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2. 发明公开

EP3271951A4 TRANSFERRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPARATUS OF MICRO-LED 审中-公开
公开(公告)号：EP3271951A4
公开(公告)日：2018-02-21
申请号：EP15892224
申请日：2015-05-21
申请人： GOERTEK INC
发明人： ZOU QUANBO , WANG ZHE
IPC分类号： H01L33/00
CPC分类号： H01L33/0079 , H01L21/67144 , H01L21/6835 , H01L24/00 , H01L25/0753 , H01L33/38 , H01L33/44 , H01L33/52 , H01L33/62 , H01L2221/68368 , H01L2221/68381 , H01L2933/0016 , H01L2933/0025 , H01L2933/0033 , H01L2933/005 , H01L2933/0066
摘要： A transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED (402) are disclosed. The method for transferring micro-LED (402) comprises: transferring at least one micro-LED (402) from an original substrate (406) to a support body (412); transferring the at least one micro-LED (402) from the support body (412) to a backup substrate (415); and transferring the at least one micro-LED (402) from the backup substrate (415) to a receiving substrate (417).

3. 发明公开

EP3276652A2 VERFAHREN ZUM HERSTELLEN EINER SUBSTRATANORDNUNG MIT EINEM KLEBEVORFIXIERMITTEL, ENTSPRECHENDE SUBSTRATANORDNUNG, VERFAHREN ZUM VERBINDEN EINES ELEKTRONIKBAUTEILS MIT EINER SUBSTRATANORDNUNG MIT ANWENDUNG EINES AUF DEM ELEKTRONIKBAUTEIL UND/ODER DER SUBSTRATANORDNUNG AUFGEBRACHTEN KLEBEVORFIXIERMITTELS UND MIT EINER SUBSTRATANORDNUNG VERBUNDENES ELEKTRONIKBAUTEIL 审中-公开
公开(公告)号：EP3276652A2
公开(公告)日：2018-01-31
申请号：EP17182111.9
申请日：2016-03-23
申请人： Heraeus Deutschland GmbH & Co. KG
发明人： Schäfer, Michael , Schmitt, Wolfgang , Hinrich, Andreas , Barrera-Marin, Isabel
IPC分类号： H01L21/58 , H01L21/60 , H01L23/373 , H01L23/495 , H01L23/498 , H05K3/32 , H05K3/34 , H01L21/683
CPC分类号： H01L24/83 , H01L21/6836 , H01L23/3735 , H01L23/49513 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/95 , H01L24/97 , H01L2221/68368 , H01L2224/27312 , H01L2224/2732 , H01L2224/27334 , H01L2224/27418 , H01L2224/27848 , H01L2224/29007 , H01L2224/291 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29339 , H01L2224/32014 , H01L2224/32227 , H01L2224/32245 , H01L2224/75272 , H01L2224/75745 , H01L2224/83001 , H01L2224/83007 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83201 , H01L2224/8321 , H01L2224/83815 , H01L2224/8384 , H01L2224/83907 , H01L2224/95 , H01L2224/97 , H05K3/303 , H05K3/32 , H05K3/34 , H05K2203/1131 , H01L2924/00014 , H01L2924/014 , H01L2924/0781 , H01L2924/00012 , H01L2224/83
摘要： Die Erfindung betrifft ein Verfahren zum Herstellen einer Substratanordnung (10, 10') zur Verbindung mit einem Elektronikbauteil (50; 51), umfassend die Schritte:
- Bereitstellen eines Substrates (20), insbesondere eines DCB-Substrats, eines PCB-Substrats oder eines Leadframes, mit einer ersten Seite (22) und einer zweiten Seite (23),
- abschnittsweises Aufbringen eines Vorfixiermittels (30) auf die erste Seite (22) des Substrates (20),
wobei das Vorfixiermittel (30) ein Klebemittel ist, das 20 - 45 Gew.-% thermoplastisches Polymer, 40 - 70 Gew.-% organisches Lösemittel, 10 - 25 Gew.-% anorganische Füllstoffpartikel und 0 - 0,5 Gew.-% weitere Additive aufweist.
Die Erfindung betrifft auch eine entsprechende Substratanordnung (10, 10') sowie ein entsprechendes Verfahren zum Verbinden (Versintern, Verlöten, Verpressen) eines Elektronikbauteils (50, 51) mit der Substratanordnung (10, 10').
Durch die erfindungsgemäßen Maßnahmen wird beim Transport vom Ort des Bestückens der Substratanordnung (10, 10') mit dem Elektronikbauteil (50, 51') zum Ort des Verbindens eine ausreichende Transportfestigkeit erzeugt.
Das Vorfixiermittel (30) kann auch alternativ oder zusätzlich auf die erste Seite (52) des Elektronikbauteils (50, 51) abschnittsweise aufgebracht werden.
Auf die Substratanordnung (10, 10') und/oder auf das Elektronikbauteil (50, 51) kann vor dem Aufbringen des Vorfixiermittels (30) ein Kontaktierungsmaterial (25) aufgebracht werden. Das Vorfixiermittel (30) kann zumindest abschnittsweise seitlich des Kontaktierungsmaterials (25) aufgebracht werden, derart, dass das Vorfixiermittel (30) dicker als das Kontaktierungsmaterial (25) ist.
Das Vorfixiermittel (30) wird während des Verbindens oder nach dem Verbinden zumindest teilweise entfernt, insbesondere abgebrannt und/oder abgeschmolzen.
Nach dem Verbinden ist auf der ersten Seite (22) des Substrates (20) und/oder auf der dem Substrat (20) zugewandten ersten Seite (52) des Elektronikbauteils (50, 51) abschnittsweise ein Rest (31) des Vorfixiermittels (30), insbesondere die anorganischen Füllstoffpartikel, ausgebildet.

4. 发明授权

EP2565924B1 Transfer method 有权
标题翻译：转移方法
公开(公告)号：EP2565924B1
公开(公告)日：2018-01-10
申请号：EP12190201.9
申请日：2002-07-24
申请人： Samsung Electronics Co., Ltd.
发明人： Shimoda, Tatsuya , Utsunomiya, Sumio
IPC分类号： H01L27/11502 , H01L27/11517 , H01L27/11585 , H01L27/1159 , H01L21/683 , H01L27/12 , H01L27/00 , H01L21/52 , G02F1/133 , G09F9/00 , H01L27/118 , H01L27/13 , H05K3/04 , H01L27/11 , B82Y30/00 , B82Y10/00 , H01L27/108 , H01L21/336 , H01L27/112 , G02F1/136 , H01L51/56 , H01L27/32
CPC分类号： H01L27/1266 , B82Y10/00 , B82Y30/00 , G02F2001/13613 , H01L21/6835 , H01L21/6836 , H01L27/10844 , H01L27/11 , H01L27/11213 , H01L27/11502 , H01L27/11517 , H01L27/11585 , H01L27/1159 , H01L27/118 , H01L27/1214 , H01L27/13 , H01L27/3244 , H01L29/66757 , H01L29/66772 , H01L51/56 , H01L2221/68318 , H01L2221/68322 , H01L2221/6835 , H01L2221/68359 , H01L2221/68363 , H01L2221/68368 , H01L2221/68381 , H01L2224/95 , H01L2225/06562 , H05K3/046
摘要： A transfer method comprising a step of forming a plurality of transferred bodies on a transfer origin substrate, and a step of applying energy to partial regions corresponding to the transferred bodies to be transferred, and transferring these transferred bodies corresponding to the partial regions onto a transfer destination substrate. A plurality of transferred bodies such as devices or circuits that are to be disposed on a transfer destination substrate with spaces therebetween can be manufactured integrated together on a transfer origin substrate, and hence compared with the case that the transferred bodies are formed on the transfer destination substrate directly, the amount of materials used in the manufacture of the transferred bodies can be reduced, the area efficiency can be greatly improved, and a transfer destination substrate on which a large number of devices or circuits are disposed in scattered locations can be manufactured efficiently and cheaply.

5. 发明公开

EP3198679A2 COMPOUND MICRO-ASSEMBLY STRATEGIES AND DEVICES 审中-公开
标题翻译：复合微组装策略和装置
公开(公告)号：EP3198679A2
公开(公告)日：2017-08-02
申请号：EP15780778.5
申请日：2015-09-23
申请人： X-Celeprint Limited
发明人： BOWER, Christopher , MEITL, Matthew
IPC分类号： H01Q3/26 , G02F1/13 , H01L21/48 , H01L21/66 , H01L23/538 , H01L25/075 , G02F1/1345 , G02F1/136 , G09G3/32 , G09G3/00 , H01Q1/22 , H01Q21/00
CPC分类号： H01L25/50 , H01L21/485 , H01L21/6835 , H01L22/14 , H01L22/20 , H01L23/5382 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/82 , H01L25/0753 , H01L25/167 , H01L25/18 , H01L2221/68368 , H01L2221/68372 , H01L2221/68381 , H01L2224/24137 , H01Q1/2283 , H01Q3/267 , H01Q21/0087
摘要： The disclosed technology relates generally to designs and methods of assembling devices utilizing compound micro-assembly. Functional elements are micro-assembled to form an array of individual micro-systems on an intermediate substrate, then the microsystems are transferred (one or more at a time) to a destination or device substrate. For example, for a display device, each micro-system may be an individual pixel containing red, blue, and green micro LEDs and a silicon drive circuit. An array of pixels may be formed by micro-transfer printing functional elements onto the intermediate substrate and electrically connecting them via fine lithography, then the individual pixels may be micro-transfer printed onto the destination substrate.
摘要翻译：所公开的技术总体上涉及利用复合微组装的装置的设计和方法。功能元件被微组装以在中间衬底上形成单个微系统的阵列，然后将微系统（一次一个或多个）转移到目的地或器件衬底。例如，对于显示装置，每个微系统可以是包含红色，蓝色和绿色微型LED以及硅驱动电路的单个像素。可以通过将功能元件微印到中间基板上并通过精细光刻将它们电连接来形成像素阵列，然后可以将各个像素微转印到目标基板上。

6. 发明公开

EP2256807A3 Semiconductor device and its fabricating method 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：EP2256807A3
公开(公告)日：2017-05-17
申请号：EP10009803.7
申请日：2003-12-19
申请人： Semiconductor Energy Laboratory Co, Ltd.
发明人： Nishi, Kazuo , Takayama, Toru , Goto, Yuugo
IPC分类号： H01L27/12 , H01L21/84 , H01L21/336 , H01L29/786 , H01L21/20 , H01L27/146 , H01L29/66 , H01L27/144
CPC分类号： H01L27/1266 , H01L27/1214 , H01L27/1218 , H01L27/1222 , H01L27/1255 , H01L27/1446 , H01L29/66757 , H01L29/78675 , H01L2221/68368 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05548 , H01L2224/05569 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05669 , H01L2224/16225 , H01L2924/00014 , H01L2224/05599
摘要： The present invention is characterized by forming a metal film, an insulating film, and an amorphous semiconductor film in sequence over a first substrate; crystallizing the metal oxide film and the amorphous semiconductor film; forming a first semiconductor element by using the crystallized semiconductor film as an active region; attaching a support to the first semiconductor element by using an adhesive; causing separation between the metal film and the insulating film; attaching a second substrate to the separated insulating film; separating the support by removing the first adhesive; forming an amorphous semiconductor film over the first semiconductor element; and forming a second semiconductor element using the amorphous semiconductor film as an active region.
摘要翻译：本发明的特征在于：在第一基板上依次形成金属膜，绝缘膜和非晶半导体膜; 使金属氧化物膜和非晶半导体膜结晶化; 通过使用结晶的半导体膜作为有源区来形成第一半导体元件; 通过使用粘合剂将支撑件附接到第一半导体元件; 引起金属膜和绝缘膜之间的分离; 将第二衬底附接到分离的绝缘膜; 通过移除第一粘合剂来分离支撑件; 在第一半导体元件上形成非晶半导体膜; 以及使用该非晶半导体膜作为有源区来形成第二半导体元件。

7. 发明公开

EP3157858A1 SYSTEMS AND METHODS FOR CONTROLLING RELEASE OF TRANSFERABLE SEMICONDUCTOR STRUCTURES 审中-公开
标题翻译：控制可转移半导体结构释放的系统和方法
公开(公告)号：EP3157858A1
公开(公告)日：2017-04-26
申请号：EP15736210.4
申请日：2015-06-18
申请人： X-Celeprint Limited
发明人： BOWER, Christopher , MEITL, Matthew
IPC分类号： B81C99/00
CPC分类号： H01L21/7813 , B81C99/008 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L21/6836 , H01L24/83 , H01L2221/68368
摘要： The disclosed technology relates generally to methods and systems for controlling the release of micro devices. Prior to transferring micro devices to a destination substrate, a native substrate is formed with micro devices thereon. The micro devices can be distributed over the native substrate and spatially separated from each other by an anchor structure. The anchors are physically connected/secured to the native substrate. Tethers physically secure each micro device to one or more anchors, thereby suspending the micro device above the native substrate. In certain embodiments, single tether designs are used to control the relaxation of built-in stress in releasable structures on a substrate, such as Si (1 1 1). Single tether designs offer, among other things, the added benefit of easier break upon retrieval from native substrate in micro assembly processes. In certain embodiments, narrow tether designs are used to avoid pinning of the undercut etch front.
摘要翻译：所公开的技术总体上涉及用于控制微型器件的释放的方法和系统。在将微型器件转移到目标衬底之前，在其上形成具有微型器件的本地衬底。微器件可以分布在自然衬底上并且通过锚结构彼此在空间上分离。锚固物物理连接/固定在天然基底上。系绳物理地将每个微型装置固定到一个或多个锚定件，从而将微型装置悬挂在自然基板上方。在某些实施方案中，使用单系链设计来控制衬底上可释放结构（例如Si（111））中内建应力的松弛。除了别的以外，单系绳设计提供了在微组装过程中从原始基板取回时更容易断裂的附加益处。在某些实施例中，使用窄绳索设计来避免底切蚀刻前端的钉扎。

8. 发明公开

EP3036189A1 CARRIER-SUBSTRATE ADHESIVE SYSTEM 审中-公开
标题翻译：载体衬底保证金制度
公开(公告)号：EP3036189A1
公开(公告)日：2016-06-29
申请号：EP14838653.5
申请日：2014-08-15
申请人： Massachusetts Institute of Technology
发明人： FUCETOLA, Corey Patrick , SMITH, Henry Ignatius , FUCETOLA, Jay J.
IPC分类号： B82Y40/00 , B82B1/00 , B82B3/00
CPC分类号： B82Y10/00 , B32B2457/00 , B32B2551/00 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/68368 , H01L2221/68381
摘要： A system and method for creating three-dimensional nanostmctures is disclosed. The system includes a substrate bonded to a carrier using a bonding agent. The bonding agent may be vaporizable or sublimable. The carrier may be a glass or glass-like substance. In some embodiments, the carrier may be permeable having one or a plurality of pores through which the bonding agent may escape when converted to a gaseous state with heat, pressure, light or other methods. A substrate is bonded to the carrier using the bonding agent. The substrate is then processed to form a membrane. This processing may include grinding, polishing, etching, patterning, or other steps. The processed membrane is then aligned and affixed to a receiving substrate, or a previously deposited membrane.

9. 发明公开

EP2182553A3 Transfer method of functional region, led array, led printer head, and led printer 审中-公开
标题翻译：功能区，LED阵列的传送方法，LED打印机头和LED打印机
公开(公告)号：EP2182553A3
公开(公告)日：2015-12-02
申请号：EP09013628.4
申请日：2009-10-29
申请人： Canon Kabushiki Kaisha
发明人： Yonehara, Takao , Takai, Yasuyoshi
IPC分类号： H01L33/00 , B41J2/45 , H01L25/16 , H01L27/15
CPC分类号： H01L33/0079 , B41J2/45 , H01L21/6835 , H01L25/167 , H01L27/153 , H01L2221/68322 , H01L2221/68368 , H01L2924/0002 , H01L2924/00
摘要： A transfer method includes plural steps. A first bonding layer (205) is arranged on a first functional region (101) on a first substrate (100), or a region on a second substrate (200). The functional region (101) is bonded to the substrate (200) through the bonding layer (205). A first release layer (115a) is subjected to a first process to separate the substrate (100) from the functional region (101) at the release layer (115a). A second bonding layer (305) is arranged on a second functional region (102) on the substrate (100), or a region on a third substrate (300). The functional region (102) is bonded to the substrate (300) through the bonding layer (305). A second release layer (115b) is subjected to a second process to separate the substrate (100) from the functional region (102) at the release layer (115b).

10. 发明公开

EP2937896A1 PRINTABLE SEMICONDUCTOR STRUCTURES AND RELATED METHODS OF MAKING AND ASSEMBLING 审中-公开
标题翻译： PRINTABLE半导体结构及制造和组装相关方法
公开(公告)号：EP2937896A1
公开(公告)日：2015-10-28
申请号：EP15163216.3
申请日：2006-06-01
申请人： The Board of Trustees of The University of Illinois
发明人： Nuzzo, Ralph G , Rogers, John A. , Menard, Etienne , Lee, Keon Jae , Khang, Dahl-Young , Sun, Yugang , Meitl, Matthew , Zhu, Zhengtao , Ko, Heung Cho , Mack, Shawn
IPC分类号： H01L21/683
CPC分类号： H01L29/0665 , B82Y10/00 , H01L21/6835 , H01L27/1266 , H01L27/1292 , H01L29/0673 , H01L29/1606 , H01L29/22 , H01L29/66742 , H01L29/7781 , H01L29/78696 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68377 , H01L2924/0002 , H01L2924/1033 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.
摘要翻译：本发明提供一种具有选择用于高质量打印的半导体元件的制造中，转移和组件的高收率途径的物理尺寸，形状，组合物和空间取向。的组合物和本发明的方法提供了高精确度的注册转移和微尺寸和/或纳米尺寸的半导体结构的阵列的集成到基底上，包括大面积衬底和/或柔性基片。此外，本发明提供了制备从低成本散装材料，颜色可印刷的半导体元件的方法：如体硅晶片，以及智能材料处理策略，使一种多功能且具有商业吸引力基于印制造平台用于制造范围广泛的功能性半导体器件。

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