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1. 发明公开

EP3387888A1 ASSEMBLY AND LIGHTING DEVICE COMPRISING THE ASSEMBLY 审中-公开
公开(公告)号：EP3387888A1
公开(公告)日：2018-10-17
申请号：EP16806015.0
申请日：2016-11-28
申请人： Philips Lighting Holding B.V.
发明人： DIJKEN, Durandus Kornelius , EGGINK, Hendrik Jan
IPC分类号： H05K1/02
CPC分类号： H05K1/0272 , F21V29/83 , F21Y2115/10 , H05K1/0203 , H05K1/0204 , H05K1/0209 , H05K1/021 , H05K3/445 , H05K2201/064 , H05K2201/09063 , H05K2201/10106 , H05K2201/10257
摘要： An assembly (1) is disclosed, comprising at least one electrical device (5) and at least one carrier substrate (2) arranged to support the at least one electrical device (5). The at least one carrier substrate (2) is arranged with at least one tubular structure (6), which is at least in part hollow and arranged so as to permit passage of fluid through the at least one carrier substrate (2), for example between a first side (3) of the carrier substrate (2) and a second side (4) of the carrier substrate (2), and wherein the at least one tubular structure (6) is arranged such that it has an extension so that it protrudes a predefined distance from at least one of the first side (3) and the second side (4). A lighting device comprising the assembly (1) and a method (30) for manufacturing the assembly (1) are also disclosed.

2. 发明公开

EP3358917A1 LEITERPLATTE MIT EINER KÜHLFUNKTION 审中-公开
公开(公告)号：EP3358917A1
公开(公告)日：2018-08-08
申请号：EP17154961.1
申请日：2017-02-07
申请人： Siemens Aktiengesellschaft
发明人： Seidel, Julian
IPC分类号： H05K1/02 , H05K3/34 , H05K3/40
CPC分类号： H05K1/021 , H05K1/0204 , H05K1/0206 , H05K1/0215 , H05K3/341 , H05K3/4061 , H05K2201/09054 , H05K2201/09845 , H05K2201/10416 , H05K2201/10969 , H05K2203/128
摘要： Die Erfindung betrifft ein Verfahren zum Herstellen einer Leiterplatte (10) mit einer Kühlfunktion für ein in einer vorgegebenen Position auf der Leiterplatte (10) angeordnetes und an Leiterbahnen (14) der Leiterplatte (10) elektrisch angeschlossenes elektronisches Bauteil (16), mit:
- Herstellen der Leiterplatte (10), indem auf einem Leiterplattenmaterial (18) die Leiterbahnen (14) zumindest an einer Oberfläche (20) des Leiterplattenmaterials (18) aufgebracht werden, wobei die Leiterbahnen (14) zumindest elektrische Kontaktflächen (12) zum elektrischen Kontaktieren des wenigstens einen elektronischen Bauteils (16) bereitstellen,
- Einbringen einer Durchgangsöffnung (22) in die Leiterplatte (10) im Bereich der vorgegebenen Position, und
- Hindurchführen eines Wärmeleitkörpers (24) durch die Durchgangsöffnung (22) zur Kühlung des elektronischen Bauteils (16).

3. 发明授权

EP2713396B1 Overlay circuit structure for interconnecting semiconductor light emitting devices and method of manufacturing the same 有权
标题翻译：叠加电路结构，用于发射用于制造半导体derren装置和方法的光的连接
公开(公告)号：EP2713396B1
公开(公告)日：2017-03-08
申请号：EP12186414.4
申请日：2012-09-27
申请人： General Electric Company
发明人： Gowda, Arun Virupaksha , Cunningham, Donald Paul , Chauhan, Shakti Singh
IPC分类号： H01L25/075 , H05K1/02 , H05K1/18 , H01L33/62 , H01L33/64
CPC分类号： H01L25/0753 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/24 , H05K1/0206 , H05K1/021 , H05K1/189 , H05K2201/10106

4. 发明公开

EP3131370A1 PRINTED CIRCUIT BOARD AND LIGHT-EMITTING DEVICE INCLUDING SAME 有权
标题翻译： LEITERPLATTE UND LICHTEMITTIERENDE VORRICHTUNG DAMIT
公开(公告)号：EP3131370A1
公开(公告)日：2017-02-15
申请号：EP15776290.7
申请日：2015-03-27
申请人： LG Innotek Co., Ltd.
发明人： KIM, Jeong Han , PARK, Jeung Ook , YOON, Sang In , IM, Hyun Gu
IPC分类号： H05K1/02 , H05K1/18 , H01L33/00
CPC分类号： H01L33/44 , H01L33/00 , H01L33/38 , H01L33/62 , H01L33/642 , H05K1/02 , H05K1/021 , H05K1/056 , H05K1/117 , H05K1/18 , H05K1/183 , H05K2201/10106 , H05K2203/049
摘要： The present invention relates to a printed circuit board having an improved heat radiation performance, and a light-emitting device including the same. A printed circuit board according to an embodiment of the present invention comprises: a first electrode layer, a first insulation layer disposed on one surface of the first electrode layer, the first insulation layer including at least a cavity formed through a part thereof; and a second electrode layer disposed on the first insulation layer, wherein at least a part of the one surface of the first electrode layer can be exposed to the outside through the cavity.
摘要翻译：本发明涉及具有改进的散热性能的印刷电路板，以及包括该印刷电路板的发光装置。根据本发明实施例的印刷电路板包括：第一电极层，设置在第一电极层的一个表面上的第一绝缘层，第一绝缘层至少包括通过其一部分形成的空腔; 以及设置在所述第一绝缘层上的第二电极层，其中所述第一电极层的所述一个表面的至少一部分可以通过所述空腔暴露于外部。

5. 发明授权

EP1986244B1 Mounting structure 有权
标题翻译： Montagestruktur
公开(公告)号：EP1986244B1
公开(公告)日：2017-01-11
申请号：EP08161081.8
申请日：2002-11-12
申请人： Fujitsu Limited
发明人： Shigaki, Masafumi , Nakazawa, Isao , Yamanaka, Kazunori
IPC分类号： H01L39/04 , H05K1/02 , H01L23/40 , H01L23/66
CPC分类号： H05K1/021 , H01L23/66 , H01L25/165 , H01L2223/6627 , H01L2924/1423 , H01L2924/15153 , H01L2924/15165 , H01L2924/1616 , H01L2924/16195 , H01L2924/16315 , H01L2924/166 , H01L2924/19032 , H05K1/0203 , H05K1/0243 , H05K1/142 , H05K1/182 , H05K3/0061 , H05K2201/0323 , H05K2201/09745 , H05K2201/10166 , H05K2201/10409

6. 发明公开

EP3089565A1 LEITERPLATTE 审中-公开
标题翻译：电路板
公开(公告)号：EP3089565A1
公开(公告)日：2016-11-02
申请号：EP16162575.1
申请日：2016-03-29
申请人： MELECS EWS GmbH & Co KG
发明人： Koch, Armin , Neumann, Gerhard , Hellinger, Leopold
IPC分类号： H05K1/02
CPC分类号： H05K1/0204 , H05K1/0209 , H05K1/021 , H05K2201/066 , H05K2201/09063 , H05K2201/10106 , H05K2201/10166 , H05K2201/10416
摘要： Gezeigt wird eine Leiterplatte mit zwei metallischen Außenschichten (1, 2) und mindestens einer, insbesondere metallischen, Zwischenschicht (3),
- wobei im Falle einer metallischen Zwischenschicht zwischen den Außenschichten (1, 2) und der Zwischenschicht (3) Isolierschichten (4) angeordnet sind,
- wobei auf mindestens einer der Außenflächen der Leiterplatte mindestens eine Kontaktfläche für ein zu kühlendes Bauelement (9) angeordnet ist,
- wobei auf der gegenüber liegenden Außenfläche der Leiterplatte mindestens ein Kühlelement (11) angeordnet ist, und
- wobei die Kontaktfläche für das zu kühlende Bauelement (9) mittels eines Plättchens (5) aus isoliertem Metallsubstrat elektrisch vom Kühlelement (11) isoliert ist. Dabei ist vorgesehen, dass die Kontaktfläche für das zu kühlende Bauelement (9) durch eine oder mehrere metallische Durchkontaktierungen (13) mit der gegenüber liegenden Außenfläche der Leiterplatte verbunden ist, wo das Plättchen (5) aus isoliertem Metallsubstrat außen an der Außenfläche der Leiterplatte angebracht und mit dem Kühlelement (11) in Kontakt ist.
摘要翻译：示出的电路板具有两个外金属层（1,2）和至少一个，特别是金属中间层（3）， - 其中，在所述外层之间的金属中间层的情况下（1,2）和中间层（3）的绝缘层（4）被布置， - 其中至少一个接触表面，用于对冷却装置（9）被布置在电路板的外表面中的至少一个， - 其中至少一个冷却元件（11）设置在所述电路板的所述相对的外表面上，并且 - 其中所述接触面为该组件由一个晶片的装置（9）被冷却（5）由从冷却元件（11）是分离的绝缘金属电衬底。它提供了用于组件的接触表面，以通过一种或多种金属通孔（13）被冷却（9）被连接到所述芯片（5）由安装在外侧的电路板的外表面上的绝缘金属基板的所述电路板的所述相对的外表面并且连接到接触的冷却元件（11）。

7. 发明公开

EP3051642A4 CIRCUIT ASSEMBLY 审中-公开
标题翻译：电路
公开(公告)号：EP3051642A4
公开(公告)日：2016-10-19
申请号：EP14848589
申请日：2014-09-03
申请人： SUMITOMO WIRING SYSTEMS
发明人： NAKAMURA ARINOBU
IPC分类号： H02G3/16 , H05K7/06
CPC分类号： H05K1/0263 , B60R16/0238 , B60R16/0239 , H05K1/021 , H05K1/181 , H05K3/0061 , H05K3/341 , H05K3/3421 , H05K2201/09063 , H05K2201/10166 , H05K2201/10272 , Y02P70/611
摘要： Provided is a circuit assembly having a new structure in which a busbar circuit unit overlapped with a printed circuit board can reliably be fixed regardless of the heating temperature at the time of soldering of an electrical component. In a circuit assembly 10 in which a busbar circuit unit 16 is overlapped with and fixed to a printed circuit board 12, the busbar circuit unit 16 is configured as one piece by busbars 14 being buried between insulator layers 22 and 26, and has an exposed section 44 in which a part of the busbars 14 is exposed via a through-hole 40 of the insulator layer 22. The insulator layer 22 of the busbar circuit unit 16 is overlapped with the printed circuit board 12 and is fixed thereto via fixing means 36, and terminal sections 56 of an electrical component 20 are soldered to and mounted on the exposed section 44 of the busbar circuit unit 16 and a printed wiring 54 of the printed circuit board 12.

9. 发明公开

EP2944248A4 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND ENDOSCOPE 有权
标题翻译： VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERBAUMMENTS，HALBLEITERBAUELEMENT UND ENDOSKOP
公开(公告)号：EP2944248A4
公开(公告)日：2016-10-05
申请号：EP13871159
申请日：2013-09-12
申请人： OLYMPUS CORP
发明人： KOJIMA KAZUAKI
IPC分类号： A61B1/00 , A61B1/04 , A61B1/05 , G02B23/24 , G02B23/26 , H04N5/225 , H04N5/369 , H05K1/02 , H05K1/18 , H05K3/34 , H05K5/04
CPC分类号： H04N5/2257 , A61B1/0011 , A61B1/00124 , A61B1/051 , G02B23/2484 , H04N5/2253 , H04N5/369 , H05K1/021 , H05K1/181 , H05K1/189 , H05K3/3431 , H05K5/04 , H05K2201/055 , H05K2201/066 , H05K2201/10121 , H05K2201/10151 , H05K2203/1305 , H05K2203/302
摘要： A manufacturing method of an image pickup apparatus 1 includes a step of manufacturing an image pickup device chip 20, a step of manufacturing a wiring board 30 having first terminals 31 and second terminals 32 disposed on both sides of a first primary surface 30SA with a central flexible portion 30F intervened in between, a step of joining a heat conductive block 40 to a second primary surface 30SB of the wiring board 30, a step of joining the image pickup device chip 20 to the first terminals 31 of the wiring board 30, a step of performing solder joining of core wires 51 of a cable 50 to the second terminals 32 of the wiring board 30 by conducting heat generated by a heat tool 80 through the heat conductive block 40, a step of bending the wiring board 30, and a step of performing housing inside a frame member 70, and sealing with sealing resin 71.
摘要翻译：图像拾取装置1的制造方法包括制造图像拾取器件芯片20的步骤，制造具有第一端子31的布线板30和设置在第一主表面30SA的两侧上的第二端子32的步骤，其具有中心介于其间的柔性部分30F，将导热块40接合到布线板30的第二主表面30SB的步骤，将图像拾取装置芯片20连接到布线板30的第一端子31的步骤，通过从热传导块40导热由热工具80产生的热量，将布线基板30的芯线51焊接到布线基板30的第二端子32的步骤，使布线板30弯曲的步骤在框架构件70内执行壳体的步骤，并且用密封树脂71密封。

10. 发明授权

EP1590994B1 METAL BASE WIRING BOARD FOR RETAINING LIGHT EMITTING ELEMENTS, LIGHT EMITTING SOURCE, LIGHTING APPARATUS, AND DISPLAY APPARATUS 有权
标题翻译：用金属基地发光元件，光源，照明装置及显示装置电路板
公开(公告)号：EP1590994B1
公开(公告)日：2016-05-18
申请号：EP04708463.7
申请日：2004-02-05
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： MATSUI, Nobuyuki , SETOMOTO, Tatsumi , TAMURA, Tetsushi , SHIMIZU, Masanori , YAMASHITA, Yoshihisa
IPC分类号： H05K1/00 , H01L25/075
CPC分类号： H01L25/0753 , F21K9/233 , F21Y2105/10 , F21Y2115/10 , H01L33/641 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H05K1/0203 , H05K1/021 , H05K1/183 , H01L2924/00014 , H01L2924/00
摘要： A metal base wiring board including: an insulation substrate composed of an upper insulation layer and a lower insulation layer; and a metal base attached to a rear surface of the insulation substrate. In front surfaces of the upper and lower insulation layers, wiring patterns are embedded and connected to each other. The insulation substrate has a plurality of recesses whose bottom faces are exposed areas of the front surface of the lower insulation layer. LED bare chips are mounted on the bottom faces of the recesses so as to be connected to the wiring pattern of the lower insulation layer.
摘要翻译：所述的金属基底电路板，包括：上绝缘层构成的绝缘基板和下绝缘层; 和金属基底附着在绝缘基板的后表面上。在上部和下部绝缘层的前表面，布线图案被嵌入并连接到海誓山盟。该绝缘基板具有凹部，其底部的面暴露在下部绝缘层的前表面的区域的复数。 LED裸芯片安装在所述凹部的底面上，以便被连接到下绝缘层的布线图案。

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