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1. 发明授权

US12041721B2 Component carrier comprising at least two components 有权
公开(公告)号：US12041721B2
公开(公告)日：2024-07-16
申请号：US17663440
申请日：2022-05-16
申请人： AT&S (Chongqing) Company Limited
发明人： Dominik Wilding , Artan Baftiri
IPC分类号： H05K1/18 , H01L21/56 , H01L23/00 , H01L23/538 , H05K3/00
CPC分类号： H05K1/186 , H01L21/568 , H01L23/5384 , H01L23/5389 , H01L24/24 , H01L24/82 , H05K3/0029 , H05K3/0032 , H05K3/0047 , H01L2224/24137 , H01L2224/24155 , H01L2224/82101 , H05K2203/0191 , H05K2203/1476
摘要： A component carrier includes a stack with at least one electrically conductive layer structure and a plurality of electrically insulating layer structure, a first component, a second component, a central core in which both the first component and the second component are embedded. A first electrically insulating structure encapsulates the first component. A second electrically insulating structure encapsulates the second component. The first component and the second component are electrically connected to an external electrically conductive structure through at least one electrically conductive contact passing through the first electrically insulating structure and/or the second electrically insulating structure.

2. 发明申请

US20180255667A1 ELECTRONIC DEVICE AND METHOD FOR PRODUCING SAME 审中-公开
公开(公告)号：US20180255667A1
公开(公告)日：2018-09-06
申请号：US15756114
申请日：2017-03-27
申请人： OMRON CORPORATION
发明人： Wakahiro KAWAI
IPC分类号： H05K9/00 , H05K1/18 , H05K5/04 , H05K3/12
CPC分类号： H05K9/0084 , H01L21/565 , H01L21/568 , H01L23/00 , H01L23/3135 , H01L23/552 , H05K1/0218 , H05K1/182 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/125 , H05K3/282 , H05K3/288 , H05K5/04 , H05K2201/0715 , H05K2201/0723 , H05K2201/09118 , H05K2203/0156 , H05K2203/0191 , H05K2203/1316 , H05K2203/1469
摘要： The present invention provides an electronic device which includes an electromagnetic shield, can keep down a production cost, can be made to have a reduced thickness, and has a high degree of freedom in designing a wiring circuit. Further, the present invention provides a method for producing such an electronic device. The electronic device (1A) includes at least one high frequency functional component (21), an electrically conductive member (10) which electromagnetically shields the at least one high frequency functional component (21), and a resin molded body (23) in which at least part of the high frequency functional component (21) and at least part of the electrically conductive member (10) are embedded and fixed.

3. 发明授权

US09907157B2 Noise blocking printed circuit board and manufacturing method thereof 有权
公开(公告)号：US09907157B2
公开(公告)日：2018-02-27
申请号：US14656237
申请日：2015-03-12
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Se Jong Kim , Sang Ho Choi , Jeong Hae Kim , Hyung Jun Cho
IPC分类号： H05K1/03 , H05K1/02 , H05K1/18
CPC分类号： H05K1/0218 , H05K1/0243 , H05K1/185 , H05K2201/0187 , H05K2201/0355 , H05K2201/0723 , H05K2201/09972 , H05K2201/09981 , H05K2201/10553 , H05K2201/1056 , H05K2203/0191
摘要： There are provided a printed circuit board and a manufacturing method thereof. The printed circuit board includes: a core layer having a cavity provided therein; an electronic component included in the cavity; a conductive partition disposed on a side of the cavity; and insulating layers disposed on and below the core layer.

4. 发明授权

US09696349B2 Current sensing system 有权
公开(公告)号：US09696349B2
公开(公告)日：2017-07-04
申请号：US14315743
申请日：2014-06-26
申请人： General Electric Company
发明人： Ruxi Wang , William Edward Burdick, Jr. , Satish Prabhakaran , Raymond John Nicholas
IPC分类号： G01R15/20 , G01R15/18 , H05K1/02 , H01F27/28 , H05K1/16 , H05K3/28
CPC分类号： G01R15/181 , H01F27/2804 , H01F2027/2809 , H05K1/028 , H05K1/165 , H05K3/282 , H05K2201/055 , H05K2201/09036 , H05K2201/09063 , H05K2201/097 , H05K2201/10151 , H05K2201/2045 , H05K2203/0191 , H05K2203/0221 , H05K2203/0228 , H05K2203/107
摘要： A detecting unit is presented. The detecting unit includes a flexible circuit having a first side and a second side opposite the first side. The flexible circuit includes a plurality of cells defined therein, each of the plurality of cells having a first side and a second side respectively corresponding to the first side and the second side of the flexible circuit. Moreover, the flexible circuit includes a plurality of conductive windings disposed on at least one of the first and second sides of the plurality of cells. Further, the flexible circuit includes a stress reduction feature between each of the plurality of cells. Also, the detecting unit includes a sealing element configured to secure the flexible circuit in a stacked configuration. A sensing system and a method of making a detecting unit are also presented.

5. 发明申请

US20160257106A1 ACF STICKING METHOD AND ACF STICKING APPARATUS 有权
标题翻译： ACF手提方法和ACF手提装置
公开(公告)号：US20160257106A1
公开(公告)日：2016-09-08
申请号：US14995700
申请日：2016-01-14
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： Shingo YAMADA
IPC分类号： B32B38/10 , B32B37/10
CPC分类号： H05K3/361 , B32B37/0046 , B32B2457/202 , H05K3/323 , H05K2201/10136 , H05K2203/0191 , H05K2203/0264
摘要： An Anisotropic Conductive Film (ACF) is stuck to a substrate by: under-receiving the substrate on which a film-shaped component is mounted by a under-receiving section, increasing an interval between a sticking head and the under-receiving section in the under-receiving step; transporting a tape member in which a base tape is bonded to the ACF and causing a sticking surface of the ACF to face the substrate, pressing the ACF together with the base tape on the substrate and sticking the ACF to the substrate, peeling the ACF sticking to the substrate from the base tape by moving a peeling member in a horizontal direction by causing the peeling member to be interposed between the ACF and the base tape, and regulating an upward warpage deformation of the component during peeling the ACF from the base tape by moving the peeling member.
摘要翻译：通过以下方式将各向异性导电膜（ACF）粘合到基板上：通过欠接收部分下接受其上安装有薄膜状部件的基板，从而增加粘着头与受光部之间的间隔接受不足的步骤; 将其中粘合有基带的带状部件输送到ACF并使ACF的粘贴面朝向基板，将ACF与基带一起压在基板上，并将ACF粘贴到基板上，剥离ACF粘贴通过使剥离部件插入在ACF与基带之间，使剥离部件沿水平方向移动，并且通过使基板从基带剥离ACF而调整部件的向上翘曲变形，从而从基带移动到基板移动剥皮部件。

6. 发明申请

US20160192501A1 METHOD OF MANUFACTURING A FLEXIBLE AND/OR STRETCHABLE ELECTRONIC DEVICE 审中-公开
标题翻译：制造柔性和/或可拉伸电子器件的方法
公开(公告)号：US20160192501A1
公开(公告)日：2016-06-30
申请号：US14896861
申请日：2014-06-03
申请人： NANYANG TECHNOLOGICAL UNIVERSITY
发明人： Chaoyi YAN , Pooi See LEE
IPC分类号： H05K3/00
CPC分类号： H05K3/0073 , H01L29/0673 , H01L29/1606 , H01L29/401 , H01L29/413 , H01L51/0048 , H01L51/50 , H02S50/00 , H02S50/10 , H05K1/0283 , H05K1/097 , H05K3/207 , H05K3/246 , H05K2201/0133 , H05K2201/0248 , H05K2201/0257 , H05K2201/026 , H05K2201/0323 , H05K2201/0326 , H05K2203/0191 , H05K2203/1476 , H05K2203/304
摘要： A method of manufacturing a flexible electronic device is provided. The method includes a) filtering a mixture including an electrically conducting nanostructured material through a membrane such that the electrically conducting nanostructured material is deposited on the membrane; b) depositing an elastomeric polymerisable material on the electrically conducting nanostructured material and curing the elastomeric polymerisable material thereby embedding the electrically conducting nanostructured material in an elastomeric polymer thus formed; and c) separating the elastomeric polymer with the embedded electrically conducting nanostructured material from the membrane to obtain the flexible electronic device. Flexible electronic device manufactured by the method, and use of the flexible electronic device are also provided.
摘要翻译：提供一种制造柔性电子装置的方法。该方法包括：a）通过膜过滤包含导电纳米结构材料的混合物，使得导电纳米结构材料沉积在膜上; b）将弹性体可聚合材料沉积在导电纳米结构材料上并固化弹性体可聚合材料，从而将导电纳米结构材料嵌入如此形成的弹性体聚合物中; 以及c）将所述弹性体聚合物与所述嵌入的导电纳米结构材料从所述膜分离以获得所述柔性电子器件。还提供了通过该方法制造的柔性电子装置和柔性电子装置的使用。

7. 发明申请

US20160105973A1 MICRO-FABRICATED GROUP ELECTROPLATING TECHNIQUE 审中-公开
标题翻译：微型组合电镀技术
公开(公告)号：US20160105973A1
公开(公告)日：2016-04-14
申请号：US14974404
申请日：2015-12-18
申请人： California Institute of Technology
发明人： Yu-Chong Tai , Han-Chieh Chang , Xiaoxiao Zhang
IPC分类号： H05K3/24 , H05K3/06 , C25D1/04 , A61N1/05 , C23C14/14 , C23C14/24
CPC分类号： H05K3/242 , A61N1/0543 , C23C14/14 , C23C14/24 , C25D1/04 , H05K1/189 , H05K3/064 , H05K3/244 , H05K3/28 , H05K3/321 , H05K3/4007 , H05K2203/0191 , H05K2203/0361 , H05K2203/0723 , H05K2203/1338
摘要： Methods, and devices produced by the methods, for electroplating a multitude of micro-scale electrodes that are electrically isolated from each other on a cable or other device is described. A localized area of connections on another end of the cable is shorted together by depositing a metal sheet or other conductive material over the localized area. The metal sheet is connected to a terminal of a power supply, and the electrode end of the cable is immersed in an electrolyte solution for electrodeposition by electroplating. After the electrodes are electroplated, the metal sheet is removed from the cable in order to re-isolate the electrodes.
摘要翻译：描述了通过该方法产生的用于电镀多个在电缆或其它设备上彼此电隔离的微尺度电极的方法和装置。通过在局部区域上沉积金属片或其它导电材料，将电缆的另一端上的局部连接区域短路在一起。金属片与电源的端子连接，将电缆的电极端浸渍在电解液中，通过电镀电沉积。在电极电镀之后，将金属片从电缆中取出，以便重新隔离电极。

8. 发明申请

US20160095220A1 ELECTRONIC PACKAGE DESIGN THAT FACILITATES SHIPPING THE ELECTRONIC PACKAGE 有权
标题翻译：电子包装设计，便于运输电子包装
公开(公告)号：US20160095220A1
公开(公告)日：2016-03-31
申请号：US14496560
申请日：2014-09-25
申请人： Intel Corporation
发明人： Omkar Karhade , Nitin Deshpande , Nachiket Raravikar
IPC分类号： H05K1/18 , H05K3/30 , H05K3/28 , H05K1/02 , H05K1/11
CPC分类号： H05K3/305 , H01L23/562 , H01L2924/0002 , H01L2924/15311 , H01L2924/3511 , H05K2201/10734 , H05K2203/0191 , Y02P70/613 , H01L2924/00
摘要： Some example forms relate to an electronic package. The electronic package includes an electronic component and a substrate that includes a front side and a back side. The electronic component is mounted on the front side of the substrate and conductors are mounted on the back side of the substrate. The substrate is warped due to differences in the coefficients of thermal expansion between the electronic component and the substrate. An adhesive is positioned between the conductors on the back side of the substrate and an adhesive film is attached to the adhesive positioned between the conductors on the back side of the substrate.
摘要翻译：一些示例形式涉及电子包装。电子封装包括电子部件和包括正面和背面的基板。电子部件安装在基板的前侧，导体安装在基板的背面。由于电子部件和基板之间的热膨胀系数的差异，基板翘曲。粘合剂位于基板背侧的导体之间，并且粘合剂膜附着到位于基板背面的导体之间的粘合剂。

9. 发明申请

US20150296624A1 PRINTED CIRCUIT BOARD FOR MOUNTING CHIP AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：用于安装芯片的印刷电路板及其制造方法
公开(公告)号：US20150296624A1
公开(公告)日：2015-10-15
申请号：US14438660
申请日：2013-05-09
申请人： LG INNOTEK CO., LTD.
发明人： Yun Ho An , Won Suk Jung , Ran Kim , Sung Soo Park , Young Joon Son , Sang Myung Lee , Woo Young Lee , Joon Wook Han
IPC分类号： H05K1/18
CPC分类号： H05K1/185 , H01L21/568 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2924/3511 , H05K1/0271 , H05K3/4602 , H05K2201/09136 , H05K2201/095 , H05K2201/0959 , H05K2201/10636 , H05K2203/0191 , Y02P70/611
摘要： A printed circuit board for mounting a chip includes: a core layer including a chip mounting cavity; a chip mounted into the chip mounting cavity; a first insulating material layer filled in a space between the chip mounting cavity and the chip; and a second insulating material layer laminated on one surface of the core layer.
摘要翻译：用于安装芯片的印刷电路板包括：芯层，包括芯片安装腔; 芯片安装在芯片安装腔中; 填充在芯片安装腔和芯片之间的空间中的第一绝缘材料层; 以及层叠在芯层的一个表面上的第二绝缘材料层。

10. 发明授权

US09155190B2 Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom 有权
标题翻译：从其制备柔性基底组件和柔性基底组件的方法
公开(公告)号：US09155190B2
公开(公告)日：2015-10-06
申请号：US13913141
申请日：2013-06-07
申请人： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
发明人： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
IPC分类号： H05K1/00 , H05K1/02 , H05K3/00 , H05K1/18 , H05K1/03 , H05K3/28
CPC分类号： H05K1/0271 , H05K1/0277 , H05K1/0393 , H05K1/181 , H05K3/00 , H05K3/007 , H05K3/281 , H05K2201/0145 , H05K2201/0154 , H05K2201/068 , H05K2203/0152 , H05K2203/016 , H05K2203/0191 , H05K2203/1383 , Y10T156/10 , Y10T428/14 , Y10T428/1476 , Y10T428/23914 , Y10T428/24355 , Y10T428/24942 , Y10T428/26 , Y10T428/2848 , Y10T428/31515
摘要： Some embodiments include a method of preparing a flexible substrate assembly. Other embodiments of related methods and structures are also disclosed.
摘要翻译：一些实施例包括制备柔性基底组件的方法。还公开了相关方法和结构的其它实施方案。

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