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11. 发明授权

US6125531A Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means 有权
公开(公告)号：US6125531A
公开(公告)日：2000-10-03
申请号：US259977
申请日：1999-03-01
申请人： Donald S. Farquhar , Voya R. Markovich , Kostas I. Papathomas , Leonard L. Schmidt
发明人： Donald S. Farquhar , Voya R. Markovich , Kostas I. Papathomas , Leonard L. Schmidt
IPC分类号： H05K1/03 , H05K1/11 , H05K3/00 , H05K3/24 , H05K3/40 , H01K3/10
CPC分类号： H05K3/0094 , H05K3/4069 , H05K1/0366 , H05K1/113 , H05K2201/0347 , H05K2201/0959 , H05K2203/0278 , H05K2203/0338 , H05K2203/1453 , H05K3/246 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： A method of making a circuitized substrate such as a printed circuit board having at least one hole therein which comprises the steps of providing a layer of dielectric, forming at least one (and preferably several) holes therein, providing a fill member including a quantity of fill material and reinforcement means located within the fill material, positioning the fill member on the dielectric over the holes and thereafter applying a predetermined force sufficient to cause only the fill material to be forcibly driven into the accommodating hole(s), not the reinforcement means. Subsequent steps can include forming a layer of circuitry on the substrate's external surface and over the filled holes such that an electrical component such as a ball grid array (BGA), semiconductor chip, etc. may be directly positioned on and/or over the hole(s). A fill member usable with the method is also provided.

12. 发明授权

US6079100A Method of making a printed circuit board having filled holes and fill member for use therewith 失效
标题翻译：制造具有填充孔和填充构件的印刷电路板的方法
公开(公告)号：US6079100A
公开(公告)日：2000-06-27
申请号：US76649
申请日：1998-05-12
申请人： Donald S. Farquhar , Voya R. Markovich , Kostas I. Papathomas , Leonard L. Schmidt
发明人： Donald S. Farquhar , Voya R. Markovich , Kostas I. Papathomas , Leonard L. Schmidt
IPC分类号： H05K1/11 , H05K3/00 , H01K3/10 , H01R9/09
CPC分类号： H05K3/0094 , H05K1/113 , H05K2201/0959 , H05K2203/0191 , H05K2203/025 , H05K2203/0278 , Y10T29/49155 , Y10T29/49165
摘要： A method of making a circuitized substrate such as a printed circuit board having at least one hole therein which comprises the steps of providing a layer of dielectric, forming at least one (and preferably several) holes therein, positioning a thin layer of support material atop the dielectric layer and over the hole(s), positioning a quantity of fill material on the thin layer of support material (preferably before positioning the thin layer on the dielectric) and thereafter applying a predetermined force sufficient to cause the thin support layer to rupture or otherwise deform (including melting from heat application thereto) such that the fill material is forcibly driven into the accommodating hole(s). Subsequent steps can include forming a layer of circuitry on the substrate's external surface and over the filled holes such that an electrical component such as a ball grid array (BGA), semiconductor chip, etc. may be directly positioned on and/or over the hole(s). A fill member usable with the method is also provided.
摘要翻译：一种制造诸如印刷电路板的电路化基板的方法，其中具有至少一个孔，其包括以下步骤：提供介电层，在其中形成至少一个（并且优选几个）孔，将薄层的支撑材料定位在顶部电介质层和孔之上，将一定量的填充材料定位在支撑材料的薄层上（优选在将薄层定位在电介质上之前），然后施加足以使薄载体层破裂的预定力或以其他方式变形（包括从其加热熔化）使得填充材料被强制地驱动到容纳孔中。随后的步骤可以包括在衬底的外表面上和填充的孔上形成电路层，使得电子部件例如球栅阵列（BGA），半导体芯片等可以直接定位在孔的上和/或上方（s）。还提供了可用于该方法的填充构件。

13. 发明申请

US20110017498A1 Photosensitive dielectric film 审中-公开
标题翻译：感光电介质膜
公开(公告)号：US20110017498A1
公开(公告)日：2011-01-27
申请号：US12460975
申请日：2009-07-27
申请人： John M. Lauffer , Voya R. Markovich , Kostas I. Papathomas
发明人： John M. Lauffer , Voya R. Markovich , Kostas I. Papathomas
IPC分类号： H05K1/09 , C08J3/28 , B05D5/12
CPC分类号： H05K3/4676 , H05K3/0023 , H05K2201/0209
摘要： A photosensitive dielectric composition adapted for forming a dielectric film layer for use in a circuitized substrate is provided according to one embodiment of the invention, the composition including an epoxide bearing component including at least one polyepoxide resin curable by electromagnetic radiation, a cyanate ester, a flexibilizer, a nanostructured toughener, a photoinitiator in a predetermined amount by weight of the resin component, and a ceramic filler, the photosensitive dielectric composition forming the dielectric film layer having no solvent therein. In an alternative embodiment, a heat activated dielectric composition is provided which is curable by heat and includes an epoxide bearing component including at least one polyepoxide resin curable by heat, a cyanate ester, a flexibilizer, a nanostructured toughener, a heat activated curing agent for accelerating reaction of the cyanate ester and polyepoxide resin components, and a ceramic filler. Methods of making circuitized substrates from the above compositions are also provided.
摘要翻译：根据本发明的一个实施方案提供一种适用于形成用于电路化基底的电介质膜层的光敏电介质组合物，该组合物包括含环氧化物的组分，该组分包括至少一种可通过电磁辐射固化的聚环氧树脂，氰酸酯，增韧剂，纳米结构增韧剂，预定量的树脂组分的光引发剂和陶瓷填料，所述光敏介电组合物形成在其中不溶剂的电介质膜层。在另一个实施方案中，提供热活化电介质组合物，其可通过加热固化，并且包括含环氧化物的组分，其包含至少一种可热固化的聚环氧树脂，氰酸酯，增韧剂，纳米结构增韧剂，热活化固化剂加速氰酸酯和聚环氧树脂组分的反应，以及陶瓷填料。还提供了从上述组合物制备电路化基底的方法。

14. 发明授权

US07211289B2 Method of making multilayered printed circuit board with filled conductive holes 有权
标题翻译：制造具有填充导电孔的多层印刷电路板的方法
公开(公告)号：US07211289B2
公开(公告)日：2007-05-01
申请号：US10737974
申请日：2003-12-18
申请人： James M. Larnerd , John M. Lauffer , Voya R. Markovich , Kostas I. Papathomas
发明人： James M. Larnerd , John M. Lauffer , Voya R. Markovich , Kostas I. Papathomas
IPC分类号： B05D5/12 , B28B19/00 , B29B15/10
CPC分类号： H05K3/429 , H01L2224/13 , H05K1/113 , H05K1/115 , H05K3/0032 , H05K3/0035 , H05K3/421 , H05K2201/0347 , H05K2201/09454 , H05K2201/09509 , H05K2201/09518 , H05K2201/09563 , H05K2201/0959 , H05K2201/0969 , H05K2201/09845
摘要： A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers, including one of the conductive layers connected by the other hole. It is also possible to connect all three conductive layers using one or more holes. The resulting holes may be filled, e.g., with metal plating, or conductive or non-conductive paste. In the case of the latter, it is also possible to provide a top covering conductive layer over the paste, e.g., to serve as a pad or the like on the board's external surface.
摘要翻译：一种制造印刷电路板的方法，其中导电通孔形成在板结构的两个电介质层内，以便连接指定的导电层。一个孔连接两个相邻的层，另一个连接两个相邻的层，包括通过另一个孔连接的一个导电层。也可以使用一个或多个孔连接所有三个导电层。所得到的孔可以例如用金属电镀或导电或不导电的糊料填充。在后者的情况下，也可以在浆料上方设置顶部覆盖导电层，例如在板的外表面上用作衬垫等。

15. 发明授权

US09756724B2 Method of making a circuitized substrate 有权
公开(公告)号：US09756724B2
公开(公告)日：2017-09-05
申请号：US13252256
申请日：2011-10-04
申请人： Rabindra N. Das , Kostas I. Papathomas , Voya R. Markovich
发明人： Rabindra N. Das , Kostas I. Papathomas , Voya R. Markovich
IPC分类号： H05K3/40 , H05K1/03 , H05K3/46 , B23K26/382 , B23K26/40 , H01B1/22 , H05K1/09 , B23K103/00 , B23K101/40 , B23K103/16
CPC分类号： H05K1/0313 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/16 , B23K2103/172 , B23K2103/52 , H01B1/22 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01322 , H01L2924/15311 , H05K1/097 , H05K3/4053 , H05K3/4069 , H05K3/462 , H05K3/4623 , H05K3/4641 , H05K2201/0257 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09718 , H05K2201/10378 , H05K2203/0425 , H05K2203/1152 , Y10T29/49128 , Y10T29/49165 , H01L2924/00
摘要： A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto.

16. 发明申请

US20120247822A1 CORELESS LAYER LAMINATED CHIP CARRIER HAVING SYSTEM IN PACKAGE STRUCTURE 审中-公开
标题翻译：包装结构中的无缝层叠层叠载体系统
公开(公告)号：US20120247822A1
公开(公告)日：2012-10-04
申请号：US13073307
申请日：2011-03-28
申请人： James W. Fuller, JR. , Jeffrey Knight , Voya R. Markovich , Kostas I. Papathomas
发明人： James W. Fuller, JR. , Jeffrey Knight , Voya R. Markovich , Kostas I. Papathomas
IPC分类号： H05K1/16 , H05K3/00
CPC分类号： H05K3/4602 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L2924/0002 , H05K1/113 , H05K1/162 , H05K2201/09509 , H05K2201/096 , Y10T29/49124 , H01L2924/00
摘要： A substrate for use in a laminated chip carrier (LCC) and a system in package (SiP) device having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can include thermoset and thermoplastic resin.
摘要翻译：一种用于层叠芯片载体（LCC）的基板和具有无芯堆积层和至少一种金属和至少一个介电层的封装（SiP）装置。无芯堆积电介质层可包括热固性和热塑性树脂。

17. 发明授权

US08063315B2 Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate 有权
标题翻译：具有导电浆料的电路基板，包括所述电路化基板的电气组件和制造所述基板的方法
公开(公告)号：US08063315B2
公开(公告)日：2011-11-22
申请号：US11802434
申请日：2007-05-23
申请人： Rabindra N. Das , Kostas I. Papathomas , Voya R. Markovich
发明人： Rabindra N. Das , Kostas I. Papathomas , Voya R. Markovich
IPC分类号： H05K1/11
CPC分类号： H05K1/0313 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/16 , B23K2103/172 , B23K2103/52 , H01B1/22 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01322 , H01L2924/15311 , H05K1/097 , H05K3/4053 , H05K3/4069 , H05K3/462 , H05K3/4623 , H05K3/4641 , H05K2201/0257 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09718 , H05K2201/10378 , H05K2203/0425 , H05K2203/1152 , Y10T29/49128 , Y10T29/49165 , H01L2924/00
摘要： A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto.
摘要翻译：一种电路化基板，包括用于提供电连接的导电浆料。在一个实施方案中，糊状物包括包含纳米颗粒的金属组分，并且可以包括附加元素，例如焊料或其它金属微粒，以及导电聚合物和有机物。糊料组合物的颗粒烧结并且根据添加的另外的元素而熔化，因为层压，从而形成通过糊料的有效连续的电路。还提供了制造这种基板的方法，以及利用该基板并且包括诸如与其耦合的半导体芯片的电子部件的电组件。

18. 发明申请

US20090241332A1 Circuitized substrate and method of making same 审中-公开
标题翻译：电路基板及其制作方法
公开(公告)号：US20090241332A1
公开(公告)日：2009-10-01
申请号：US12078206
申请日：2008-03-28
申请人： John M. Lauffer , Roy H. Magnuson , Voya R. Markovich , James P. Paoletti , Kostas I. Papathomas , Rajinder S. Rai
发明人： John M. Lauffer , Roy H. Magnuson , Voya R. Markovich , James P. Paoletti , Kostas I. Papathomas , Rajinder S. Rai
IPC分类号： H05K3/00
CPC分类号： H05K3/462 , H05K3/0032 , H05K3/4069 , H05K3/4623 , H05K2201/09318 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2203/061 , Y10T29/49124
摘要： A circuitized substrate and method of making same in which a first plurality of holes are formed within two bonded dielectric layers and then made conductive, e.g., plated. The substrate also includes third and fourth dielectric layers bonded to the first and second with a plurality of continuous electrically conductive thru holes extending through all four dielectric layers. Conductive paste is positioned within the thru holes for providing electrical connections between desired conductive layers of the substrate and outer layers as well. A circuitized substrate assembly and method of making same are also provided.
摘要翻译：电路化基板及其制造方法，其中第一多个孔形成在两个接合的介电层内，然后导电，例如电镀。衬底还包括通过延伸穿过所有四个电介质层的多个连续导电通孔与第一和第二电极结合的第三和第四电介质层。导电浆料位于通孔内，用于在基板和外层的期望的导电层之间提供电连接。还提供了电路化基板组件及其制造方法。

19. 发明授权

US07348677B2 Method of providing printed circuit board with conductive holes and board resulting therefrom 有权
标题翻译：为印刷电路板提供导电孔和由此产生的板的方法
公开(公告)号：US07348677B2
公开(公告)日：2008-03-25
申请号：US11397713
申请日：2006-04-05
申请人： James M. Larnerd , John M. Lauffer , Voya R. Markovich , Kostas I. Papathomas
发明人： James M. Larnerd , John M. Lauffer , Voya R. Markovich , Kostas I. Papathomas
IPC分类号： H01L29/40
CPC分类号： H05K3/429 , H01L2224/13 , H05K1/113 , H05K1/115 , H05K3/0032 , H05K3/0035 , H05K3/421 , H05K2201/0347 , H05K2201/09454 , H05K2201/09509 , H05K2201/09518 , H05K2201/09563 , H05K2201/0959 , H05K2201/0969 , H05K2201/09845
摘要： A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers, including one of the conductive layers connected by the other hole. It is also possible to connect all three conductive layers using one or more holes. The resulting holes may be filled, e.g., with metal plating, or conductive or non-conductive paste. In the case of the latter, it is also possible to provide a top covering conductive layer over the paste, e.g., to serve as a pad or the like on the board's external surface.
摘要翻译：一种制造印刷电路板的方法，其中导电通孔形成在板结构的两个电介质层内，以便连接指定的导电层。一个孔连接两个相邻的层，另一个连接两个相邻的层，包括通过另一个孔连接的一个导电层。也可以使用一个或多个孔连接所有三个导电层。所得到的孔可以例如用金属电镀或导电或不导电的糊料填充。在后者的情况下，也可以在浆料上方设置顶部覆盖导电层，例如在板的外表面上用作衬垫等。

20. 发明授权

US06609296B1 Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means 失效
标题翻译：制造具有填充孔的印刷电路板和用于其的填充构件的方法，包括加强装置
公开(公告)号：US06609296B1
公开(公告)日：2003-08-26
申请号：US09562580
申请日：2000-05-01
申请人： Donald S. Farquhar , Voya R. Markovich , Kostas I. Papathomas , Leonard L. Schmidt
发明人： Donald S. Farquhar , Voya R. Markovich , Kostas I. Papathomas , Leonard L. Schmidt
IPC分类号： H01K310
CPC分类号： H05K3/0094 , H05K1/0366 , H05K1/113 , H05K3/246 , H05K3/4069 , H05K2201/0347 , H05K2201/0959 , H05K2203/0278 , H05K2203/0338 , H05K2203/1453 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： A method of making a circuitized substrate such as a printed circuit board having at least one hole therein which comprises the steps of providing a layer of dielectric, forming at least one (and preferably several) holes therein, providing a fill member including a quantity of fill material and reinforcement means located within the fill material, positioning the fill member on the dielectric over the holes and thereafter applying a predetermined force sufficient to cause only the fill material to be forcibly driven into the accommodating hole(s), not the reinforcement means. Subsequent steps can include forming a layer of circuitry on the substrate's external surface and over the filled holes such that an electrical component such as a ball grid array (BGA), semiconductor chip, etc. may be directly positioned on and/or over the hole(s). A fill member usable with the method is also provided.
摘要翻译：一种制造电路化基板的方法，例如其中具有至少一个孔的印刷电路板，其包括以下步骤：提供介电层，在其中形成至少一个（并且优选几个）孔，提供填充构件，该填充构件包括一定量的填充材料和加强装置，其位于填充材料内，将填充构件定位在电介质上的孔上，然后施加足以使填充材料被强制地驱动进入容纳孔的预定力，而不是加强装置。随后的步骤可以包括在衬底的外表面上和填充的孔上形成电路层，使得电子部件例如球栅阵列（BGA），半导体芯片等可以直接定位在孔的上和/或上方（s）。还提供了可用于该方法的填充构件。

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