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11. 发明授权

US07860357B2 Optoelectronic device chip having a composite spacer structure and method making same 有权
标题翻译：具有复合间隔结构的光电器件芯片及其制造方法
公开(公告)号：US07860357B2
公开(公告)日：2010-12-28
申请号：US12228102
申请日：2008-08-09
申请人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： G02B6/12
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/481 , H01L27/14683 , H01L2223/6622 , H01L2224/274 , H01L2924/01079 , H01L2924/07811 , H01L2924/00
摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
摘要翻译：公开了一种光电器件芯片及其制造方法。芯片包括器件基板，光学透明上基板和复合间隔层，其包括粘合材料和分散在所述粘合材料中的多个颗粒。器件基板和上基板之间的距离由复合间隔层的厚度控制，使得该变化在光学系统的焦深范围内。

12. 发明申请

US20100219433A1 LIGHT EMITTING DEVICES 有权
标题翻译：发光装置
公开(公告)号：US20100219433A1
公开(公告)日：2010-09-02
申请号：US12395086
申请日：2009-02-27
申请人： Tzy-Ying LIN , Chun-Chiang Yen , Wu-Cheng Kuo
发明人： Tzy-Ying LIN , Chun-Chiang Yen , Wu-Cheng Kuo
IPC分类号： H01L33/00
CPC分类号： H01L33/508 , H01L24/05 , H01L24/06 , H01L24/48 , H01L2224/04042 , H01L2224/05556 , H01L2224/05599 , H01L2224/48091 , H01L2224/48463 , H01L2224/85399 , H01L2924/00014 , H01L2924/01013 , H01L2924/01055 , H01L2924/01058 , H01L2924/01064 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2224/45099 , H01L2924/00
摘要： Light emitting devices conformally covered by a luminescent material layer are presented. A light emitting device includes a semiconductor light emitting die attached to a substrate. At least one bond pad is disposed on the semiconductor light emitting die. A luminescent material layer conformally covers the semiconductor light emitting die, wherein the luminescent material layer has at least one opening corresponding to and exposing the at least one bond pad. At least one wirebond is electrically connected to the at least one bond pad and a contact pad on the substrate.
摘要翻译：呈现由发光材料层共形覆盖的发光器件。发光器件包括附接到衬底的半导体发光芯片。至少一个接合焊盘设置在半导体发光管芯上。发光材料层共形地覆盖半导体发光管芯，其中发光材料层具有至少一个对应于并暴露至少一个焊盘的开口。至少一个引线键电连接到所述至少一个接合焊盘和所述衬底上的接触焊盘。

13. 发明申请

US20080303109A1 Optoelectronic device chip having a composite spacer structure and method making same 有权
公开(公告)号：US20080303109A1
公开(公告)日：2008-12-11
申请号：US12228102
申请日：2008-08-09
申请人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/481 , H01L27/14683 , H01L2223/6622 , H01L2224/274 , H01L2924/01079 , H01L2924/07811 , H01L2924/00
摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.

14. 发明授权

US06309976B1 Critical dimension controlled method of plasma descum for conventional quarter micron and smaller dimension binary mask manufacture 有权
标题翻译：用于常规四分之一微米和较小维二进制掩模制造的等离子体除垢的关键尺寸控制方法
公开(公告)号：US06309976B1
公开(公告)日：2001-10-30
申请号：US09272532
申请日：1999-03-22
申请人： Tzy-Ying Lin , Cheng-Lung Duan , Tsung-Wen Tien
发明人： Tzy-Ying Lin , Cheng-Lung Duan , Tsung-Wen Tien
IPC分类号： H01L21302
CPC分类号： G03F1/68 , G03F1/80
摘要： A method of forming a mask from a metal layer deposited upon a substrate patterned for exposure of a workpiece to radiation of a specific range of wavelengths with the substrate being transparent to the radiation comprises the following steps. Form the metal layer superjacent to the substrate. Form a photoresist layer superjacent to the metal layer. Expose the photoresist layer to a pattern. Develop the photoresist to Form a photoresist mask with an opening therethrough. Bake the photoresist mask, the metal layer and the substrate. Perform a descum operation. Perform an isotropic etching of the metal layer through the opening in the mask. Perform an after etching inspection measurement. Strip the photoresist mask. Perform an after stripping inspection measurement. The isotropic etching is performed with a wet etchant. The descum operation is performed with a dry plasma process including oxygen and nitrogen gases and an inert gas selected from argon and helium.
摘要翻译：从沉积在被图案化的衬底上的金属层形成掩模的方法，其中所述衬底被图案化以将工件暴露于特定波长范围的辐射，其中衬底对辐射是透明的，包括以下步骤。形成与衬底相邻的金属层。形成与金属层相邻的光致抗蚀剂层。将光致抗蚀剂层暴露于图案。开发光致抗蚀剂以形成具有开口的光致抗蚀剂掩模。烘烤光刻胶掩模，金属层和基材。执行除法操作。通过掩模中的开口进行金属层的各向同性蚀刻。进行蚀刻检查测量。剥去光刻胶掩模。进行剥离检查测量。用湿蚀刻剂进行各向同性蚀刻。除氧操作通过包括氧气和氮气的干等离子体工艺和选自氩气和氦气的惰性气体进行。

15. 发明申请

US20110069395A1 LENS ASSEMBLY AND METHOD FOR FORMING THE SAME 有权
标题翻译：镜头组件及其形成方法
公开(公告)号：US20110069395A1
公开(公告)日：2011-03-24
申请号：US12565325
申请日：2009-09-23
申请人： Tzy-Ying LIN , Chieh-Yuan Cheng
发明人： Tzy-Ying LIN , Chieh-Yuan Cheng
IPC分类号： G02B27/10 , B32B38/10 , B29D11/00
CPC分类号： H01L27/14625 , H01L27/14685
摘要： According to embodiments of the invention, a lens assembly and method for forming the same is provided. The method includes providing a first lens layer having a first transparent substrate and a first lens on the first transparent substrate, providing a second lens layer having a second transparent substrate and a second lens on the second transparent substrate, forming a spacer structure between the first lens layer and the second lens layer, and thinning the first transparent substrate to a first thickness after the spacer is formed.
摘要翻译：根据本发明的实施例，提供了一种用于形成其的透镜组件及其方法。该方法包括在第一透明衬底上提供具有第一透明衬底和第一透镜的第一透镜层，在第二透明衬底上提供具有第二透明衬底和第二透镜的第二透镜层，在第一透明衬底之间形成间隔结构，透镜层和第二透镜层，并且在形成间隔物之后将第一透明基板细化为第一厚度。

16. 发明授权

US07833810B2 Method of fabricating isolation structures for CMOS image sensor chip scale packages 有权
标题翻译：制造CMOS图像传感器芯片级封装的隔离结构的方法
公开(公告)号：US07833810B2
公开(公告)日：2010-11-16
申请号：US12493758
申请日：2009-06-29
申请人： Tzu-Han Lin , Tzy-Ying Lin , Fang-Chang Liu , Kai-Chih Wang
发明人： Tzu-Han Lin , Tzy-Ying Lin , Fang-Chang Liu , Kai-Chih Wang
IPC分类号： H01L21/00 , H01L23/544
CPC分类号： H01L27/14618 , H01L24/05 , H01L24/13 , H01L2224/0401 , H01L2924/01078 , H01L2924/12043 , H01L2924/14 , H01L2924/15311 , H01L2924/3025 , H01L2924/00
摘要： Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a support structure for the package. The transparent substrate includes a first cutting edge and a second cutting edge. A CMOS image sensor die with a die circuitry is mounted on the transparent substrate. An encapsulant is disposed on the substrate encapsulating the CMOS image sensor die. A connection extends from the die circuitry to a plurality of terminal contacts for the package on the encapsulant, wherein the connection is exposed by the first cutting edge. An isolation structure is disposed on the first cutting edge passivating the exposed connection and co-planed with the second cutting edge.
摘要翻译： CMOS图像传感器芯片级封装的隔离结构及其制造方法。 CMOS图像传感器芯片级封装包括被配置为用于封装的支撑结构的透明衬底。透明基板包括第一切削刃和第二切削刃。具有裸片电路的CMOS图像传感器芯片安装在透明基板上。密封剂设置在封装有CMOS图像传感器芯片的基板上。连接从管芯电路延伸到密封剂上的封装的多个端子触头，其中连接由第一切削刃暴露。隔离结构设置在第一切削刃上，钝化暴露的连接并与第二切削刃共同设计。

17. 发明授权

US07569409B2 Isolation structures for CMOS image sensor chip scale packages 有权
标题翻译： CMOS图像传感器芯片级封装的隔离结构
公开(公告)号：US07569409B2
公开(公告)日：2009-08-04
申请号：US11649242
申请日：2007-01-04
申请人： Tzu-Han Lin , Tzy-Ying Lin , Fang-Chang Liu , Kai-Chih Wang
发明人： Tzu-Han Lin , Tzy-Ying Lin , Fang-Chang Liu , Kai-Chih Wang
IPC分类号： H01L21/00 , H01L23/544
CPC分类号： H01L27/14618 , H01L24/05 , H01L24/13 , H01L2224/0401 , H01L2924/01078 , H01L2924/12043 , H01L2924/14 , H01L2924/15311 , H01L2924/3025 , H01L2924/00
摘要： Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a support structure for the package. The transparent substrate includes a first cutting edge and a second cutting edge. A CMOS image sensor die with a die circuitry is mounted on the transparent substrate. An encapsulant is disposed on the substrate encapsulating the CMOS image sensor die. A connection extends from the die circuitry to a plurality of terminal contacts for the package on the encapsulant, wherein the connection is exposed by the first cutting edge. An isolation structure is disposed on the first cutting edge passivating the exposed connection and co-planed with the second cutting edge.
摘要翻译： CMOS图像传感器芯片级封装的隔离结构及其制造方法。 CMOS图像传感器芯片级封装包括被配置为用于封装的支撑结构的透明衬底。透明基板包括第一切削刃和第二切削刃。具有裸片电路的CMOS图像传感器芯片安装在透明基板上。密封剂设置在封装有CMOS图像传感器芯片的基板上。连接从管芯电路延伸到密封剂上的封装的多个端子触头，其中连接由第一切削刃暴露。隔离结构设置在第一切削刃上，钝化暴露的连接并与第二切削刃共同设计。

18. 发明授权

US07433555B2 Optoelectronic device chip having a composite spacer structure and method making same 有权
标题翻译：具有复合间隔结构的光电器件芯片及其制造方法
公开(公告)号：US07433555B2
公开(公告)日：2008-10-07
申请号：US11438128
申请日：2006-05-22
申请人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： G02B6/12 , G02B6/26
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/481 , H01L27/14683 , H01L2223/6622 , H01L2224/274 , H01L2924/01079 , H01L2924/07811 , H01L2924/00
摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
摘要翻译：公开了一种光电器件芯片及其制造方法。芯片包括器件基板，光学透明上基板和复合间隔层，其包括粘合材料和分散在所述粘合材料中的多个颗粒。器件基板和上基板之间的距离由复合间隔层的厚度控制，使得该变化在光学系统的焦深范围内。

19. 发明申请

US20130141917A1 LED LIGHT DEVICE 审中-公开
标题翻译： LED灯装置
公开(公告)号：US20130141917A1
公开(公告)日：2013-06-06
申请号：US13309421
申请日：2011-12-01
申请人： Tzy-Ying Lin , Wei-Ping Lin , I-Liang Huang , Jin-Lung Yang , Chung-Yu Yang , Tzu-Han Lin
发明人： Tzy-Ying Lin , Wei-Ping Lin , I-Liang Huang , Jin-Lung Yang , Chung-Yu Yang , Tzu-Han Lin
IPC分类号： F21V29/00 , F21V21/00
CPC分类号： F21V5/04 , F21K9/232 , F21K9/64 , F21V7/0091 , F21V29/507 , F21V29/83 , F21Y2113/13 , F21Y2115/10
摘要： The present invention provides an LED light device, including: a heat sink having a layered structure formed by a plurality of tubes; and a sub-mount positioned on the heat sink and mounted with an LED emitter.
摘要翻译：本发明提供一种LED灯装置，其特征在于，包括：具有由多个管形成的层叠结构的散热器; 以及位于散热器上并安装有LED发射器的子安装座。

20. 发明授权

US08388793B1 Method for fabricating camera module 有权
标题翻译：相机模块制作方法
公开(公告)号：US08388793B1
公开(公告)日：2013-03-05
申请号：US13219948
申请日：2011-08-29
申请人： Tzy-Ying Lin , Chieh-Yuan Cheng , Hung-Yeh Lin
发明人： Tzy-Ying Lin , Chieh-Yuan Cheng , Hung-Yeh Lin
IPC分类号： B32B37/00 , B32B38/04 , B32B38/10 , B32B43/00
CPC分类号： H01L27/14618 , H01L27/14623 , H01L27/14625 , H01L27/14683 , H01L2924/0002 , Y10T156/11 , H01L2924/00
摘要： The invention provides a method for fabricating a camera module. An exemplary embodiment of the method for fabricating a camera module comprises providing plurality of lens sets. A dry film layer is formed on the plurality of lens sets. The dry film layer is patterned to form a plurality of dry film patterns respectively attaching to a plurality of lens sets. The plurality of lens sets are separated. A lens set separated from the plurality of lens sets is bonded to an image sensor device chip. The dry film pattern on the lens set is removed.
摘要翻译：本发明提供一种制造相机模块的方法。用于制造相机模块的方法的示例性实施例包括提供多个透镜组。在多个透镜组上形成干膜层。图案化干膜层以形成分别连接到多个透镜组的多个干膜图案。多个透镜组被分离。与多个透镜组分离的透镜组被结合到图像传感器装置芯片。去除透镜组上的干膜图案。

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