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    • 3. 发明申请
    • METHODS OF FABRICATING AN IMAGE SENSOR
    • 制作图像传感器的方法
    • US20070054434A1
    • 2007-03-08
    • US11464244
    • 2006-08-14
    • Won-Je ParkJae-Ho SongYoung-Hoon Park
    • Won-Je ParkJae-Ho SongYoung-Hoon Park
    • H01L21/00
    • H01L27/14683H01L27/14603H01L27/14643
    • Provided are methods of fabricating an image sensor. Embodiments of such methods can include forming a first gate insulation layer in a first region of a semiconductor substrate and a first gate electrode layer, to cover the first gate insulation layer and forming a second gate insulation layer within a nitrogen enhanced atmosphere and a second gate electrode layer in a second region of the semiconductor substrate. The methods also include patterning the first gate electrode layer and the first gate insulation layer of the first region to form a first gate pattern and patterning the second gate electrode layer and the second gate insulation layer of the second region to form a second gate pattern.
    • 提供制造图像传感器的方法。 这种方法的实施例可以包括在半导体衬底的第一区域和第一栅极电极层中形成第一栅极绝缘层,以覆盖第一栅极绝缘层并在氮气增强气氛中形成第二栅极绝缘层和第二栅极 在半导体衬底的第二区域中的电极层。 所述方法还包括图案化第一区域的第一栅极电极层和第一栅极绝缘层以形成第一栅极图案,并且使第二栅极电极层和第二栅极绝缘层图案化以形成第二栅极图案。
    • 7. 发明授权
    • Methods of fabricating an image sensor
    • 制作图像传感器的方法
    • US07462520B2
    • 2008-12-09
    • US11464244
    • 2006-08-14
    • Won-Je ParkJae-Ho SongYoung-Hoon Park
    • Won-Je ParkJae-Ho SongYoung-Hoon Park
    • H01L27/146
    • H01L27/14683H01L27/14603H01L27/14643
    • Provided are methods of fabricating an image sensor. Embodiments of such methods can include forming a first gate insulation layer in a first region of a semiconductor substrate and a first gate electrode layer, to cover the first gate insulation layer and forming a second gate insulation layer within a nitrogen enhanced atmosphere and a second gate electrode layer in a second region of the semiconductor substrate. The methods also include patterning the first gate electrode layer and the first gate insulation layer of the first region to form a first gate pattern and patterning the second gate electrode layer and the second gate insulation layer of the second region to form a second gate pattern.
    • 提供制造图像传感器的方法。 这种方法的实施例可以包括在半导体衬底的第一区域和第一栅极电极层中形成第一栅极绝缘层,以覆盖第一栅极绝缘层并在氮气增强气氛中形成第二栅极绝缘层和第二栅极 在半导体衬底的第二区域中的电极层。 所述方法还包括图案化第一区域的第一栅极电极层和第一栅极绝缘层以形成第一栅极图案,并且使第二栅极电极层和第二栅极绝缘层图案化以形成第二栅极图案。
    • 9. 发明申请
    • CMOS IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
    • CMOS图像传感器及其制造方法
    • US20090239327A1
    • 2009-09-24
    • US12478258
    • 2009-06-04
    • Tae-Seok OhJae-Ho SongJung-Ho Park
    • Tae-Seok OhJae-Ho SongJung-Ho Park
    • H01L21/77
    • H01L27/14689H01L27/14609H01L27/14643
    • In a CMOS image sensor and method of fabricating the same, the CMOS image sensor is comprised of a pixel array generating image signals and a peripheral circuit processing the image signals. In the method, a substrate is provided having a pixel region and a peripheral circuit region. A photo-receiving element and at least one transistor are formed on the pixel region of the substrate and a transistor is formed on the peripheral circuit region of the substrate. A silicide barrier pattern is formed to cover a region where the photo-receiving element is formed. A silicide layer is formed on a predetermined region of the substrate. An interlevel insulation film is formed on the silicide barrier layer. At least one contact hole penetrating the interlevel insulation film is formed, the at least one contact hole exposing a predetermined region of the silicide layer. This is effective to prevent a problem such as an excessive etching due to disagreement of the etch target films between the pixel array and the peripheral circuit.
    • 在CMOS图像传感器及其制造方法中,CMOS图像传感器由产生图像信号的像素阵列和处理图像信号的外围电路组成。 在该方法中,提供具有像素区域和外围电路区域的基板。 在基板的像素区域上形成光接收元件和至少一个晶体管,并且在基板的外围电路区域上形成晶体管。 形成硅化物屏障图形以覆盖形成光接收元件的区域。 在基板的预定区域上形成硅化物层。 在硅化物阻挡层上形成层间绝缘膜。 形成贯穿层间绝缘膜的至少一个接触孔,该至少一个接触孔露出硅化物层的预定区域。 这是有效的,以防止由于像素阵列和外围电路之间的蚀刻目标膜的不一致而导致的过度蚀刻等问题。
    • 10. 发明申请
    • CMOS image sensor and method of fabricating the same
    • CMOS图像传感器及其制造方法
    • US20070023802A1
    • 2007-02-01
    • US11493146
    • 2006-07-26
    • Tae-Seok OhJae-Ho SongJung-Ho Park
    • Tae-Seok OhJae-Ho SongJung-Ho Park
    • H01L31/113H01L31/062
    • H01L27/14689H01L27/14609H01L27/14643
    • In a CMOS image sensor and method of fabricating the same, the CMOS image sensor is comprised of a pixel array generating image signals and a peripheral circuit processing the image signals. In the method, a substrate is provided having a pixel region and a peripheral circuit region. A photo-receiving element and at least one transistor are formed on the pixel region of the substrate and a transistor is formed on the peripheral circuit region of the substrate. A silicide barrier pattern is formed to cover a region where the photo-receiving element is formed. A silicide layer is formed on a predetermined region of the substrate. An interlevel insulation film is formed on the silicide barrier layer. At least one contact hole penetrating the interlevel insulation film is formed, the at least one contact hole exposing a predetermined region of the silicide layer. This is effective to prevent a problem such as an excessive etching due to disagreement of the etch target films between the pixel array and the peripheral circuit.
    • 在CMOS图像传感器及其制造方法中,CMOS图像传感器由产生图像信号的像素阵列和处理图像信号的外围电路组成。 在该方法中,提供具有像素区域和外围电路区域的基板。 在基板的像素区域上形成光接收元件和至少一个晶体管,并且在基板的外围电路区域上形成晶体管。 形成硅化物屏障图形以覆盖形成光接收元件的区域。 在基板的预定区域上形成硅化物层。 在硅化物阻挡层上形成层间绝缘膜。 形成贯穿层间绝缘膜的至少一个接触孔,该至少一个接触孔露出硅化物层的预定区域。 这是有效的,以防止由于像素阵列和外围电路之间的蚀刻目标膜的不一致而导致的过度蚀刻等问题。