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1. 发明专利

JP2010231951A Connector 审中-公开
标题翻译：连接器
公开(公告)号：JP2010231951A
公开(公告)日：2010-10-14
申请号：JP2009076509
申请日：2009-03-26
申请人： Hitachi Cable Fine Tech Ltd , Hitachi Cable Ltd , Hitachi Cable Trading Ltd , Jtekt Corp , 日立電線ファインテック株式会社 , 日立電線株式会社 , 日立電線販売株式会社 , 株式会社ジェイテクト
发明人： SANADA TAKAHIRO , NAKATANI YOSHIO , HAYAKAWA YOSHIKAZU , KIMOTO DAISUKE , NISHIDA SATOSHI
IPC分类号： H01R13/46 , H01R13/52
摘要： PROBLEM TO BE SOLVED: To provide a connector capable of enhancing the waterproof performance between an electric cable and a housing covering the outer peripheral portion of the electric cable without provision of a waterproof member.
SOLUTION: A connector is provided with a plurality of terminals 1, a plurality of cables each having a core wire connected to a corresponding one of the terminals 1 and a coating layer thats coat the core wire, and a housing 3 made of a synthetic resin for coating the outer peripheral portion of the terminal of each electric cable. The coating layer is formed of a synthetic resin containing the same kind of synthetic resin as the housing 3. By using the heat generated when the housing 3 is formed, the synthetic resin, which is of the kind of the synthetic resin that is contained in the housing 3 is melted, such that the coating layer and the housing 3 are integrally combined.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够提高电缆和覆盖电缆的外周部分的壳体之间的防水性能而不设置防水构件的连接器。解决方案：连接器设置有多个端子1，多个电缆，每个电缆具有连接到相应的一个端子1的芯线和涂覆芯线的涂层，以及由芯线制成的外壳3 用于涂覆每个电缆的端子的外周部分的合成树脂。涂层由含有与壳体3相同种类的合成树脂的合成树脂形成。通过使用在形成壳体3时产生的热量，合成树脂是合成树脂中包含的合成树脂壳体3熔化，使得涂层和壳体3一体地组合。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2013235985A Base material for semiconductor light emitting device and semiconductor light emitting device using the same 审中-公开
标题翻译：用于半导体发光器件的基底材料和使用该半导体发光器件的半导体发光器件
公开(公告)号：JP2013235985A
公开(公告)日：2013-11-21
申请号：JP2012107851
申请日：2012-05-09
申请人： Hitachi Cable Ltd , 日立電線株式会社 , Hitachi Cable Precision Co Ltd , 日立ケーブルプレシジョン株式会社
发明人： WADAYAMA YOSHIHIDE , TAKAHATA KAZUHIRO , INO MASANOBU
IPC分类号： H01L33/62 , H01L21/60 , H01L23/12 , H01L23/50 , H01L33/60
CPC分类号： H01L2224/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/48458 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a base material for a semiconductor light emitting device having a light-reflection/wire-bonding part which can maintain a high light-reflectance and a good junction between bonding wires for a long term by preventing sulfurization of a light-reflection layer, and the semiconductor light emitting device using the same.SOLUTION: A base material for a semiconductor light emitting device has a metal part in which a semiconductor light emitting element is mounted thereon and which is connected to the semiconductor light emitting element via a bonding wire. In the metal part, a light-reflection/wire-bonding part is formed on a surface side where the semiconductor light emitting element is mounted, the light-reflection/wire-bonding part has a structure in which a bonding layer consisting of Ag or Ni, a barrier layer consisting of Ti or Pd and a light reflection layer consisting of Al, are laminated in this order, a thickness of the light reflection layer is 0.03 μm or more and 0.5 μm or less and an average surface roughness of the light reflection layer is equal to or less than 0.1 μm.
摘要翻译：要解决的问题：为了提供一种具有光反射/引线接合部分的半导体发光器件的基材，该光反射/引线接合部分可以通过防止硫化而长时间保持高的光反射率和良好的接合线之间的接合光反射层和使用其的半导体发光器件。解决方案：用于半导体发光器件的基底材料具有其中安装有半导体发光元件并且连接到半导体发光元件的金属部分通过接合线。在金属部分中，在安装有半导体发光元件的表面侧上形成有光反射/引线接合部，光反射/引线接合部具有由Ag或 Ni，由Ti或Pd组成的阻挡层和由Al构成的光反射层按顺序层叠，光反射层的厚度为0.03μm以上且0.5μm以下，光的平均表面粗糙度反射层等于或小于0.1μm。

3. 发明专利

JP2012174610A Method for manufacturing wire covered with porous ultraviolet curable resin composition 审中-公开
标题翻译：用多孔超紫外线固化树脂组合物制造线的方法
公开(公告)号：JP2012174610A
公开(公告)日：2012-09-10
申请号：JP2011037607
申请日：2011-02-23
申请人： Hitachi Cable Ltd , Hitachi Cable Fine Tech Ltd , 日立電線ファインテック株式会社 , 日立電線株式会社
发明人： KATO YOSHIHISA , ABE TOMIYA , MIWA TAKAO , WATANABE KIYOSHI , KUROSAWA YOSHINORI , SEYA OSAMU , KO TOKUTEN
IPC分类号： H01B13/16 , C08J9/28
摘要： PROBLEM TO BE SOLVED: To provide a wire covered with a porous ultraviolet curable resin composition having a stable outer diameter by reducing the influence of heat from a light source radiating ultraviolet light.SOLUTION: A method for manufacturing a wire covered with a porous ultraviolet curable resin composition comprises the steps of: covering an outer periphery of a metal conductor with an ultraviolet curable resin composition, in which a hydrated water absorbent polymer that is water-absorbed and swollen is distributed therein; and irradiating the ultraviolet curable resin composition covering the outer periphery of the metal conductor with ultraviolet light to cure by crosslinking of the ultraviolet curable resin composition, and also making the composition porous by dehydrating the hydrated water absorbent polymer. At a first ultraviolet light radiating furnace that irradiates the ultraviolet curable resin composition with ultraviolet light, the ultraviolet curable resin composition is irradiated with ultraviolet light in a coolant for cooling the composition to be cured by crosslinking, and after that, the hydrated water absorbent polymer is dehydrated.
摘要翻译：要解决的问题：通过减少来自辐射紫外线的光源的热量的影响，提供覆盖有具有稳定外径的多孔紫外线固化树脂组合物的线。解决方案：一种用多孔紫外线固化树脂组合物覆盖的线材的制造方法，包括以下步骤：用紫外线固化树脂组合物覆盖金属导体的外周，其中，水溶性吸水性聚合物是水溶性聚合物，吸收和肿胀分布在其中; 用紫外线照射覆盖金属导体的外周的紫外线固化性树脂组合物，通过紫外线硬化性树脂组合物的交联进行固化，通过使水合吸水性聚合物脱水，使组合物多孔化。在用紫外线照射紫外线固化型树脂组合物的第一紫外线辐射炉中，将紫外线固化型树脂组合物用紫外线照射在冷却剂中以冷却通过交联固化的组合物，然后将水合吸水性聚合物脱水版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2012109529A SUBSTRATE FOR MOUNTING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND SEMICONDUCTOR LIGHT-EMITTING DEVICE USING THE SAME 审中-公开
公开(公告)号：JP2012109529A
公开(公告)日：2012-06-07
申请号：JP2011157252
申请日：2011-07-16
申请人： HITACHI CABLE , HITACHI CABLE PREC CO LTD
发明人： WAJIMA MINEO , MIWA TAKAO , WADAYAMA YOSHIHIDE , CHINDA SATOSHI , TAKAHATA KAZUHIRO , KAWANOBE SUNAO , OKABE NORIO , INO MASANOBU , OKUMA AKIRA
IPC分类号： H01L33/62 , H01L23/28 , H01L33/60
摘要： PROBLEM TO BE SOLVED: To provide a substrate for mounting a semiconductor light-emitting element, which is not sulfurized and thus can ensure a high reflectance, and to provide a semiconductor light-emitting device using the same.SOLUTION: The substrate for mounting a semiconductor light-emitting element includes: a base 2 comprising a metal part; and an aluminum reflective layer 4 with a thickness of 0.02 to 5 μm inclusive, which is provided on that surface side of the base 2 on which the semiconductor light-emitting element is to be mounted.

5. 发明专利

JP2011198677A Cable for differential signal, cable assembly using the same, and cable for multi-pair differential signal 有权
标题翻译：用于差分信号的电缆，使用该电缆的电缆组件，以及用于多对信号的电缆
公开(公告)号：JP2011198677A
公开(公告)日：2011-10-06
申请号：JP2010065981
申请日：2010-03-23
申请人： Hitachi Cable Fine Tech Ltd , Hitachi Cable Ltd , 日立電線ファインテック株式会社 , 日立電線株式会社
发明人： SUGIYAMA TAKEHIRO , NAMISE HIDEKI , TSUKAMOTO YOSHINORI
IPC分类号： H01B11/00 , H01B7/00 , H01B7/02 , H01B7/08 , H01B11/08 , H01R12/53
CPC分类号： H01B11/203 , H01B11/1016 , H01B11/1025 , H01B11/1091
摘要： PROBLEM TO BE SOLVED: To provide a cable for a differential signal, wherein in the cable for the differential signal used for high-speed transmission of a number Gbit/s or more, when connected and mounted on a connector built-in printed circuit board or the like, mismatch in characteristic impedance in a connecting part between the cable and the printed circuit board can be reduced, and the increase in skew as difference of a signal traveling period and the increase (deterioration) of a differential and in-phase conversion amount can be suppressed.SOLUTION: The cable 100 for the differential signal includes: two insulating wires 3 composed of a conductive wire 1 and an insulator 2 to cover the conductive wire 1 and installed in parallel contact; fused layers 6 each installed at a surface of the two insulating wires 3; a drain wire 4 vertically supported by a recessed part 7 formed between the two insulating wires 3; and a shield tape 5 to collectively wind the two insulating wires 3 and the drain wire 4. Respective two insulating wires 3 are deformed to form a flat face 2a at one part of the surface of the insulator 2, and fused so as to be mutually contacted at the flat face 2a.
摘要翻译：要解决的问题：提供用于差分信号的电缆，其中在用于高速传输数Gbit / s以上的差分信号的电缆中，当连接并安装在连接器内置的印刷电路板可以减少电缆和印刷电路板之间的连接部分中的特性阻抗的不匹配，并且随着信号行进周期的差异和差分和同相转换的增加（劣化）的偏差增加可以抑制量。解决方案：差分信号的电缆100包括：由导线1和绝缘体2组成的两根绝缘导线3，用于覆盖导线1并且并联安装; 每个安装在两个绝缘线3的表面上的熔融层6; 由形成在两个绝缘线3之间的凹部7垂直支撑的排线4; 以及屏蔽带5，以共同地缠绕两根绝缘线3和排线4.各绝缘线3变形，以在绝缘体2的表面的一部分处形成平坦面2a，并且相互熔合在平面2a处接触。

6. 发明专利

JP2011091168A Solar cell lead wire and method of manufacturing the same, and solar cell using the same 有权
标题翻译：太阳能电池引线及其制造方法及使用其的太阳能电池
公开(公告)号：JP2011091168A
公开(公告)日：2011-05-06
申请号：JP2009242775
申请日：2009-10-21
申请人： Hitachi Cable Fine Tech Ltd , Hitachi Cable Ltd , 日立電線ファインテック株式会社 , 日立電線株式会社
发明人： HIGASHITANI IKU , KIMOTO KUNIAKI , AKUTSU HIROYUKI , ITO YUKIO , NISHI HAJIME , TAKAHASHI TAKESHI , KURODA HIROMITSU , OKIKAWA HIROSHI
IPC分类号： H01L31/042
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a solar cell lead wire with high cell cracking suppression effect and bonding reliability and a method of manufacturing the same, and a solar cell using the same. SOLUTION: The solar cell lead wire has a molten solder plating layer 13 formed on a surface of a belt-like conductive material 12 formed in a flat shape, wherein the belt-like conductive material 12 has a 0.2% proof stress value of ≤90 MPa by a tensile test, and the molten solder plating layer 13 is formed flatly. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供具有高电池破裂抑制效果和接合可靠性的太阳能电池引线及其制造方法，以及使用该太阳能电池引线的太阳能电池。
解决方案：太阳能电池引线具有形成在平坦形状的带状导电材料12的表面上的熔融焊料镀层13，其中带状导电材料12具有0.2％的屈服应力值的拉伸试验为≤90MPa，熔融焊料镀层13平坦地形成。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2010248589A Method and device for hot-dip plating of wire rod 审中-公开
标题翻译：方法和装置用于热镀锌线
公开(公告)号：JP2010248589A
公开(公告)日：2010-11-04
申请号：JP2009101223
申请日：2009-04-17
申请人： Hitachi Cable Fine Tech Ltd , Hitachi Cable Ltd , 日立電線ファインテック株式会社 , 日立電線株式会社
发明人： TSUJI TAKAYUKI , FUJITO KEISUKE , ITO MASATO
IPC分类号： C23C2/38
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for hot-dip plating of a wire rod, which is excellent in uniformity of plating thickness, and stably attains uneven thickness of 20% or less.
SOLUTION: In the method for hot-dip plating which forms a hot-dip plating layer by continuously dipping a metal wire rod 11 in a plating bath holding hot-dip plating liquid 12, a part which pulls out the wire rod 11 upward from the hot water surface 121 of the plating bath is surrounded by a tension liquid level forming tube 17, and the tension liquid level forming tube 17 is formed to have an inner diameter in which a plating hot bath level surrounded by the tension liquid level forming tube 17 does not have the horizontal surface to perform hot-dip plating to the wiring rod 11.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种电镀厚度均匀性优异的线材的热浸镀方法和装置，并且稳定地获得20％以下的不均匀厚度。解决方案：在通过将金属线材11连续浸渍在保持热浸镀液12的镀浴中形成热浸镀层的热浸镀方法中，拉出线材11的部分从电镀槽的热水面121向上方被张力液位形成管17包围，张力液位形成管17形成为具有被拉伸液面包围的电镀热水位的内径成型管17不具有水平表面以对布线棒11进行热浸镀。版权所有：（C）2011，JPO＆INPIT

8. 发明专利

JP2010199228A Wiring component for solar cell and method of manufacturing the same, and solar cell module 审中-公开
标题翻译：用于太阳能电池的配线组件及其制造方法和太阳能电池模块
公开(公告)号：JP2010199228A
公开(公告)日：2010-09-09
申请号：JP2009041058
申请日：2009-02-24
申请人： Hitachi Cable Fine Tech Ltd , Hitachi Cable Ltd , 日立電線ファインテック株式会社 , 日立電線株式会社
发明人： TAKAHASHI TAKESHI , NISHI HAJIME , NEMOTO SHINJI , SAWAHATA KATSUNORI
IPC分类号： H01L31/042
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive and high-reliability wiring component for a solar cell and a method of manufacturing the same, and a solar cell module. SOLUTION: The wiring component 1 for a solar cell has an insulating substrate 12 and a plurality of conductors 11 provided on the insulating substrate 12. Each outer peripheral surface of the plurality of conductors 11 is applied with plating. Each conductor 11 is partially cut. The wiring component for a solar cell also has each conductive plate 13 that electrically connects between the plurality of conductors 11. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于太阳能电池的便宜且高可靠性的布线部件及其制造方法以及太阳能电池模块。解决方案：用于太阳能电池的配线部件1具有绝缘基板12和设置在绝缘基板12上的多个导体11.多根导体11的每个外周表面都镀有电镀。每个导体11被部分切割。用于太阳能电池的布线组件也具有电连接在多个导体11之间的每个导电板13.版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2009015454A Wireless communication module and electric-electronic appliance 审中-公开
标题翻译：无线通信模块和电子电器
公开(公告)号：JP2009015454A
公开(公告)日：2009-01-22
申请号：JP2007174382
申请日：2007-07-02
申请人： Hitachi Cable Fine Tech Ltd , Hitachi Cable Ltd , 日立電線ファインテック株式会社 , 日立電線株式会社
发明人： YAMANOBE HIROSHI , FUKUCHI KEISUKE , KO TOKUTEN , KUNII MASASHI , KOMATSU HIROAKI , NAGAI HIDEJI , NEMOTO SHINJI , KIYOHARA HIDETOSHI , ENDO KATSUO
IPC分类号： G06K19/077 , G06K19/07 , H01Q7/00 , H04B5/02
摘要： PROBLEM TO BE SOLVED: To provide a low-cost wireless communication module incorporated in a mobile appliance terminal or the like, having a stable communication characteristic, and to provide an electric-electronic appliance therewith. SOLUTION: This wireless communication module comprises: an IC chip module; a loop antenna portion comprising an electric cable wherein a conductor connected to the IC chip module is insulatively covered; and a frame having a groove for fitting in and holding the electric cable. COPYRIGHT: (C)2009,JPO&INPIT

10. 发明专利

JP2008243576A Flat cable, and its manufacturing method 审中-公开
标题翻译：平板电缆及其制造方法
公开(公告)号：JP2008243576A
公开(公告)日：2008-10-09
申请号：JP2007082160
申请日：2007-03-27
申请人： Hitachi Cable Fine Tech Ltd , Hitachi Cable Ltd , 日立電線ファインテック株式会社 , 日立電線株式会社
发明人： YAMANOBE HIROSHI , ITO MASATO , TSUJI TAKAYUKI , KOBAYASHI HIDENORI
IPC分类号： H01B7/08 , H01B7/00 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a flat cable capable of balancing whisker resistance with solder joinability by subjecting one-side terminals to connector fitting and the other-side terminals to solder joining; and its manufacturing method. SOLUTION: This flat cable is composed by laminating and integrating upper and lower surfaces of one or more solder-plated rectangular conductors 2 arranged in parallel to one another by laminating a film 1 with an adhesive having an insulation property, wherein one-side terminals 5 and the other-side terminals 6 are subjected to connector fitting and to solder joining, respectively. In the flat cable, the solder-plated rectangular conductor 2 is formed by plating pure Sn to a base material formed of pure copper or a copper alloy; and the total thickness of solder plating is set to 0.5-1.0 μm on the connector fitting side and to 1-3 μm on the solder joining side. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：通过使一侧端子与连接器配合和另一端端子进行焊接来提供能够平衡晶须阻力与焊料接合性的扁平电缆; 及其制造方法。解决方案：该扁平电缆通过层压并整合一个或多个焊接的扁平扁平导体2的上表面和下表面，该矩形导体2通过用具有绝缘性质的粘合剂层压薄膜1而彼此平行布置，侧端子5和另一侧端子6分别进行连接器配合和焊接。在扁平电缆中，通过将纯Sn镀到由纯铜或铜合金形成的基材上形成焊接的矩形导体2; 并且焊接电镀的总厚度在连接器配合侧设定为0.5-1.0μm，在焊料接合侧设定为1-3μm。版权所有（C）2009，JPO＆INPIT

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