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1. 发明授权

EP0876692B1 POWER DISTRIBUTION CENTER 失效
标题翻译：电源分配单元
公开(公告)号：EP0876692B1
公开(公告)日：2005-08-31
申请号：EP97912804.8
申请日：1997-10-22
申请人： Thomas & Betts International, Inc.
发明人： BUTTS, Lawrence, D. , ROBINSON, Charles, L. , SIMPSON, Douglas , DERY, Joseph, L.
IPC分类号： H01R9/09 , H01R13/10 , H01R9/24 , B60R16/02 , H01R12/00
CPC分类号： B60R16/0238 , H01R9/22 , H01R9/2491 , Y10S439/949
摘要： A Power Distribution Center (PDC) for a motor vehicle distributes power through relays and fuses to connectors for distribution of power throughout the motor vehicle. The PDC includes a housing/connector plate (10), a printed circuit board (30), a leadframe assembly (40), an insulator (50), a B+ buss bar (60), an alignment plate (100) and a cover (110). The PDC utilizes the B+ buss bar asembly (60) for receiving power into the PDC. The leadframe assembly (40) is utilized to distribute power within the PDC to particular circuits. The printed circuit board (30) is employed to distribute power and signals within the PDC. Terminals clips (84, 84') are used to interconnect between the PDC and associated relays and fuses. The PDC is configured to allow simple addition of electronic modules by providing an interface (15) as part of the PDC, thereby allowing modules to be added to the network without requiring a separate wiring harness for each module.

2. 发明公开

EP1415371A2 HUB IDU CARD INSERT PANEL 审中-公开
标题翻译： HUB IDU卡插入面板
公开(公告)号：EP1415371A2
公开(公告)日：2004-05-06
申请号：EP02746657.2
申请日：2002-06-24
申请人： BWA Technology, Inc.
发明人： UDD, Thomas, E.
IPC分类号： H01R23/70 , H01R9/09
CPC分类号： H01Q1/2275 , G06F1/186 , H01Q1/088 , H01Q1/125 , H01Q1/22 , H01R13/518 , H01R13/73
摘要： An insert panel assembly (10) for the IDU cards at the hub of a point-to-multipoint millimeter wave wireless communication system. Generic cards with terminations for the selective connection of remote transceivers are provided with an apertured faceplate (16) over which an insert panel (20) may be placed to selectively block access to the card terminations (12). In one embodiment, the insert (20) carries adaptors and another embodiment the connector (26) on the conductor (30) from the transceiver is configured to attach to the faceplate. In both embodiments the weight of the connector and conductor is supported by the chassis and not by the card. The connector is angled downwardly to avoid on the conductor and reduce the likelihood of kinking.
摘要翻译：一种用于位于点对多点毫米波无线通信系统的集线器处的IDU卡的插入面板组件（10）。具有用于远程收发器的选择性连接的终端的通用卡设置有开孔面板（16），插入面板（20）可以放置在该开口面板上以选择性地阻挡对卡终端（12）的访问。在一个实施例中，插入件（20）承载适配器，并且在另一实施例中，来自收发器的导体（30）上的连接器（26）被配置为附接到面板。在两个实施例中，连接器和导体的重量由底盘支撑而不是由卡支撑。连接器向下倾斜以避免在导体上并减少扭结的可能性。

3. 发明公开

EP1340289A2 BOARD INTEGRATED RESILIENT CONTACT ELEMENTS ARRAY AND METHOD OF FABRICATION 审中-公开
标题翻译：板上集成柔性接触元件阵列及其制造方法
公开(公告)号：EP1340289A2
公开(公告)日：2003-09-03
申请号：EP01999269.2
申请日：2001-12-04
申请人： Aprion Digital Ltd.
发明人： KOREM, Aharon
IPC分类号： H01R9/09
CPC分类号： H01R13/2414 , B41J2/14072 , H01R12/592 , H01R12/61 , H05K1/095 , H05K3/326 , H05K3/4007 , H05K2201/0314 , H05K2201/0367 , Y10T29/49147
摘要： According to some embodiments of the present invention, a connectable electronic component-carrying board (10) is provided. The connectable electronic board (10) comprises at least one resilient conductive element (14) integrally molded onto at least part of a contact (12A) of the connectable board (10). The resilient conductive element (14) is able to provide an electrical pathway between the contact (12A) it is molded to and a corresponding contact (12B) on another electronic component-carrying board (18). A method of fabricating the connecting electronic component-carrying board (10) is also provided.

4. 发明公开

EP0932221A3 Terminal pins mounted in flexible substrates 审中-公开
标题翻译：安装在柔性衬底上销
公开(公告)号：EP0932221A3
公开(公告)日：2001-10-31
申请号：EP99100220.5
申请日：1999-01-08
申请人： MOLEX INCORPORATED
发明人： Berg, Paul Christopher , Etters, Harry N. , Fencl, Duane M. , Fuerst, Robert M. , Krehbiel, Fred love
IPC分类号： H01R9/09 , H01R9/07 , H05K3/32 , H01R4/02
CPC分类号： H01R12/65 , H01R4/02 , H01R12/585 , H01R12/592 , H05K3/326
摘要： An electronic device (52) includes a flat flexible dielectric substrate (56) less than 0.050 inch thick and having a generally round hole (58) of a given diameter (66). A substantially square or polygonal terminal pin (62) is inserted into the round hole (58) in the substrate. The pin has a given cross-dimension (64) between opposite diametral corners thereof greater than the diameter of the round hole (58). The difference between the cross-dimension (64) of the pin (62) and the diameter (66) of the round hole (58) is on the order of 7% to 67% of the diameter of the hole.

5. 发明公开

EP0867980A3 Interconnecting electrical connector 失效
标题翻译：电气互连
公开(公告)号：EP0867980A3
公开(公告)日：2001-02-07
申请号：EP98650012.2
申请日：1998-02-12
申请人： HIROSE ELECTRIC CO., LTD.
发明人： Arai, Tatsuya , Nagashima, Masayuki
IPC分类号： H01R23/72 , H01R9/09
CPC分类号： H01R12/52 , H01R12/7082 , H01R12/714
摘要： A contact element 1 comprises a rigid fixing section 2 to be inserted into a slot 12 of an insulation housing 10 and a flexible section 3 extending from the fixing section 2. The flexible section 3 comprises a pair of upper and lower first thin springs 5 extending from the fixing section 2 and a pair of second thin springs 6 extending from the first thin springs 5 and connect with or spaced from each other. A pair of contact points 7 are provided at the joints between the first and second thin springs.

6. 发明公开

EP0815615A4 A PACKAGE HOUSING MULTIPLE SEMICONDUCTOR DIES 失效
标题翻译： GEHÄUSEFÜRMEHRERE HALBLEITERBAUELEMENTE
公开(公告)号：EP0815615A4
公开(公告)日：2000-12-06
申请号：EP96908756
申请日：1996-03-12
申请人： INTEL CORP
发明人： KUHN HARRY A
IPC分类号： H01L25/18 , H01L23/31 , H01L23/495 , H01L25/065 , H01L25/07 , H01R9/09 , B23K31/02 , H01L21/60 , H01L23/14 , H01R43/02 , H05K5/02
CPC分类号： H01L24/49 , H01L23/3107 , H01L23/49531 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L2224/05554 , H01L2224/16 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49112 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/014 , H01L2924/12044 , H01L2924/14 , H01L2924/19107 , H01L2224/05599
摘要： A package (50) housing multiple semiconductor dies (22, 23) includes a leadframe having a paddle (20) and a number of lead fingers (21). A flexible circuit (27) is adhesively laminated to both sides of the paddle. A first semiconductor die (23) is back-mounted to the bottom surface of the paddle and wire-bonded to the flexible circuit and the lead fingers. A second semiconductor die (22) is back-mounted to the top surface of the paddle and to the flexible circuit. The dies (22, 23) are encapsulated in a security coating (40) and encased in plastic (50).
摘要翻译：容纳多个半导体管芯的封装包括具有焊盘和多个引线指的引线框架。柔性电路粘合地层压在桨的两侧。第一半导体管芯被背面安装到焊盘的底表面上并引线接合到柔性电路和引线指。第二半导体管芯被背面安装到桨的顶表面和柔性回路。模具被封装在安全涂层中并且封装在塑料中。

7. 发明公开

EP0902508A3 Method for connecting a loop antenna to a circuit board and an assembly thereof 审中-公开
标题翻译：一种用于将环形天线连接到电路板和它们的组装方法
公开(公告)号：EP0902508A3
公开(公告)日：2000-10-25
申请号：EP98307365.1
申请日：1998-09-11
申请人： THE WHITAKER CORPORATION
发明人： Mickievicz, Scott K. , Whyne, Richard N. , Morin, Scott F. , Peavy, Jennifer L. , Hirsbrunner, Robert T.
IPC分类号： H01R23/72 , H01R9/09
CPC分类号： H01R12/57 , H01R12/718
摘要： A connector for use in connecting a loop antenna (32) to a circuit board (20) comprises two terminals (40) mounted in a housing (70). The ends (34,36) of the antenna are blade-like and the terminals include receptacles (44) for receiving the blade-like antenna ends. The terminals (40) are secured together by means of the housing (70) which isolates the terminals from one another and holds them together as a unit. The housing supports the terminals in mutually spaced relation corresponding to the spacing of circuit termini (24) on the board (20) to which the terminals are to be connected. A predetermined amount of solder (28) is disposed on each of the circuit termini, whereafter the terminals can be automatically positioned on the respective termini by means of the housing and be secured to the termini at the same time as other components, in a reflow soldering process. Subsequently, the ends (34,36) of the antenna are mated with the receptacles of the terminals.

8. 发明公开

EP0933834A3 Fastener for an electrical connector 审中-公开
标题翻译：紧固装置用于将电连接器
公开(公告)号：EP0933834A3
公开(公告)日：2000-06-07
申请号：EP98810842.9
申请日：1998-08-26
申请人： Samtec, Inc.
发明人： Vicich, Brian R. , Hynes, John K.
IPC分类号： H01R9/09 , H01R43/20
CPC分类号： H05K3/3447 , H01R12/58 , H01R43/205 , H05K3/3484 , H05K2201/10303 , H05K2201/1031 , H05K2201/10598 , H05K2201/10916 , Y02P70/611 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153
摘要： A fastener for an electrical connector. The fastener includes a fastener body having an opening therethrough for receiving a pin. The fastener body includes a plurality of gripping elements protruding into the hole for securing the fastener to the pin when disposed therebetween. The fastener is then soldered to the pin and to a mounting surface, such as a printed circuit board, by known soldering techniques.

9. 发明公开

EP0913879A3 Bornes perfectionnées 有权
标题翻译：改进的连接元件
公开(公告)号：EP0913879A3
公开(公告)日：2000-05-17
申请号：EP98500219.5
申请日：1998-10-08
申请人： MECANISMOS AUXILIARES INDUSTRIALES S.A. M.A.I.S.A.
发明人： Lopez Romani, Angel , Cardenas Diaz, Carmen , Viladrosa Pardo, Juan
IPC分类号： H01R4/18 , H01R9/09 , H01R13/04
CPC分类号： H01R12/58 , H01R4/185 , H01R13/04
摘要： Conçuée pour l'enclenchement sur un ou deux câbles normaux d'une section transversale de 0,5 mm2 environ et d'un diamètre d'isolant de 1,6 mm au plus. par un de leurs extrémités tandis que par l'opposée on elle est prevue de s'incorporer à une borne femelle ou un circuit imprimé d'une ou deux faces, en occupant le plus petit espace possible grâce à qu'elle présente une configuration sensiblement angulaire de façon que la zone d'enclenchement forme un angle de 90º environ avec la partie extrême opposée qui agit comme element mâle pour être introduite dans le point convenant du circuit imprimé.

10. 发明公开

EP0995235A1 KONTAKT SOWIE VERFAHREN ZUR HERSTELLUNG EINES KONTAKTES 失效
标题翻译：联系及其制造方法曝光
公开(公告)号：EP0995235A1
公开(公告)日：2000-04-26
申请号：EP98936426.0
申请日：1998-07-16
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DERANGEWANDTEN FORSCHUNG E.V.
发明人： BEUTEL, Hansjörg
IPC分类号： H01R4/02 , H01R9/09
CPC分类号： H05K3/328 , H01L21/4839 , H01L21/4853 , H01L24/11 , H01L24/13 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/45124 , H01L2224/78301 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01R4/02 , H01R12/62 , H01R43/02 , H05K3/361 , H05K2203/049 , Y10T428/12549 , Y10T428/1275 , Y10T428/12889 , H01L2924/00 , H01L2224/48
摘要： The invention relates to an electric and mechanical contact comprising a fixed background, a thin sheet-like bond structure and a bond connection. The invention also relates to a method for electrically and mechanically connecting a thin sheet-like bond structure to a fixed background by means of a bond head. The invention seeks to enable the production of bond contacts in minimum space and with very small pitch differences, i.e. up to 50 νm. To this end, the bond structure has a hole, and the bond connection consists substantially of a bond element extending from the background, through the hole in the bond structure, to an area situated above the bond structure. The bond element in the area above the bond structure at least partially extends laterally, beyond the hole in the bond structure, thus guaranteeing contact between the background and the underside of the bond structure. The invention furthermore seeks to make this production method as simple, rapid and economical as possible. To this end, the bond head is bonded for the most part directly to the background, through a hole in the bond structure. The bond structure is thus pressed against the background by the bond head.

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