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    • 2. 发明授权
    • Semiconductor light-emitting device
    • 半导体发光装置
    • US09362446B2
    • 2016-06-07
    • US14414384
    • 2013-07-26
    • Sang Jeong An
    • Sang Jeong An
    • H01L33/00H01L33/38H01L33/62H01L33/06H01L33/32H01L25/075
    • H01L33/0025H01L25/0753H01L33/0079H01L33/06H01L33/32H01L33/382H01L33/62H01L2224/48091H01L2924/00014
    • The present disclosure relates to a semiconductor light emitting device, comprising: a supporting substrate having a first surface and a second surface opposite to the first surface; at least one semiconductor stack formed on the first surface, wherein each stack includes a plurality of semiconductor layers grown sequentially using a growth substrate and composed of a first semiconductor layer, a second semiconductor layer, and an active layer generating light via electron-hole recombination, and wherein a growth substrate-removed surface is formed on the side of the first semiconductor layer; a bonded layer, which bonds the second semiconductor layer side of the plurality of semiconductor layers to the first surface side of the supporting substrate; and a bonded layer-removed surface formed on the first surface, being open towards the plurality of semiconductor layer to supply current thereto.
    • 本公开涉及一种半导体发光器件,包括:支撑衬底,具有第一表面和与第一表面相对的第二表面; 形成在第一表面上的至少一个半导体堆叠,其中每个堆叠包括使用生长衬底顺序生长并由第一半导体层,第二半导体层和通过电子 - 空穴复合产生光的有源层组成的多个半导体层 并且其中在所述第一半导体层的侧面上形成生长衬底去除表面; 键合层,其将多个半导体层的第二半导体层侧粘合到支撑基板的第一表面侧; 以及形成在所述第一表面上的接合层去除表面,朝向所述多个半导体层开放以向其提供电流。
    • 3. 发明申请
    • SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体发光器件及其制造方法
    • US20150187993A1
    • 2015-07-02
    • US14406906
    • 2013-06-14
    • Sang Jeong AN
    • Sang Jeong An
    • H01L33/32H01L33/38H01L33/00
    • H01L33/0079H01L33/007H01L33/0075H01L33/06H01L33/32H01L33/382H01L33/385H01L33/62H01L2224/16H01L2933/0016H01L2933/0033
    • The disclosed invention relates to a semiconductor light-emitting element comprising: a plurality of semiconductor layers which are provided with a growth substrate eliminating surface on the side where a first semiconductor layer is located; a support substrate which is provided with a first electrical pathway and a second electrical pathway; a joining layer which joins a first surface side of the support substrate with a second semiconductor layer side of the plurality of semiconductor layers, and is electrically linked with the first electrical pathway; a joining layer eliminating surface which is formed on the first surface, and in which the second electrical pathway is exposed, and which is open towards the plurality of semiconductor layers; and an electrical link for electrically linking the plurality of semiconductor layers with the second electrical pathway exposed in the joining layer eliminating surface.
    • 所公开的发明涉及一种半导体发光元件,包括:多个半导体层,其在第一半导体层所在的一侧设置有生长衬底消除表面; 支撑基板,其设置有第一电路和第二电路; 接合层,其将所述支撑基板的第一表面侧与所述多个半导体层的第二半导体层侧接合,并与所述第一电路电气连接; 形成在所述第一表面上并且所述第二电通路暴露的并且朝向所述多个半导体层开口的接合层消除表面; 以及用于将多个半导体层与暴露在接合层消除表面中的第二电路电连接的电连接。
    • 8. 发明申请
    • SEMICONDUCTOR LIGHT-EMITTING DEVICE
    • 半导体发光器件
    • US20150144870A1
    • 2015-05-28
    • US14414384
    • 2013-07-26
    • Sang Jeong AN
    • Sang Jeong An
    • H01L33/00H01L33/62H01L33/38H01L33/06H01L33/32
    • H01L33/0025H01L25/0753H01L33/0079H01L33/06H01L33/32H01L33/382H01L33/62H01L2224/48091H01L2924/00014
    • The present disclosure relates to a semiconductor light emitting device, comprising: a supporting substrate having a first surface and a second surface opposite to the first surface; at least one semiconductor stack formed on the first surface, wherein each stack includes a plurality of semiconductor layers grown sequentially using a growth substrate and composed of a first semiconductor layer, a second semiconductor layer, and an active layer generating light via electron-hole recombination, and wherein a growth substrate-removed surface is formed on the side of the first semiconductor layer; a bonded layer, which bonds the second semiconductor layer side of the plurality of semiconductor layers to the first surface side of the supporting substrate; and a bonded layer-removed surface formed on the first surface, being open towards the plurality of semiconductor layer to supply current thereto.
    • 本公开涉及一种半导体发光器件,包括:支撑衬底,具有第一表面和与第一表面相对的第二表面; 形成在第一表面上的至少一个半导体堆叠,其中每个堆叠包括使用生长衬底顺序生长并由第一半导体层,第二半导体层和通过电子 - 空穴复合产生光的有源层组成的多个半导体层 并且其中在所述第一半导体层的侧面上形成生长衬底去除表面; 键合层,其将多个半导体层的第二半导体层侧粘合到支撑基板的第一表面侧; 以及形成在所述第一表面上的接合层去除表面,朝向所述多个半导体层开放以向其提供电流。