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2. 发明授权

EP3226269B1 LEISTUNGSHALBLEITEREINRICHTUNG 有权
公开(公告)号：EP3226269B1
公开(公告)日：2018-06-20
申请号：EP17157758.8
申请日：2017-02-24
申请人： SEMIKRON Elektronik GmbH & Co. KG
发明人： Frank, Thomas , Walter, Christian , Weiß, Stefan , Ziegler, Thomas
IPC分类号： H05K3/00 , H01G4/40 , H01G4/38 , H01G2/06 , H01G2/08 , H01L23/049 , H01L23/48 , H05K3/32 , H05K3/30 , H05K1/02
CPC分类号： H01G2/06 , H01G2/08 , H01G4/38 , H01G4/40 , H01L23/049 , H01L23/48 , H05K1/0203 , H05K3/0061 , H05K3/301 , H05K3/325 , H05K2201/10015 , H05K2201/10537 , H05K2201/10651 , H05K2201/10757

3. 发明公开

EP3334258A1 CIRCUIT BOARD DEVICE 审中-公开
公开(公告)号：EP3334258A1
公开(公告)日：2018-06-13
申请号：EP17190322.2
申请日：2017-09-11
申请人： KABUSHIKI KAISHA TOSHIBA , Toshiba Infrastructure Systems & Solutions Corporation
发明人： Satake, Yoshiaki , Tamai, Shinji
IPC分类号： H05K1/02 , H05K3/28 , H05K7/20 , H01L23/552 , H05K3/34
CPC分类号： H05K1/0209 , H01L23/552 , H01L2924/3025 , H05K1/0204 , H05K1/0233 , H05K3/0061 , H05K3/281 , H05K3/284 , H05K3/3415 , H05K3/3426 , H05K3/429 , H05K7/205 , H05K2201/0215 , H05K2201/066 , H05K2201/095 , H05K2201/09581 , H05K2201/09872 , H05K2201/10689 , H05K2203/1311 , H05K2203/1316 , H05K2203/1322 , H05K2203/1438
摘要： A circuit board device of the embodiment includes: a mount board (10) having an electronic component (12) and a printed circuit board (11) having at least one surface where the electronic component is mounted; a heat path (40) arranged to a position facing the mount surface of the mount board, a sheet (30) arranged on the mount surface, and a resin portion (20) arranged between the sheet and the heat path. A cavity (D) surrounded by the sheet and the mount surface is formed in a step portion between the electronic component and the printed circuit board.

4. 发明公开

EP3320610A1 HIGH POWER DENSITY INVERTER (I) 有权
标题翻译：高功率密度逆变器（I）
公开(公告)号：EP3320610A1
公开(公告)日：2018-05-16
申请号：EP16736173.2
申请日：2016-07-07
申请人： Constructions Electroniques + Telecommunications
发明人： BLEUS, Paul , JOANNES, Thierry , MILSTEIN, François , STASSAIN, Pierre , FREBEL, Fabrice
IPC分类号： H02M1/14 , H02M1/15 , H02M7/5387 , H02M1/00 , H02M1/08 , H02M1/12 , H02M7/48 , H02M7/797 , H03K17/13 , H03K5/1536 , H03K5/153
CPC分类号： H02M1/143 , H02M1/08 , H02M1/12 , H02M1/126 , H02M1/15 , H02M7/523 , H02M7/5387 , H02M7/797 , H02M2001/0029 , H02M2001/0048 , H02M2001/0058 , H02M2001/123 , H02M2007/4811 , H03K17/133 , H05K3/0061 , Y02B70/1483 , Y02B70/1491
摘要： The present invention relates to a single phase, non-insulated, miniaturized DC/AC power inverter (1) having an output power density higher than 3000 W/dm3, wherein said first (S1_H), second (S1_L), third (S2_H) and fourth (S2_L) switches are made of wide-band semiconductors and preferably of gallium nitride or GaN semiconductors; and wherein said DC/AC power inverter (1) further comprises: a ripple-compensating active filter comprising a third half-bridge (203) having a fifth switch (S3_H) in series with a sixth switch (S3_L), said fifth switch (S3_H) being connected at one end to the positive terminal (L+) of the DC input, said sixth switch (S3_L) being connected at one end to the negative terminal (L−) of the DC input,the other end of the fifth switch (S3_H) being connected to the other end of the sixth switch (S3_L), defining a third common end, said third common end being connected to a first end of a LC filter, made of at least one inductor (L6) and one storage capacitor (C5), a second end of the LC filter being connected to the negative terminal (L−); modulation control means of said first (S1_H), second (S1_L), third (S2_H), fourth (S2_L), fifth (S3_H) and sixth (S3_L) switches for providing a switch frequency comprised between 20 and 500 kHz and allowing variable phase shifts between any two of said first (201), second (202) and third (203) half-bridges and allowing dead time modulation of the switches of said half-bridges (201, 202, 203), so that to obtain a switching approaching ZVS switching, in particular to obtain switching when current crosses through zero and further to cancel switching losses and so that to allow high peak-to-peak voltage variations in the active filter, while storing corresponding energy in the storage capacitors (C5), wherein the Y-capacitors of the common mode noise filter (100), are referenced to a shielding being at a reference potential, said shielding being insulated from earth, said Y-capacitors having a value comprised between 100 nF and several μF.

5. 发明公开

EP2641997A4 LAMINATE AND METHOD FOR PRODUCING LAMINATE 审中-公开
公开(公告)号：EP2641997A4
公开(公告)日：2017-12-20
申请号：EP11842434
申请日：2011-11-17
申请人： NHK SPRING CO LTD
发明人： YAMAUCHI YUICHIRO , SAITO SHINJI , AKABAYASHI MASARU , HIRANO SATOSHI
IPC分类号： C23C24/04 , B32B18/00 , H01L23/36 , H05K1/03 , H05K3/38
CPC分类号： H05K1/11 , B23K35/001 , C04B41/009 , C04B41/52 , C04B41/90 , C04B2111/00844 , C23C24/04 , C23C28/322 , C23C28/34 , H01L23/15 , H01L23/3735 , H01L2924/0002 , H05K1/0306 , H05K3/0061 , H05K3/388 , Y10T428/12611 , C04B35/00 , C04B35/10 , C04B41/4545 , C04B41/50 , C04B41/5116 , C04B41/5127 , C04B41/5094 , C04B41/515 , C04B41/522 , C04B41/5155 , H01L2924/00
摘要： It is possible to obtain a laminate having high adhesion strength between ceramic and a metal coating by providing the following: an insulating ceramic substrate (10); an intermediate layer (50) formed on the surface of the ceramic substrate (10) and having a metal-containing principal component metal layer (51) and an active ingredient layer (52) including metal, a metal oxide, or a metal hydride; and a metal coating (40) formed on the surface of the intermediate layer (50) by accelerating a metal-containing powder with gas, and depositing the same on the surface thereof by spraying while in a solid state.

6. 发明公开

EP2506320A4 SUBSTRATE FOR LED MOUNTING 审中-公开
公开(公告)号：EP2506320A4
公开(公告)日：2017-12-06
申请号：EP10832865
申请日：2010-11-26
申请人： NITTO DENKO CORP
发明人： KITAGAWA DAISUKE , TAKAYAMA YOSHINARI , SUEHIRO ICHIRO , USUI HIDEYUKI , ODA TAKASHI
IPC分类号： H05K1/03 , H01L23/373 , H01L33/60 , H01L33/64
CPC分类号： H05K1/0373 , C08L27/18 , H01L23/3735 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2924/181 , H01L2924/3025 , H05K1/0204 , H05K3/0061 , H05K2201/015 , H05K2201/0209 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The LED mounting substrate of the present invention includes a thermally conductive layer (thermally conductive sheet (10)) made of a composition containing boron nitride powder and a fluororesins, and the fluororesin contains polytetrafluoroethylene. The thermally conductive layer has a thermal conductivity of 2 W/(m€¢K) or more. The thermally conductive layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm.

7. 发明公开

EP3242323A1 BRIDGE LEG CIRCUIT ASSEMBLY AND FULL-BRIDGE CIRCUIT ASSEMBLY 审中-公开
标题翻译：桥接腿电路组件和全桥电路组件
公开(公告)号：EP3242323A1
公开(公告)日：2017-11-08
申请号：EP17168930.0
申请日：2017-05-02
申请人： General Electric Company
发明人： WU, Tao , LI, Fei
IPC分类号： H01L23/538 , H01L25/07 , H05K1/18
CPC分类号： H03K17/66 , H01L23/4821 , H01L23/538 , H01L25/072 , H03K17/063 , H03K17/567 , H03K17/602 , H05K1/0203 , H05K1/05 , H05K1/182 , H05K3/0061
摘要： A bridge leg circuit assembly (10, 30) comprising: a circuit board (20, 40), a first active switch die (Q1), and a second active switch die (Q2). The circuit board (20, 40) consists of an insulating plate (14, 34) with a first side and a second side as well as a first conducting layer (11, 31) and a second conducting layer (12, 32) located on the first and second sides of the insulating plate (14, 34), respectively. The second conducting layer (12, 32) consists of a first conducting region (121, 321) and a second conducting region (122, 322) that are insulated from each other. The first active switch die (Q1) consists of an opposing first side and an opposing second side which are embedded into the circuit board (20, 40); the first side of the first active switch die (Q1) is facing and coupled with the first conducting region (121, 321), and the second side of the first active switch die (Q2) is coupled with the second conducting region (122, 322). The second active switch die (Q2) consists of an opposing first side and an opposing second side which are embedded into the circuit board (20, 40); the first side of the second active switch die (Q2) is facing and coupled with the second conducting region (122, 322), and the second side of the second active switch (Q2) is coupled with the first conducting layer (11, 31). Embodiments of the present invention also relate to a full-bridge circuit assembly (50).
摘要翻译：一种桥臂电路组件（10,30），包括：电路板（20,40），第一有源开关管芯（Q1）和第二有源开关管芯（Q2）。电路板（20,40）包括具有第一侧和第二侧的绝缘板（14,34）以及位于第一侧和第二侧上的第一导电层（11,31）和第二导电层（12,32）绝缘板14,34的第一和第二侧。第二导电层（12,32）由彼此绝缘的第一导电区域（121,321）和第二导电区域（122,322）组成。第一有源开关管芯（Q1）由嵌入电路板（20,40）中的相对的第一侧和相对的第二侧组成; 第一有源开关管芯Q1的第一侧与第一导电区域121,321相对并且与第一导电区域121,321耦合，并且第一有源开关管芯Q2的第二侧与第二导电区域122相耦合， 322）。第二有源开关管芯（Q2）由嵌入电路板（20,40）中的相对的第一侧和相对的第二侧组成; 第二有源开关晶片（Q2）的第一侧面对第二导电区域（122,322）并与其耦合，并且第二有源开关（Q2）的第二侧与第一导电层（11,31））。本发明的实施例还涉及全桥电路组件（50）。

8. 发明公开

EP3234457A1 LEUCHTMITTELTRÄGER FÜR EINE LICHTBANDLEUCHTE 有权
标题翻译： LEUCHTMITTELTRÄGERFÜREINE LICHTBANDLEUCHTE
公开(公告)号：EP3234457A1
公开(公告)日：2017-10-25
申请号：EP15813006.2
申请日：2015-12-11
申请人： Zumtobel Lighting GmbH
发明人： BADER, Martin , BECHTER, Wolfgang , GADNER, Wolfgang
IPC分类号： F21V19/00 , F21V21/02 , H05K3/00 , F21Y115/10
CPC分类号： F21V17/16 , F21V17/02 , F21V17/12 , F21V19/0015 , F21V19/004 , F21V19/0055 , F21V21/025 , F21V23/06 , F21V29/70 , F21Y2103/10 , F21Y2115/10 , H05K1/0203 , H05K3/0061
摘要： The invention relates to a lighting-means carrier (5) for a strip-lighting luminaire, comprising: at least one lighting-means circuit board (30) having light-emitting diodes (33) that can be arranged thereon; and at least one heat sink (31) thermally connected to the lighting-means circuit board (30). In a central region, the lighting-means circuit board (30) is rigidly connected to the heat sink (31) in such a way that substantially no relative motion between the light-means circuit board (30) and the heat sink (31) is possible. In at least two further regions, the lighting-means circuit board (30) is connected to the heat sink (31) in a floating manner, the lighting-means circuit board (30) therefore being arranged on the heat sink (31) in such a way that the lighting-means circuit board can be moved in relation to the heat sink (31) outside of the central region. The invention further relates to a strip-lighting luminaire having at least one lighting-means carrier (5) according to the invention.
摘要翻译：本发明涉及一种用于带状照明照明设备的照明装置载体（5），包括：至少一个发光装置电路板（30），其具有可以布置在其上的发光二极管（33）; 和至少一个热连接到照明装置电路板（30）的散热器（31）。在中央区域中，照明装置电路板（30）以这样的方式刚性地连接到散热器（31），使得在照明装置电路板（30）和散热器（31）之间基本上没有相对运动，是可能的。在至少另外两个区域中，照明装置电路板（30）以浮动方式连接到散热器（31），因此照明装置电路板（30）布置在散热器（31）上使得照明装置电路板可以相对于中央区域外的散热器（31）移动。本发明进一步涉及具有根据本发明的至少一个照明装置载体（5）的条形照明灯具。

9. 发明公开

EP3226269A3 LEISTUNGSHALBLEITEREINRICHTUNG 有权
公开(公告)号：EP3226269A3
公开(公告)日：2017-10-25
申请号：EP17157758.8
申请日：2017-02-24
申请人： SEMIKRON Elektronik GmbH & Co. KG
发明人： Frank, Thomas , Walter, Christian , Weiß, Stefan , Ziegler, Thomas
IPC分类号： H01G4/40 , H01G4/38 , H01G2/06 , H01G2/08 , H01L23/049 , H01L23/48 , H05K3/32 , H05K3/30
CPC分类号： H01G2/06 , H01G2/08 , H01G4/38 , H01G4/40 , H01L23/049 , H01L23/48 , H05K1/0203 , H05K3/0061 , H05K3/301 , H05K3/325 , H05K2201/10015 , H05K2201/10537 , H05K2201/10651 , H05K2201/10757
摘要： Die Erfindung betrifft eine Leistungshalbleitereinrichtung (1) mit einem eine erste und eine zweite elektrisch leitende Kontaktfläche (2a und 2b) aufweisenden Substrat (3) auf dem Leistungshalbleiterbauelemente (4) angeordnet und mit dem Substrat (3) elektrisch leitend verbunden sind, und mit einem elektrischen Kondensator (5), der zum elektrischen Anschluss des Kondensators ein elektrisch leitendes erstes und ein elektrisch leitendes zweites Kondensatoranschlusselement (5a und 5b) aufweist, wobei die Kondensatoranschlusselemente mit dem Substrat elektrisch leitend druckkontaktiert sind. Die Erfindung schafft eine Leistungshalbleitereinrichtung, deren Kondensatoren zuverlässig elektrisch leitend mit dem Substrat der Leistungshalbleitereinrichtung verbunden sind.
Abbildung 2.

10. 发明公开

EP3214646A1 HEAT-DISSIPATING STRUCTURE 审中-公开
标题翻译：散热结构
公开(公告)号：EP3214646A1
公开(公告)日：2017-09-06
申请号：EP14904817.5
申请日：2014-10-29
申请人： Shindengen Electric Manufacturing Co., Ltd.
发明人： IKEDA Kosuke , MORINAGA Yuji , MATSUZAKI Osamu
IPC分类号： H01L23/36 , H01L25/07 , H01L25/18 , H05K7/20
CPC分类号： H05K1/021 , H01L23/3672 , H01L25/07 , H01L25/18 , H01L2924/0002 , H05K1/18 , H05K3/0061 , H05K7/209 , H05K2201/066 , H05K2201/10015 , H05K2201/10022 , H05K2201/10166 , H05K2201/10174 , H05K2201/10189 , H01L2924/00
摘要： The present invention provides a heat dissipating structure with high heat dissipation performance while reducing the electric resistance. A heat dissipating structure includes: a heat sink (2) having a base portion (6), and a plurality of heat dissipating fins (7) provided upright on a first surface (6a) of the base portion (6); a first heat generating component (3) provided on a side of the first surface (6a) of the base portion (6) while being in contact with at least one heat dissipating fin (7) of the plurality of heat dissipating fins (7); a circuit board (4) joined to a second surface (6b), opposite to the first face (6a), of the base portion (6) while being electrically connected to the first heat generating component (3); a second heat generating component (5) provided on the circuit board (4), the second heat generating component (5) generating a smaller amount of heat than the first heat generating component (3); and a connector (20) electrically connecting the first heat generating component (3) and the second heat generating component (5). The connector (20) has a first outlet (22a, 22b) into which a first connecting terminal (21 a, 21b) on a side of the first heat generating component (3) is insertable, and a second outlet (24) into which a second connecting terminal (23) on a side of the second heat generating component (5) is insertable.
摘要翻译：本发明提供了一种具有高散热性能同时降低电阻的散热结构。散热结构包括：散热器（2），其具有基部（6）和立设在基部（6）的第一表面（6a）上的多个散热片（7）;散热片在与所述多个散热翅片（7）中的至少一个散热翅片（7）接触的同时设置在所述基部（6）的所述第一表面（6a）的一侧上的第一发热部件（3） ; 电连接到与所述基部（6）的所述第一面（6a）相对的第二表面（6b），同时电连接到所述第一发热元件（3）的电路板（4）; 设置在所述电路板（4）上的第二发热部件（5），所述第二发热部件（5）产生的热量小于所述第一发热部件（3）的热量; 和电连接第一发热部件（3）和第二发热部件（5）的连接器（20）。连接器20具有能够插入第一发热部件3侧的第一连接端子21a，21b的第一插座22a和插入该插座20b的第二插座24，第二发热元件（5）一侧上的第二连接端子（23）是可插入的。

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