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    • 3. 发明授权
    • Bonding method
    • 粘合方法
    • US5040293A
    • 1991-08-20
    • US523398
    • 1990-05-14
    • Nobuto YamazakiAkihiro Nishimura
    • Nobuto YamazakiAkihiro Nishimura
    • H01L21/60H01L21/00
    • H01L21/67138Y10T29/49121Y10T29/49131Y10T29/49149
    • A bonding method for bonding inner leads on a film to electrodes of semiconductor elements is performed by the steps of: individually positioning the film and semiconductor elements at a predetermined bonding position; individually recognizing the positions of the inner leads and electrodes; selecting a combination of one inner lead and one electrode which are positionally shifted relative to each other; correcting relative position of the inner lead and electrode which are positionally shifted so that the inner lead and electrode are aligned; the inner lead and electrode are bonded; relative positions of remaining inner leads and elctrodes are aligned; and the inner leads and elctrodes are individually connected by bonding.
    • 通过以下步骤进行将膜上的内引线与半导体元件的电极接合的接合方法:将膜和半导体元件分别定位在预定的接合位置; 分别识别内部引线和电极的位置; 选择相对于彼此位置偏移的一个内引线和一个电极的组合; 校正位置偏移的内部引线和电极的相对位置,使得内部引线和电极对齐; 内引线和电极接合; 剩余内引线和电极的相对位置对齐; 并且内引线和电极通过接合单独连接。
    • 5. 发明授权
    • Inner lead bonder
    • 内部引线键合机
    • US4526646A
    • 1985-07-02
    • US558207
    • 1983-12-05
    • Yasunobu SuzukiSeiichi ChibaAkihiro Nishimura
    • Yasunobu SuzukiSeiichi ChibaAkihiro Nishimura
    • H01L21/60H01L21/00B65G25/00B23P19/00B32B31/00B44C1/00
    • H01L21/67138Y10T156/171Y10T156/1771Y10T29/53178
    • An inner lead bonder for bonding dies to leads of carrier tape with improved positional accuracy and improved work efficiency. In the inner lead bonder, dies are fed to a die positioning spot one at a time and positioned. Then, said positioned die is carried to a bonding position. On the other hand, leads of a carrier tape are fed to the bonding position and positioned at the spot above the aforesaid die. Thereafter, the leads of the carrier tape are pressed onto the die and bonded by using a bonding tool. This inner lead bonder is characterized in that it includes a rotary table with the size covering the die positioning point and the bonding position, and after positioning the die on the rotary table, the rotary table is rotated in order to bring the die positioned as mentioned above to the bonding position to place the die at a proper position for bonding.
    • 一种用于将模具接合到载带的引线的内引线接合器,具有改进的位置精度和提高的工作效率。 在内引线焊接机中,将模具一次一个地送入模具定位点并定位。 然后,将所述定位的模具运送到结合位置。 另一方面,载带的引线被馈送到接合位置并且位于上述模具上方的位置处。 此后,将载带的引线按压到模具上并通过使用接合工具粘接。 该内引线接合机的特征在于,其包括具有覆盖芯片定位点和接合位置的尺寸的旋转台,并且在将模具定位在旋转台上之后,旋转台旋转以使模具定位成如上所述 上方到结合位置以将模具放置在用于结合的适当位置。
    • 6. 发明授权
    • Fungicidal composition and method for controlling plant diseases
    • 防治植物病害的防治成分及方法
    • US08962661B2
    • 2015-02-24
    • US13002361
    • 2009-06-30
    • Munekazu OgawaAkihiro Nishimura
    • Munekazu OgawaAkihiro Nishimura
    • A01N43/40A01N43/653
    • A01N43/40A01N37/48A01N43/42A01N43/56A01N43/653A01N43/78A01N43/90A01N47/12A01N47/24A01N59/02A01N37/06A01N47/14A01N2300/00
    • To provide a fungicidal composition having stable and high fungicidal effects against cultivated crops infected with plant diseases resulting from plant diseases.A fungicidal composition containing, as active ingredients, (a) a benzoylpyridine derivative represented by the formula (I) or its salt: wherein when A is —N═, B is —CX4═; when A is —CH═, B is —N═; each of X1 and X2 which are independent of each other, is a halogen atom, an alkoxy group, a hydroxyl group, an alkyl group, a CF3 group or an alkylthio group; X3 is a hydrogen atom, a halogen atom, an alkoxy group, an alkyl group, a CF3 group or an alkylthio group; X4 is a hydrogen atom, a halogen atom, an alkoxy group, an alkyl group, a CF3 group or an alkylthio group; R1 is an alkyl group; R2′ is an alkoxy group; p is 0, 1 or 2; and each of R2″ and R2′″ is an alkoxy group, and (b) at least one additional fungicide.
    • 提供对由植物病害引起的植物病害感染的栽培作物具有稳定和高杀真菌作用的杀真菌组合物。 一种杀真菌组合物,其含有(a)由式(I)表示的苯甲酰基吡啶衍生物或其盐作为活性成分:其中当A为-N =,B为-CX4 = 当A为-CH =时,B为-N =; X 1和X 2各自独立地为卤素原子,烷氧基,羟基,烷基,CF 3基或烷硫基; X 3为氢原子,卤素原子,烷氧基,烷基,CF 3基或烷硫基; X 4为氢原子,卤素原子,烷氧基,烷基,CF 3基或烷硫基; R1是烷基; R2'是烷氧基; p为0,1或2; 并且R2“和R2”“各自为烷氧基,和(b)至少一种另外的杀真菌剂。