly silicon carbide heterojunction bipolar transistors (HBTs) using germanium base doping to produce suitable emitter/base heterojunctions. In one variation, all device layers are are grown epitaxially and the heterojunction is created by introducing a pseudoalloying material, such as germanium, to form a graded implant. In other variations, the device epitaxial layers are 1) grown directly onto a semi-insulating substrate, 2) the semi-insulating epitaxial layer is grown onto a conducting substrate; 3) the subcollector is grown on a lightly doped p-type epitaxial layer grown on a conducting substrate; and 4) the subcollector is grown directly on a conducting substrate. Another variation comprises a multi-finger HBT with bridging conductor connections among emitter fingers. Yet another variation includes growth of layers using dopants other than nitrogent or aluminum. Yet another variation includes implantation of region within one or more epitaxial layers, rather than use of separate epitaxial layers.
    • 使用锗基掺杂制造完全碳化硅异质结双极晶体管(HBT)以产生合适的发射极/基极异质结的装置和方法。 在一个变型中,外延生长所有器件层,并且通过引入诸如锗的假合金化材料来形成异质结,以形成渐变植入物。 在其他变型中,器件外延层1)直接生长到半绝缘衬底上,2)半导体绝缘外延层生长在导电衬底上; 3)子集电极在生长在导电衬底上的轻掺杂p型外延层上生长; 和4)子集电极直接在导电衬底上生长。 另一变型包括在发射器指状物之间具有桥接导体连接的多指HBT。 另一种变化包括使用除了nit或铝之外的掺杂剂的层的生长。 又一变型包括在一个或多个外延层内注入区域,而不是使用单独的外延层。
    • 8. 发明申请
    • CUBIC SILICON CARBIDE IMPLANTABLE NEURAL PROSTHETIC
    • CUBIC碳化硅可植入神经元
    • US20120232631A1
    • 2012-09-13
    • US13479631
    • 2012-05-24
    • Christopher Leroy FrewinStephen E. SaddowEdwin Weeber
    • Christopher Leroy FrewinStephen E. SaddowEdwin Weeber
    • A61N1/05H01R43/00
    • A61N1/0529A61B5/04001C23C16/325Y10T29/49194
    • An implantable neuronal prosthetic and method of manufacture thereof includes at least one elongated electrode shank adapted for arrangement in the brain having at least one electrode contact disposed on its surface and arranged to electrically couple with said brain. The at least one elongated electrode shank is formed form a single crystal cubic silicon carbide. An insulation layer of amorphous, polycrystalline, or single crystal silicon carbide is disposed over the elongated electrode shank; the insulation layer of amorphous, polycrystalline, or single crystal silicon carbide is removed from the at least one electrode contact. Signal control electronics are attached to the at least one elongated electrode shank and are in electrical communication with the at least one electrode contact. In an embodiment, a plurality of the at least one elongated electrode shanks are arranged into a matrix.
    • 可植入神经元假体及其制造方法包括至少一个适于安排在脑中的细长电极柄,其具有设置在其表面上的至少一个电极接触件并布置成与所述大脑电耦合。 至少一个细长电极柄由单晶立方碳化硅形成。 非晶,多晶或单晶碳化硅的绝缘层设置在细长电极柄上; 从至少一个电极接触件去除非晶,多晶或单晶碳化硅的绝缘层。 信号控制电子装置连接到至少一个细长的电极柄并且与至少一个电极接触件电连通。 在一个实施例中,多个所述至少一个细长电极柄被布置成矩阵。
    • 10. 发明授权
    • Monolithic microwave integrated circuit terminal protection device
    • 单片微波集成电路端子保护装置
    • US4891730A
    • 1990-01-02
    • US351114
    • 1989-05-10
    • Stephen E. SaddowRobert V. GarverRoger Kaul
    • Stephen E. SaddowRobert V. GarverRoger Kaul
    • H01L23/20H01T4/08
    • H01T4/08H01L23/20H01L2224/49171H01L2924/1423H01L2924/3011
    • A monolithic microwave integrated circuit is enclosed within an ionizable gas filled housing having a terminal protection device integral with the circuit's substrate. A photon generating region extends within the substrate and along a portion of the surface area of the substrate for facilitating the ionizing of the gas. First and second electrodes, in contact with the substrate surface area and disposed on opposite sides of the photon generating region, have a plurality of cantilevered protrusions extending over the surface of the substrate and equally spaced from one another forming spark-gaps therebetween. One electrode is connected to an input to the device while the other is connected to ground. When a potential difference between the first and second electrodes increases towards a predetermined value, due to high RF input energy, the photon generating region is operatively biased to emit photons, which ionize the gas, resulting in a voltage discharge across the spark-gaps to occur quickly and at a lower voltage than the semiconductor breakdown voltage.
    • 单片微波集成电路封装在具有与电路基板一体的端子保护装置的可电离气体填充的壳体内。 光子产生区域在衬底内并且沿着衬底的表面区域的一部分延伸,以便于气体的电离。 第一和第二电极与衬底表面区域接触并且设置在光子产生区域的相对侧上,具有在衬底的表面上延伸的多个悬臂突出部,并且彼此间隔开,在它们之间形成火花隙。 一个电极连接到设备的输入,而另一个连接到地。 当第一和第二电极之间的电势差向预定值增加时,由于高的RF输入能量,光子产生区被可操作地偏置以发射光子,这使得气体离子化,从而导致跨火花隙的电压放电 发生在比半导体击穿电压低的电压下。