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    • 7. 发明申请
    • ELECTRONIC SEMICONDUCTOR CIRCUIT WHICH INCLUDES A TUNNEL DIODE
    • 电子半导体电路,其中包括隧道二极管
    • WO01067458A1
    • 2001-09-13
    • PCT/US2001/006753
    • 2001-03-02
    • G11C11/38G11C11/412H01L21/8244H01L27/11G11C11/00G11C7/00G11C11/34
    • H01L27/11G11C11/38G11C11/412H01L27/1104
    • A static RAM memory cell (30) uses cross-coupled enhancement mode, N-channel MOD drive transistors (36) to form a bistable flip-flop. A load circuit (34) couples between I/O ports (40) of the drive transistors (36) and Vcc. For each drive transistor (36), the load circuit includes a depletion mode, N-channel MOS load transistor (54) and a forward biased tunnel diode (32). The drain and gate of the load transistor (54) couple across the anode and cathode of the tunnel diode (32) so that the forward voltage (Vf) of the tunnel diode (32) controls the Vgs transfer curve (56) of the load transistor. The tunnel diode (32) may be formed at a junction between a mono-crystalline silicon layer (88) at a region (98, 100) which also serves as a source or drain of a transistor (36, 54) and a poly-crystalline silicon layer (106). The poly-crystalline silicon layer (106) also serves as a non-metallic, conductive interconnection (55) to save space.
    • 静态RAM存储单元(30)使用交叉耦合增强模式,N沟道MOD驱动晶体管(36)形成双稳态触发器。 负载电路(34)耦合在驱动晶体管(36)和Vcc的I / O端口(40)之间。 对于每个驱动晶体管(36),负载电路包括耗尽模式N沟道MOS负载晶体管(54)和正向偏置隧道二极管(32)。 负载晶体管(54)的漏极和栅极耦合在隧道二极管(32)的阳极和阴极之间,使得隧道二极管(32)的正向电压(Vf)控制负载的Vgs转移曲线(56) 晶体管。 隧道二极管(32)可以形成在也用作晶体管(36,54)的源极或漏极的区域(98,100)处的单晶硅层(88)之间的结处, 晶体硅层(106)。 多晶硅层(106)还用作非金属导电互连(55)以节​​省空间。
    • 10. 发明公开
    • Two state memory cell
    • 与两个开关状态的存储器单元。
    • EP0068164A2
    • 1983-01-05
    • EP82104821.2
    • 1982-06-02
    • International Business Machines Corporation
    • Malaviya, Shashi Dhar
    • G11C11/38
    • G11C11/38
    • A two state memory cell includes a bipolar transistor (11) and a tunnel diode (16) shunted across the base-collector junction thereof. A constant operating current is established through the transistor (11) and the tunnel diode (16). The voltage across the tunnel diode (16) may thus be maintained at one of two stable levels, while the bipolar transistor (11) is kept on regardless of the tunnel diode voltage, which determines the ZERO or ONE state of the cell.
      Since the transistor (11) is not switched on and off when the memory state (corresponding to the two tunnel diode voltage levels) changes, memory cell switching speed is not degraded by transistor switching delay. Moreover, since the current in the tunnel diode (16) is maintained constant, preferably at a value midway between the tunnel diode peak and valley currents, the noise margin of the memory cell is enhanced and the possibility of false switching reduced. The tunnel diode/bipolar transistor combination may be formed on a semiconductor substrate as an integrated structure, thereby providing a high density memory cell.