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1. 发明授权

US07860357B2 Optoelectronic device chip having a composite spacer structure and method making same 有权
标题翻译：具有复合间隔结构的光电器件芯片及其制造方法
公开(公告)号：US07860357B2
公开(公告)日：2010-12-28
申请号：US12228102
申请日：2008-08-09
申请人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： G02B6/12
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/481 , H01L27/14683 , H01L2223/6622 , H01L2224/274 , H01L2924/01079 , H01L2924/07811 , H01L2924/00
摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
摘要翻译：公开了一种光电器件芯片及其制造方法。芯片包括器件基板，光学透明上基板和复合间隔层，其包括粘合材料和分散在所述粘合材料中的多个颗粒。器件基板和上基板之间的距离由复合间隔层的厚度控制，使得该变化在光学系统的焦深范围内。

2. 发明申请

US20080303109A1 Optoelectronic device chip having a composite spacer structure and method making same 有权
公开(公告)号：US20080303109A1
公开(公告)日：2008-12-11
申请号：US12228102
申请日：2008-08-09
申请人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/481 , H01L27/14683 , H01L2223/6622 , H01L2224/274 , H01L2924/01079 , H01L2924/07811 , H01L2924/00
摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.

3. 发明申请

US20080198481A1 Aspheric lens structures and fabrication methods thereof 有权
标题翻译：非球面透镜结构及其制造方法
公开(公告)号：US20080198481A1
公开(公告)日：2008-08-21
申请号：US11706192
申请日：2007-02-15
申请人： Pai-Chun Peter Zung , Shin-Chang Shiung , Wei-Ko Wang , Chia-Yang Chang , Chien-Pang Lin
发明人： Pai-Chun Peter Zung , Shin-Chang Shiung , Wei-Ko Wang , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： G02B3/02 , B05D5/06
CPC分类号： B29D11/00019 , B29D11/00375
摘要： Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.
摘要翻译：公开了具有双非球面表面的非球面透镜结构及其制造方法。非球面透镜结构包括具有设置在第二透镜部件上的非球面顶表面的第一透镜部件，其中第一透镜部件和第二透镜部件之间的界面是球形的。第二透镜部件包括非球面后表面，其中第一透镜部件的非球面上表面的曲率半径不同于第二透镜部件的非球面后表面的曲率半径。第二透镜部件还可以包括平面后表面，其中第三透镜部件设置在第二部件的平面后表面上。第三透镜部件包括非球面后表面，其中第一透镜部件的非球面顶表面的曲率半径不同于第三透镜部件的非球面后表面的曲率半径。

4. 发明申请

US20070166029A1 Image sensor module having precise image-projection control 有权
标题翻译：图像传感器模块具有精确的图像投影控制
公开(公告)号：US20070166029A1
公开(公告)日：2007-07-19
申请号：US11653297
申请日：2007-01-16
申请人： Hsiao-Wen Lee , Tzu-Han Lin , Pai-Chun Peter Zung , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Tzu-Han Lin , Pai-Chun Peter Zung , Chien-Pang Lin
IPC分类号： G03B17/00
CPC分类号： H04N5/2254 , H01L27/14618 , H01L27/14625 , H01L27/1469 , H01L2924/16195 , H04N5/2257
摘要： An image sensor module comprises an image sensor chip, at least one lens layer, and at least one bonding layer. The image sensor chip has an image capturing zone manufactured with an image capturing element, and a partition zone surrounding the image capturing zone. The at least one lens layer is stacked on the image sensor chip, having a transparent substrate and a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip. The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip and bonded between the image sensor chip and the at least one lens layer, mixing of a glue agent and a plurality of spacer elements with which the height of each the spacer elements is determined to be the height of the bonding layer.
摘要翻译：图像传感器模块包括图像传感器芯片，至少一个透镜层和至少一个结合层。图像传感器芯片具有由图像捕获元件制造的图像捕获区域和围绕图像捕获区域的分隔区域。至少一个透镜层堆叠在图像传感器芯片上，具有透明基板和安装在透明基板上的透镜，并且适于将投影图像聚焦到图像传感器芯片的图像捕获区域上。所述至少一个接合层被布置成对应于图像传感器芯片的分隔区并且结合在图像传感器芯片和至少一个透镜层之间，胶粘剂与多个间隔元件的混合，每个间隔元件被确定为接合层的高度。

5. 发明申请

US20180024650A1 STYLUS WITH CAPACITIVE SLIDE AND GRIP SENSORS 有权
公开(公告)号：US20180024650A1
公开(公告)日：2018-01-25
申请号：US15217969
申请日：2016-07-22
申请人： Yu-Kuang Hou , Yueh-Hua Li , Yen-Teh Lee , CHIEN-PANG LIN , Yu-Ting Lo
发明人： Yu-Kuang Hou , Yueh-Hua Li , Yen-Teh Lee , CHIEN-PANG LIN , Yu-Ting Lo
IPC分类号： G06F3/038 , G06F3/0354 , G06F3/041 , G06F3/044
CPC分类号： G06F3/0383 , G06F3/03545 , G06F3/0414 , G06F3/044 , G06F2203/0381 , G06F2203/04106
摘要： Embodiments of a stylus having a capacitive slide sensor and grip sensors are disclosed, for use with electronic devices and particularly with touchscreen devices. The stylus is in signal communication with the electronic device, either wired or wirelessly, and the slide sensor allows a user to generate a sliding data value as well as a contact/no-contact datum; these can be used as scaled control values or as buttonpress control values to control features of applications running on the electronic device. The capacitive sensors are formed on a single flexible PCB wrapped inside the stylus barrel.

6. 发明授权

US08000041B1 Lens modules and fabrication methods thereof 有权
标题翻译：透镜模块及其制造方法
公开(公告)号：US08000041B1
公开(公告)日：2011-08-16
申请号：US12886129
申请日：2010-09-20
申请人： Chien-Pang Lin , San-Yuan Chung , Weng-Chu Chu
发明人： Chien-Pang Lin , San-Yuan Chung , Weng-Chu Chu
IPC分类号： G02B7/02 , G02B27/10
CPC分类号： G02B7/021 , B29D11/00375 , G02B13/001
摘要： According to an embodiment of the present invention, a lens module is provided, which includes a first lens assembly including a first patterned substrate, a first recess formed from a first surface of the first patterned substrate, a first lens element disposed in the first recess, and a second lens element disposed on the first patterned substrate, wherein the second lens element aligns along an optical axis through the first lens element.
摘要翻译：根据本发明的实施例，提供了一种透镜模块，其包括第一透镜组件，该第一透镜组件包括第一图案化衬底，由第一图案化衬底的第一表面形成的第一凹部，设置在第一凹部以及设置在第一图案化基板上的第二透镜元件，其中第二透镜元件沿着光轴对准穿过第一透镜元件。

7. 发明授权

US07703997B2 Image sensor module having precise image-projection control 有权
标题翻译：图像传感器模块具有精确的图像投影控制
公开(公告)号：US07703997B2
公开(公告)日：2010-04-27
申请号：US11653297
申请日：2007-01-16
申请人： Hsiao-Wen Lee , Tzu-Han Lin , Pai-Chun Peter Zung , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Tzu-Han Lin , Pai-Chun Peter Zung , Chien-Pang Lin
IPC分类号： G03B17/00 , H04N5/335 , H04N5/225 , G02B7/02
CPC分类号： H04N5/2254 , H01L27/14618 , H01L27/14625 , H01L27/1469 , H01L2924/16195 , H04N5/2257
摘要： An image sensor module comprises an image sensor chip, at least one lens layer, and at least one bonding layer. The image sensor chip has an image capturing zone manufactured with an image capturing element, and a partition zone surrounding the image capturing zone. The at least one lens layer is stacked on the image sensor chip, having a transparent substrate and a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip. The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip and bonded between the image sensor chip and the at least one lens layer, mixing of a glue agent and a plurality of spacer elements with which the height of each the spacer elements is determined to be the height of the bonding layer.
摘要翻译：图像传感器模块包括图像传感器芯片，至少一个透镜层和至少一个结合层。图像传感器芯片具有由图像捕获元件制造的图像捕获区域和围绕图像捕获区域的分隔区域。至少一个透镜层堆叠在图像传感器芯片上，具有透明基板和安装在透明基板上的透镜，并且适于将投影图像聚焦到图像传感器芯片的图像捕获区域上。所述至少一个接合层被布置成对应于图像传感器芯片的分隔区并且结合在图像传感器芯片和至少一个透镜层之间，胶粘剂与多个间隔元件的混合，每个间隔元件被确定为接合层的高度。

8. 外观设计

USD415484S Computer keyboard with Z-axis input means 失效
公开(公告)号：USD415484S
公开(公告)日：1999-10-19
申请号：US95478
申请日：1998-10-23
申请人： Chien Pang Lin
设计人： Chien Pang Lin

9. 发明申请

US20170322645A1 CIRCUIT AND STYLUS FOR CAPACITIVE TOUCHSCREEN 有权
公开(公告)号：US20170322645A1
公开(公告)日：2017-11-09
申请号：US15145819
申请日：2016-05-04
申请人： Ting-Kuo Kao , Hsin Hsueh Wu , Chien-Pang Lin
发明人： Ting-Kuo Kao , Hsin Hsueh Wu , Chien-Pang Lin
IPC分类号： G06F3/0354 , G06F3/044 , G06F3/038
CPC分类号： G06F3/03545 , G06F3/0383 , G06F3/0418 , G06F3/044
摘要： Embodiments of a circuit and a stylus for interacting with a capacitive sensor are disclosed. The stylus includes a stylus body, a circuit disposed within the stylus body, a tip, and a power source. The circuit includes an input terminal, an amplifier, and an output terminal. The tip includes a sensing electrode and an emitting electrode, and the tip is disposed on a proximal end of the stylus body. The power source is electrically coupled to the circuit. The input terminal of the circuit is electrically coupled to the sensing electrode of the tip, and the output terminal of the circuit is electrically coupled to the emitting electrode of the tip. The circuit receives a signal through the sensing electrode, amplifies and inverts the signal, and outputs the signal through the emitting electrode. The amplifier of the circuit amplifies only a portion of the signal that exceeds a threshold voltage.

10. 发明授权

US07576551B2 Test socket and test board for wafer level semiconductor testing 有权
标题翻译：用于晶圆级半导体测试的测试插座和测试板
公开(公告)号：US07576551B2
公开(公告)日：2009-08-18
申请号：US11902309
申请日：2007-09-20
申请人： Sheng-Feng Lu , Shih-Ming Chen , Chien-Pang Lin , Ming-Hsun Sung
发明人： Sheng-Feng Lu , Shih-Ming Chen , Chien-Pang Lin , Ming-Hsun Sung
IPC分类号： G01R31/26
CPC分类号： G01R1/0408 , G01R1/0466 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2924/15311 , H01L2924/00
摘要： A test board for wafer level semiconductor testing is disclosed. The test board comprises a plurality of wires and microelectronic devices; and a plurality of test sockets on an upper surface of the test board. Each test socket comprises: a base member configured for attachment to the test board with a first set of screws, wherein the base member has a central opening exposing a portion of the underlying test board; an anisotropic conductive film disposed within the central opening of the base member; a chip to be tested, disposed on the anisotropic conductive film within the central opening of the base member; and a cover member overlying the chip, attached to the base member with a second set of screws.
摘要翻译：公开了一种用于晶片级半导体测试的测试板。测试板包括多根导线和微电子器件; 以及在测试板的上表面上的多个测试插座。每个测试插座包括：基座构件，其构造成用第一组螺钉附接到测试板，其中所述基座构件具有暴露所述底层测试板的一部分的中心开口; 设置在所述基底构件的中心开口内的各向异性导电膜; 待测试的芯片，设置在基底构件的中心开口内的各向异性导电膜上; 以及覆盖所述芯片的盖构件，以第二组螺钉附接到所述基座构件。

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