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11. 外观设计

USD664390S1 Cookware long handle 有权
标题翻译：炊具长柄
公开(公告)号：USD664390S1
公开(公告)日：2012-07-31
申请号：US29404072
申请日：2011-10-14
申请人： John Wei Shen
设计人： John Wei Shen

12. 发明授权

US08178970B2 Strong interconnection post geometry 有权
标题翻译：强互连柱几何
公开(公告)号：US08178970B2
公开(公告)日：2012-05-15
申请号：US12623925
申请日：2009-11-23
申请人： Wen-Wei Shen , Chen-Shien Chen , Chen-Cheng Kuo , Chih-Hua Chen , Ching-Wen Hsiao
发明人： Wen-Wei Shen , Chen-Shien Chen , Chen-Cheng Kuo , Chih-Hua Chen , Ching-Wen Hsiao
IPC分类号： H01L23/488
CPC分类号： H01L24/16 , H01L24/13 , H01L24/81 , H01L2224/13005 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/16 , H01L2224/16237 , H01L2224/81191 , H01L2224/812 , H01L2224/814 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/10329 , H01L2924/10336 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/381 , H01L2924/00014 , H01L2924/01083 , H01L2224/13099 , H01L2924/00 , H01L2924/206 , H01L2924/207
摘要： A flip-chip packaging assembly and integrated circuit device are disclosed. An exemplary flip-chip packaging assembly includes a first substrate; a second substrate; and joint structures disposed between the first substrate and the second substrate. Each joint structure comprises an interconnect post between the first substrate and the second substrate and a joint solder between the interconnect post and the second substrate, wherein the interconnect post exhibits a width and a first height. A pitch defines a distance between each joint structure. The first height is less than half the pitch.
摘要翻译：公开了一种倒装芯片封装组件和集成电路器件。示例性的倒装芯片封装组件包括第一基板; 第二基板; 以及设置在第一基板和第二基板之间的接合结构。每个接头结构包括在第一基板和第二基板之间的互连柱和在互连柱和第二基板之间的接合焊料，其中互连柱呈现宽度和第一高度。间距定义每个关节结构之间的距离。第一高度小于音高的一半。

13. 发明授权

US08171332B2 Integrated circuit with reduced electromagnetic interference induced by memory access and method for the same 有权
标题翻译：具有降低电磁干扰的集成电路由存储器访问引起的方法和相同的方法
公开(公告)号：US08171332B2
公开(公告)日：2012-05-01
申请号：US12464291
申请日：2009-05-12
申请人： Meng-Wei Shen
发明人： Meng-Wei Shen
IPC分类号： G06F1/00 , G06F1/12 , G06F13/42 , G06F1/04 , G06F5/06 , H04L5/00 , H04L7/00
CPC分类号： G06F1/08 , G09G3/3611 , G09G5/18 , G09G5/39 , G09G5/393 , G09G5/395 , G09G2330/06
摘要： The invention provides an integrated circuit with reduced electromagnetic interference induced by memory access. The integrated circuit includes a random code generator, a request receiver and a memory unit. The random code generator generates a plurality of random codes according to a predetermined delay parameter. The request receiver obtains an input clock signal according to a plurality of data requests and spreads the spectrum of the input clock signal based on the random codes to derive a non-periodic output clock signal. The memory unit accesses image data to be displayed in response to the data requests and the output clock signal.
摘要翻译：本发明提供一种具有由存储器访问引起的电磁干扰降低的集成电路。集成电路包括随机码发生器，请求接收器和存储器单元。随机码发生器根据预定的延迟参数产生多个随机码。请求接收器根据多个数据请求获得输入时钟信号，并且基于随机码对输入时钟信号的频谱进行扩频以导出非周期性输出时钟信号。存储单元响应于数据请求和输出时钟信号访问要显示的图像数据。

14. 发明申请

US20120060371A1 METHOD FOR MANUFACTURING TWO-PHASE FLOW HEAT SINK 审中-公开
标题翻译：制造两相流动散热器的方法
公开(公告)号：US20120060371A1
公开(公告)日：2012-03-15
申请号：US12904277
申请日：2010-10-14
申请人： SHIH-YING CHANG , YEN-HUAN LEI , WEI-SHEN CHEN , JI-RONG FU
发明人： SHIH-YING CHANG , YEN-HUAN LEI , WEI-SHEN CHEN , JI-RONG FU
IPC分类号： B21D53/02
CPC分类号： F28D15/046 , F28D15/0233 , F28D15/0283 , Y10T29/49353
摘要： The present invention relates to a method for manufacturing a two-phase flow heat sink. The two-phase flow heat sink comprises an evaporation chamber and a capillary layer. The material of the capillary layer, which has at least a porous structure, is cooled and disposed on the inner side of the evaporation chamber from a melted state. The method first sprays the thermally melted material of the capillary layer on the substrate of the evaporation chamber for forming the capillary layer on the substrate. Because the capillary layer is sprayed on the substrate of the evaporation chamber, the capillary layer is distributed irregularly on the substrate and forming irregularly distributed holes. Thereby, the flowing space for fluids in the evaporation chamber is increased, and hence enhancing the heat transfer efficiency of the heat sink.
摘要翻译：本发明涉及一种用于制造两相流散热器的方法。两相流散热器包括蒸发室和毛细管层。具有至少多孔结构的毛细管层的材料从熔融状态被冷却并设置在蒸发室的内侧。该方法首先在蒸发室的基底上喷射毛细管层的热熔融材料，以在衬底上形成毛细管层。由于毛细管层喷涂在蒸发室的基板上，所以毛细管层不规则地分布在基板上并形成不规则分布的孔。因此，蒸发室中的流体的流动空间增加，从而提高散热器的传热效率。

15. 发明申请

US20120037704A1 TWO-DIMENSIONAL ARRAY CODE 有权
标题翻译：二维阵列码
公开(公告)号：US20120037704A1
公开(公告)日：2012-02-16
申请号：US13263917
申请日：2010-04-12
申请人： Wei Shen , Jia Bing Liu , Xiao Wei Guo , Li Duo Zhong
发明人： Wei Shen , Jia Bing Liu , Xiao Wei Guo , Li Duo Zhong
IPC分类号： G06K19/06 , G06K7/10
CPC分类号： G06K19/06037
摘要： The present invention relates to a two-dimensional array code. The two-dimensional array code comprises a plurality of equal-height code characters arranged into a two-dimensional array, wherein each of the code characters corresponds to a bit group representing information, and the adjacent code characters in the row direction of the two-dimensional array have equal center distances; and a locating mechanism, for defining size and/or direction of the two-dimensional array arranged by the code characters. The present invention greatly reduces the cost for issuing a two-dimensional code, and significantly increases the user convenience. This two-dimensional array code has high compatibility for user mobile terminals. In addition, the entire system apparently improves its safety and stability, and is suitable for the present network application environment.
摘要翻译：本发明涉及一种二维阵列码。二维阵列代码包括排列成二维阵列的多个等高码字符，其中每个代码字符对应于表示信息的位组，并且二维阵列代码中的相邻代码字符在二维阵列的行方向上相邻，尺寸阵列具有相等的中心距离; 以及用于定义由代码字符排列的二维阵列的大小和/或方向的定位机构。本发明大大降低了发行二维码的成本，显着提高了用户的便利性。该二维阵列码对于用户移动终端具有高兼容性。此外，整个系统显然提高了其安全性和稳定性，适用于当前的网络应用环境。

16. 发明申请

US20110318227A1 SWITCHES FOR MICROFLUIDIC SYSTEMS 有权
标题翻译：微流控系统开关
公开(公告)号：US20110318227A1
公开(公告)日：2011-12-29
申请号：US13058449
申请日：2009-08-10
申请人： Wei Shen , Xu Li , Junfie Tian , Thanh Huynh Nguyen , Gil Garnier
发明人： Wei Shen , Xu Li , Junfie Tian , Thanh Huynh Nguyen , Gil Garnier
IPC分类号： B01L3/00 , B26D3/00 , G01N33/00
CPC分类号： B01L3/502707 , B01L3/5023 , B01L3/502738 , B01L2200/10 , B01L2300/0864 , B01L2300/0867 , B01L2300/087 , B01L2300/0874 , B01L2300/0887 , B01L2300/126 , B01L2400/0406 , B01L2400/0622 , B01L2400/0633 , B01L2400/0677 , B01L2400/0688 , F16K99/0001 , F16K2099/0074 , F16K2099/008 , F16K2099/0084 , F16K2099/0086 , F16K2099/0092 , Y10T83/02 , Y10T436/2575
摘要： A microfluidic system including a substrate in sheet form, at least one hydrophilic microfluidic channel supported on a surface of the substrate, and at least one function component formed as part of the substrate for providing a functional component for the microfluidic channel wherein the functional component comprises at least one cut within the substrate for providing a switch or filter component for the microfluidic channel.
摘要翻译：一种微流体系统，其包括片状的底物，至少一个支撑在该基底的表面上的亲水性微流体通道，以及形成为该基底的一部分的至少一个功能组分，用于提供该微流体通道的功能组分，其中该功能组分包含衬底内的至少一个切口，用于为微流体通道提供开关或过滤器部件。

17. 发明申请

US20110316130A1 THIN SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：薄半导体封装及其制造方法
公开(公告)号：US20110316130A1
公开(公告)日：2011-12-29
申请号：US13092159
申请日：2011-04-22
申请人： Yeqing Su , Zhigang Bai , Weimin Chen , Wei Shen , Jianhong Wang , Baoguan Yin , Wanming Yu
发明人： Yeqing Su , Zhigang Bai , Weimin Chen , Wei Shen , Jianhong Wang , Baoguan Yin , Wanming Yu
IPC分类号： H01L23/495 , H01L21/28
CPC分类号： H01L21/6835 , H01L21/568 , H01L23/3107 , H01L23/49541 , H01L24/48 , H01L24/85 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/8501 , H01L2924/00014 , H01L2924/18165 , H01L2224/45099
摘要： A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.
摘要翻译：一种用于制造薄半导体封装的方法，包括：提供具有可移除基板的引线框架，该可移除基板具有附接到引线框架的第一表面的附接表面。引线框架由导电片形成，并且具有从引线框架边界朝向引线框架的中心区域向内延伸的引线。半导体管芯安装在中央区域的可拆卸基板上。半导体管芯具有连接焊盘表面，其上具有焊盘，并且连接焊盘表面附接到可移除基板的附接表面。引线框架和管芯用第一密封剂封装，使得引线框架夹在第一密封剂和可移除基板之间。将可移除基板从引线框架移除以露出引线框架的第一表面，然后将管芯焊盘电连接到相应的引线。然后，管芯和引线框架用第二密封剂封装，使得引线框架和管芯夹在第一和第二密封剂之间。然后去除部分第一密封剂以减小包装的厚度并暴露引线。

18. 发明授权

US07969013B2 Through silicon via with dummy structure and method for forming the same 有权
标题翻译：通过具有虚拟结构的硅通孔及其形成方法
公开(公告)号：US07969013B2
公开(公告)日：2011-06-28
申请号：US12791978
申请日：2010-06-02
申请人： Chih-Hua Chen , Chen-Shien Chen , Chen-Cheng Kuo , Wen-Wei Shen
发明人： Chih-Hua Chen , Chen-Shien Chen , Chen-Cheng Kuo , Wen-Wei Shen
IPC分类号： H01L23/48
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A through silicon via structure includes a top pad and a vertical conductive post that is connected to the top pad. The top pad covers a wider area than the cross section of the vertical conductive post. An interconnect pad is formed at least partially below the top pad. An under layer is also formed at least partially below the top pad. At least one dummy structure connects the top pad and the under layer to fasten the top pad and the interconnect pad.
摘要翻译：透硅通孔结构包括顶焊盘和连接到顶焊盘的垂直导电柱。顶部焊盘覆盖比垂直导电柱的横截面更宽的区域。互连焊盘至少部分地形成在顶部焊盘的下方。底层也至少部分地形成在顶垫的下方。至少一个虚拟结构连接顶部焊盘和下层以紧固顶部焊盘和互连焊盘。

19. 发明申请

US20110095436A1 THROUGH SILICON VIA WITH DUMMY STRUCTURE AND METHOD FOR FORMING THE SAME 有权
标题翻译：通过具有深度结构的硅和其形成方法
公开(公告)号：US20110095436A1
公开(公告)日：2011-04-28
申请号：US12791978
申请日：2010-06-02
申请人： Chih-Hua CHEN , Chen-Shien CHEN , Chen-Cheng KUO , Wen-Wei SHEN
发明人： Chih-Hua CHEN , Chen-Shien CHEN , Chen-Cheng KUO , Wen-Wei SHEN
IPC分类号： H01L23/48 , H01L21/768
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A through silicon via structure includes a top pad and a vertical conductive post that is connected to the top pad. The top pad covers a wider area than the cross section of the vertical conductive post. An interconnect pad is formed at least partially below the top pad. An under layer is also formed at least partially below the top pad. At least one dummy structure connects the top pad and the under layer to fasten the top pad and the interconnect pad.
摘要翻译：透硅通孔结构包括顶焊盘和连接到顶焊盘的垂直导电柱。顶部焊盘覆盖比垂直导电柱的横截面更宽的区域。互连焊盘至少部分地形成在顶部焊盘的下方。底层也至少部分地形成在顶垫的下方。至少一个虚拟结构连接顶部焊盘和下层以紧固顶部焊盘和互连焊盘。

20. 发明申请

US20100131187A1 POI RECOMMENDATION APPARATUS AND METHODS, AND STORAGE MEDIA 审中-公开
标题翻译： POI推荐设备和方法以及存储介质
公开(公告)号：US20100131187A1
公开(公告)日：2010-05-27
申请号：US12334577
申请日：2008-12-15
申请人： Wei-Shen Lai , Chia-Chun Shih , Chang-Tai Hsieh
发明人： Wei-Shen Lai , Chia-Chun Shih , Chang-Tai Hsieh
IPC分类号： G01C21/00 , G06F17/30 , G06F7/06
CPC分类号： G01C21/32
摘要： The invention discloses a POI recommendation apparatus comprising a database and a POI recommendation module. The database provides a plurality of predetermined POIs, each having popularity information corresponding to a time period. The POI recommendation module finds out a recommended POI corresponding to the time period from the predetermined POIs according to the popularity information, and transmits the recommended POI to an electronic device.
摘要翻译：本发明公开了一种POI推荐装置，包括数据库和POI推荐模块。数据库提供多个预定的POI，每个POI具有对应于时间段的流行度信息。 POI推荐模块根据流行度信息找出与预定POI相对应的时间段的推荐POI，并将推荐的POI发送到电子设备。

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