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11. 发明申请

US20130037314A1 BONDING MATERIAL, BONDED PORTION AND CIRCUIT BOARD 有权
标题翻译：粘接材料，粘结部分和电路板
公开(公告)号：US20130037314A1
公开(公告)日：2013-02-14
申请号：US13616401
申请日：2012-09-14
申请人： Atsushi Yamaguchi , Kazuhiro Nishikawa , Hidenori Miyakawa
发明人： Atsushi Yamaguchi , Kazuhiro Nishikawa , Hidenori Miyakawa
IPC分类号： C22C12/00 , B23K35/24 , H05K1/02 , C22C30/04
CPC分类号： H05K3/321 , B23K35/025 , B23K35/26 , B23K35/262 , B23K35/264 , B23K35/3613 , B23K35/3618 , B23K35/362 , H01B1/22 , H05K3/3484 , Y10T403/479 , Y10T428/31678
摘要： Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material.
摘要翻译：公开了一种焊接材料，其能够在安装电子部件时实现较低的安装温度。还公开了焊膏和导电粘合剂。具体公开了具有由Sn，Bi和In构成的基本组成的焊料。该焊料材料还可含有选自Cu，Ge和Ni中的至少一种金属。可以通过将助焊剂成分混合到焊料材料中来获得能够实现低温安装的焊膏。可以通过将树脂成分混合到焊料材料中来获得能够实现低温安装的导电粘合剂。

12. 发明授权

US08345444B2 Structure with electronic component mounted therein and method for manufacturing such structure 有权
标题翻译：安装有电子部件的结构及其制造方法
公开(公告)号：US08345444B2
公开(公告)日：2013-01-01
申请号：US12675080
申请日：2008-10-21
申请人： Shigeaki Sakatani , Koso Matsuno , Atsushi Yamaguchi , Hidenori Miyakawa , Mikiya Ueda
发明人： Shigeaki Sakatani , Koso Matsuno , Atsushi Yamaguchi , Hidenori Miyakawa , Mikiya Ueda
IPC分类号： H05K1/11
CPC分类号： H05K3/305 , H01L21/563 , H01L23/295 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/12044 , H01L2924/15151 , H01L2924/18301 , H05K2201/09036 , H05K2201/09072 , H05K2201/10545 , H05K2201/10674 , H05K2201/10734 , H05K2201/10977 , Y02P70/613 , Y10T29/49139 , H01L2924/00
摘要： A structure with electronic component mounted therein includes a wiring board on which an electronic component is mounted at least on its first face, resin provided at least between the electronic component and the wiring board, and a plurality of holes formed in the wiring board at region corresponding to a mounting position of the electronic component. The holes are filled with the resin. This suppresses warpage of the structure with electronic component mounted therein, and also improves reliability by reducing a stress applied to a bonding section between the wiring board and the electronic component.
摘要翻译：安装有电子部件的结构包括：至少在其第一面上安装有电子部件的布线板，至少设置在电子部件和布线基板之间的树脂，以及在布线基板上形成的多个孔对应于电子部件的安装位置。孔用树脂填充。这抑制了安装有电子部件的结构的翘曲，并且还通过减小施加到布线板和电子部件之间的接合部的应力来提高可靠性。

13. 发明授权

US08330181B2 Semiconductor light-emitting device 有权
标题翻译：半导体发光装置
公开(公告)号：US08330181B2
公开(公告)日：2012-12-11
申请号：US12452059
申请日：2008-05-14
申请人： Nobuaki Matsui , Atsushi Yamaguchi
发明人： Nobuaki Matsui , Atsushi Yamaguchi
IPC分类号： H01L33/00
CPC分类号： H01L33/38 , H01L33/405 , H01L33/46
摘要： A semiconductor light-emitting device capable of increasing an amount of light irradiated to the outside is provided.A semiconductor light-emitting device (1) includes a substrate (2), an n-type semiconductor layer (3), a light-emitting layer (4), a p-type semiconductor layer (5), an n-side pad electrode (6), an n-side pad electrode (7), a p-side electrode (8), a reflecting layer (9), and a p-side pad electrode (10). The n-side pad electrode (7) is electrically connected to the n-type semiconductor layer (3) via the n-side pad electrode (6). The p-side pad electrode (10) is electrically connected to the p-type semiconductor layer (5) via the p-side electrode (8). A connection surface (7a) of the n-side pad electrode (7) connected to the n-type semiconductor layer (3) is arranged in a first area (Ar1) closer to a short side (2b) on an arrow B direction-side, and a connection surface (10a) of the p-side pad electrode (10) connected to the p-type semiconductor layer (5) is arranged in a fourth area (Ar4) closest to a short side (2b) on an arrow A direction-side among the first area (Ar1) to the fourth area (Ar4) formed by equally dividing the substrate (2) into four.
摘要翻译：提供能够增加照射到外部的光量的半导体发光装置。半导体发光器件（1）包括衬底（2），n型半导体层（3），发光层（4），p型半导体层（5），n侧衬垫电极（6），n侧焊盘电极（7），p侧电极（8），反射层（9）和p侧焊盘电极（10）。 n侧焊盘电极（7）经由n侧焊盘电极（6）与n型半导体层（3）电连接。 p侧焊盘电极（10）经由p侧电极（8）与p型半导体层（5）电连接。与n型半导体层（3）连接的n侧焊盘电极（7）的连接面（7a）配置在靠近箭头B方向的短边（2b）的第一区域（Ar1）并且连接到p型半导体层（5）的p侧焊盘电极（10）的连接表面（10a）被布置在最靠近短边（2b）的箭头的第四区域（Ar4）中在通过将基板（2）等分成四个而形成的第一区域（Ar1）至第四区域（Ar4）中的方向侧。

14. 发明申请

US20120243985A1 AXIAL BLOWER 审中-公开
标题翻译：轴流风机
公开(公告)号：US20120243985A1
公开(公告)日：2012-09-27
申请号：US13425688
申请日：2012-03-21
申请人： Kazuhiro NITTA , Akira UEDA , Atsushi YAMAGUCHI , Akihiro OTSUKA , Tadashi KATSUI
发明人： Kazuhiro NITTA , Akira UEDA , Atsushi YAMAGUCHI , Akihiro OTSUKA , Tadashi KATSUI
IPC分类号： F04D29/52 , F04D19/00
CPC分类号： F04D29/681 , F04D25/0613 , F04D29/526 , F04D29/685
摘要： An axial blower includes a moving vane generating air flow by rotation, a casing accommodating said moving vane, and an adapter detachably attached to the casing. The adapter includes a fitting part to be fit to an inner surface of the casing. The adapter forms a protrusion or a step on the inner surface of the casing.
摘要翻译：轴流鼓风机包括通过旋转产生空气流的移动叶片，容纳所述活动叶片的壳体和可拆卸地附接到壳体的适配器。适配器包括配合到壳体内表面的配合部件。适配器在壳体的内表面上形成突起或台阶。

15. 发明申请

US20120120613A1 ELECTRONIC MODULE AND PRODUCTION METHOD THEREFOR 有权
标题翻译：电子模块及其生产方法
公开(公告)号：US20120120613A1
公开(公告)日：2012-05-17
申请号：US13384502
申请日：2010-07-15
申请人： Ryo Kuwabara , Atsushi Yamaguchi , Masahiro Ono , Hidenori Miyakawa
发明人： Ryo Kuwabara , Atsushi Yamaguchi , Masahiro Ono , Hidenori Miyakawa
IPC分类号： H05K7/00 , H05K3/32
CPC分类号： H05K3/284 , H01L21/561 , H01L21/565 , H01L23/3121 , H01L23/552 , H01L25/165 , H01L2224/16225 , H01L2924/01019 , H01L2924/3025 , H01L2924/3511 , H05K1/0218 , H05K1/0313 , H05K2203/1316
摘要： An electronic module 10 includes: a circuit board 12 having a first surface and a second surface opposite the first surface; and a plurality of electronic components 14 mounted thereon. The electronic components 14 are sealed at the first surface of the circuit board 12, with a mold body 16 composed of a resin composition. A shield layer 28 is formed on the surface of the mold body 16. The glass transition temperature of a resin included in the mold body 16 is higher than the glass transition temperatures of resins included in the circuit board 12 and the shield layer 28, respectively. The modulus of elasticity of the mold body at 25° C. is 10 to 18 GPa, and the thickness of the circuit board is 0.3 to 1.0 mm.
摘要翻译：电子模块10包括：具有第一表面和与第一表面相对的第二表面的电路板12; 以及安装在其上的多个电子部件14。电子部件14被密封在电路板12的第一表面，模具体16由树脂组合物构成。屏蔽层28形成在模体16的表面上。包括在模体16中的树脂的玻璃化转变温度分别高于包括在电路板12和屏蔽层28中的树脂的玻璃化转变温度。模具体在25℃下的弹性模量为10〜18GPa，电路基板的厚度为0.3〜1.0mm。

16. 发明授权

US08179686B2 Mounted structural body and method of manufacturing the same 有权
标题翻译：安装结构体及其制造方法
公开(公告)号：US08179686B2
公开(公告)日：2012-05-15
申请号：US12259661
申请日：2008-10-28
申请人： Shigeaki Sakatani , Atsushi Yamaguchi , Koso Matsuno , Hidenori Miyakawa
发明人： Shigeaki Sakatani , Atsushi Yamaguchi , Koso Matsuno , Hidenori Miyakawa
IPC分类号： H05K7/00
CPC分类号： H05K3/305 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/92125 , H01L2924/01079 , H01L2924/15151 , H05K2201/09063 , H05K2201/09781 , H05K2201/10674 , H05K2201/10689 , H05K2201/10719 , H05K2201/10977 , Y02P70/613 , Y10T29/4913 , H01L2924/00
摘要： Including a wiring board having an electronic component mounted at least on a first surface, a resin applied at least between the electronic component and the wiring board, and a through-hole provided in a region corresponding to the mounting position of the electronic component in the wiring board, a protrusion is formed on the wiring board so as to overlap at least with the electronic component, around a region corresponding to the mounting position of the electronic component.
摘要翻译：包括具有至少安装在第一表面上的电子部件的布线板，至少施加在电子部件和布线板之间的树脂，以及设置在与电子部件的安装位置对应的区域中的通孔在布线基板上，至少与电子部件重叠，在与电子部件的安装位置对应的区域上形成突起。

17. 发明申请

US20120073869A1 CONDUCTIVE ADHESIVE, AND CIRCUIT BOARD AND ELECTRONIC COMPONENT MODULE USING THE SAME 有权
标题翻译：导电胶，电路板和电子元件组件
公开(公告)号：US20120073869A1
公开(公告)日：2012-03-29
申请号：US13240043
申请日：2011-09-22
申请人： Arata KISHI , Naomichi OHASHI , Atsushi YAMAGUCHI
发明人： Arata KISHI , Naomichi OHASHI , Atsushi YAMAGUCHI
IPC分类号： H05K1/02 , C09J9/02
CPC分类号： C09J9/02 , C08K3/08 , C08K5/09 , C09J11/04 , H01L21/4853 , H01L23/49811 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/1329 , H01L2224/13313 , H01L2224/16225 , H01L2224/16227 , H01L2224/81192 , H01L2224/8122 , H01L2224/81874 , H01L2924/00013 , H01L2924/15787 , H05K3/12 , H05K3/321 , H05K3/4069 , H05K2201/0272 , H05K2203/0425 , H01L2924/0105 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00014 , H01L2924/00
摘要： A conductive adhesive includes 10 to 90 wt % of Sn—Bi system solder powder and the remainder of an adhesive containing organic acid, and the Sn—Bi system solder powder is composed of solder particles having a particle size L1 of 20 to 30 μm and solder particles having a particle size L2 of 8 to 12 μm, and a mixing ratio of the Sn—Bi system solder powder is such that the solder particles having a particle size of 20 to 30 μm occupy 40 to 90 wt % with respect to the whole solder powder, and the remainder is occupied by solder particles having a particle size of 8 to 12 μm.
摘要翻译：导电性粘合剂包含10〜90重量％的Sn-Bi系焊料粉末和剩余的含有机酸的粘合剂，Sn-Bi系焊料粉末由粒径为20〜30μm的焊料粒子构成，粒径为8〜12μm的焊料粒子和Sn-Bi系焊料粉末的混合比例使得粒径为20〜30μm的焊料粒子相对于粒子的粒径为40〜90重量％整个焊料粉末，其余部分被粒径为8至12μm的焊料颗粒所占据。

18. 发明申请

US20120063606A1 SOUND PRESSURE PREDICTION APPARATUS, SOUND PRESSURE PREDICTION METHOD, AND INFORMATION STORAGE MEDIUM 有权
标题翻译：声压预测装置，声压预测方法和信息存储介质
公开(公告)号：US20120063606A1
公开(公告)日：2012-03-15
申请号：US13227175
申请日：2011-09-07
申请人： Hiroyuki Furuya , Atsushi Yamaguchi , Kazuhiro Nitta
发明人： Hiroyuki Furuya , Atsushi Yamaguchi , Kazuhiro Nitta
IPC分类号： H04R29/00
CPC分类号： G01H3/14
摘要： A sound pressure level prediction apparatus includes a storage unit for storing measured sound pressure levels. The sound pressure level prediction apparatus also includes an acquisition unit configured to acquire sound pressure levels measured at a plurality of locations for a first fan and at least one sound pressure level for a second fan, and the at least one sound pressure level being measured at the same location as at least one of the plurality of locations used for measuring the sound pressure levels for the first fan. The sound pressure level prediction apparatus further includes a prediction unit configured to predict, based on the acquired sound pressure levels of the first fan and the at least one sound pressure level for the second fan, a sound pressure level for the second fan at a location where the sound pressure level for the second fan has not yet been measured.
摘要翻译：声压级预测装置包括用于存储测量的声压级的存储单元。声压级预测装置还包括获取单元，其被配置为获取在第一风扇的多个位置处测量的声压级和用于第二风扇的至少一个声压级，并且至少一个声压级在与用于测量第一风扇的声压级的多个位置中的至少一个位置相同的位置。声压级预测装置还包括预测单元，其被配置为基于所获取的第一风扇的声压级和第二风扇的至少一个声压级来预测在位置处的第二风扇的声压级其中第二风扇的声压级尚未被测量。

19. 发明申请

US20110272665A1 Nitride semiconductor device 有权
标题翻译：氮化物半导体器件
公开(公告)号：US20110272665A1
公开(公告)日：2011-11-10
申请号：US13067042
申请日：2011-05-04
申请人： Atsushi Yamaguchi , Norikazu Ito , Shinya Takado
发明人： Atsushi Yamaguchi , Norikazu Ito , Shinya Takado
IPC分类号： H01L29/15
CPC分类号： H01L29/155 , H01L21/02381 , H01L21/02458 , H01L21/02507 , H01L21/0254 , H01L29/2003 , H01L29/452 , H01L29/475 , H01L29/66462 , H01L29/7787
摘要： An inventive nitride semiconductor device includes: a substrate; a first buffer layer provided on the substrate, and having a superlattice structure which includes two types of Group III nitride semiconductor sublayers having different compositions and alternately stacked in pairs; a second buffer layer provided on the first buffer layer in contact with the first buffer layer, and having a superlattice structure which includes two types of Group III nitride semiconductor sublayers having different compositions and alternately stacked in pairs; and a device operation layer of a Group III nitride semiconductor provided on the second buffer layer; wherein an average lattice constant LC1 of the first buffer layer, an average lattice constant LC2 of the second buffer layer and an average lattice constant LC3 of the device operation layer satisfy the following expression (1): LC1
摘要翻译：本发明的氮化物半导体器件包括：衬底; 设置在基板上的第一缓冲层，具有超晶格结构，其包括具有不同组成的两种类型的III族氮化物半导体子层，并成对地交替堆叠; 设置在与第一缓冲层接触的第一缓冲层上的第二缓冲层，并且具有超晶格结构，其包括具有不同组成的两种类型的III族氮化物半导体子层，并成对地堆叠; 以及设置在所述第二缓冲层上的第III族氮化物半导体的器件工作层; 其中第一缓冲层的平均晶格常数LC1，第二缓冲层的平均晶格常数LC2和器件工作层的平均晶格常数LC3满足下式（1）：LC1

20. 发明申请

US20110142612A1 COUNTER-ROTATING AXIAL FLOW FAN 有权
标题翻译：逆转轴流风扇
公开(公告)号：US20110142612A1
公开(公告)日：2011-06-16
申请号：US12967200
申请日：2010-12-14
申请人： Chisachi Kato , Atsushi Yamaguchi , Akira Ueda , Kazuhiro Nitta , Akihiro Otsuka , Tadashi Katsui , Masahiro Suzuki , Yoshihiko Aizawa , Honami Oosawa
发明人： Chisachi Kato , Atsushi Yamaguchi , Akira Ueda , Kazuhiro Nitta , Akihiro Otsuka , Tadashi Katsui , Masahiro Suzuki , Yoshihiko Aizawa , Honami Oosawa
IPC分类号： F04D29/44 , F03D1/02
CPC分类号： F04D29/544 , F04D19/007 , F04D19/024 , F04D29/663
摘要： A counter-rotating axial flow fan in which the shape of stationary blades of a middle stationary portion is optimized to reduce noise is provided. Defining the maximum axial chord length of front blades as Lf, the maximum axial chord length of rear blades as Lr, and the maximum axial chord length of stationary blades as Lm, a relationship of Lm/(Lf+Lr) 5.8.
摘要翻译：提供了一种反向旋转轴流风扇，其中中间静止部分的固定叶片的形状被优化以降低噪声。将前刀片的最大轴向长度定义为Lf，后刀片的最大轴向弦长度为Lr，固定刀片的最大轴向弦长为Lm，满足Lm /（Lf + Lr）<0.14的关系。定义固定叶片下表面的叶片和下表面之间的最大尺寸为K1，固定叶片的最大轴向弦长Lm满足Lm / K1> 5.8的关系。

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