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1. 发明授权

US09498898B2 Cleaning mechanism for semiconductor singulation saws 有权
标题翻译：半导体单片锯清洗机构
公开(公告)号：US09498898B2
公开(公告)日：2016-11-22
申请号：US14555562
申请日：2014-11-26
申请人： Zhijie Wang , Zhigang Bai , Mei Liu , Jiyong Niu , Zhimei Sun , Huchang Zhang
发明人： Zhijie Wang , Zhigang Bai , Mei Liu , Jiyong Niu , Zhimei Sun , Huchang Zhang
IPC分类号： B28D7/02 , H01L21/67 , B28D5/02 , B28D1/04
CPC分类号： B28D7/02 , B28D1/04 , B28D5/022 , H01L21/67046 , H01L21/67092
摘要： A cleaning subsystem removes unwanted material, such as glaze, from saw blades used in a semiconductor singulation process. A cleaning module moves radially towards the saw blade and vertically with respect to the plane of the saw blade in order to enable abrasive cleaning blocks of the cleaning module to selectively remove material from either the upper and lower surfaces of the saw blade or the outer edge of the saw blade. The cleaning assembly can remove material from the saw blade at a predetermined time or position during the singulation process or upon detection of load imbalance during the rotation of the saw blade.
摘要翻译：清洁子系统从用于半导体分离过程的锯片中除去不想要的材料，例如釉料。清洁模块相对于锯片的平面径向朝向锯片并且垂直移动，以便清洁模块的研磨清洁块能够选择性地从锯片的上表面和下表面或外边缘去除材料的锯片。清洁组件可以在切割过程期间的预定时间或位置处或者在锯片旋转期间检测到负载不平衡时从锯片上移除材料。

2. 发明授权

US09478236B1 Perpendicular magnetic recording write head 有权
标题翻译：垂直磁记录头
公开(公告)号：US09478236B1
公开(公告)日：2016-10-25
申请号：US13631808
申请日：2012-09-28
申请人： Feng Liu , Jinqiu Zhang , Zhigang Bai , Yugang Wang
发明人： Feng Liu , Jinqiu Zhang , Zhigang Bai , Yugang Wang
IPC分类号： G11B5/147
CPC分类号： G11B5/147 , G11B5/1278 , G11B5/3116
摘要： A main pole of a perpendicular magnetic recording write head is disclosed with a non-rectangular shape at the air bearing surface and a rectangular shape behind the air bearing surface. The main pole transitions from the non-rectangular shape to a rectangular shape at a distance of 10 nm to 100 nm behind the air bearing surface. The main pole includes leading and trailing beveled surfaces that extend from the non-rectangular shape of the pole at the air bearing surface toward the rectangular shape transition.
摘要翻译：公开了一种垂直磁记录写头的主极，在空气轴承表面具有非矩形形状，在空气轴承表面后面呈矩形形状。主极在空气轴承表面后方10nm到100nm的距离处从非矩形形状转变为矩形。主杆包括从空气轴承表面上的极的非矩形形状向矩形形状转变延伸的前后倾斜表面。

3. 发明授权

US09406625B2 Die edge seal employing low-K dielectric material 有权
标题翻译：使用低K电介质材料的密封边缘密封
公开(公告)号：US09406625B2
公开(公告)日：2016-08-02
申请号：US14555558
申请日：2014-11-26
申请人： Zhijie Wang , Zhigang Bai , Jiyong Niu , Dehong Ye , Huchang Zhang
发明人： Zhijie Wang , Zhigang Bai , Jiyong Niu , Dehong Ye , Huchang Zhang
IPC分类号： H01L23/544 , H01L27/118 , H01L41/338 , H01L23/00 , H01L23/58 , H01L21/78 , H01L21/66
CPC分类号： H01L23/562 , H01L21/78 , H01L22/34 , H01L23/585 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor wafer has a multi-stage structure that damps and contains nascent cracks generated during dicing and inhibits moisture penetration into the active region of a die. The wafer includes an array of die regions separated by scribe lanes. The die regions include an active region and a first ring that surrounds the active region. A portion of the first ring includes a low-k dielectric material. A second ring includes a stack of alternating layers of metal and interlayer dielectric (ILD) material. A dummy metal region around the rings includes a stacked dummy metal features and surrounds the active region. A regular or irregular staggered arrangement of saw grid process control (SGPC) features reduces mechanical stress during dicing.
摘要翻译：半导体晶片具有多级结构，其能够阻止并包含切割期间产生的新生裂纹并且抑制水分渗透到模具的有源区域。该晶片包括由划线所隔开的芯片区域阵列。管芯区域包括有源区和围绕有源区的第一环。第一环的一部分包括低k电介质材料。第二环包括金属和层间电介质（ILD）材料的交替层叠。围绕环的虚设金属区域包括堆叠的虚拟金属特征并围绕有源区域。锯格过程控制（SGPC）特征的规则或不规则交错排列降低了切割时的机械应力。

4. 发明授权

US09252114B2 Semiconductor device grid array package 有权
标题翻译：半导体器件栅格阵列封装
公开(公告)号：US09252114B2
公开(公告)日：2016-02-02
申请号：US14551070
申请日：2014-11-23
申请人： Zhijie Wang , Zhigang Bai , Aipeng Shu , Yanbo Xu , Huchang Zhang , Fei Zong
发明人： Zhijie Wang , Zhigang Bai , Aipeng Shu , Yanbo Xu , Huchang Zhang , Fei Zong
IPC分类号： H01L23/04 , H01L23/00 , H01L23/31
CPC分类号： H01L24/17 , H01L23/3128 , H01L23/49838 , H01L23/49861 , H01L24/11 , H01L24/48 , H01L24/49 , H01L24/85 , H01L24/97 , H01L2224/05552 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/85 , H01L2224/85401 , H01L2224/92247 , H01L2924/00014 , H01L2924/15173 , H01L2924/181 , H01L2224/45099 , H01L2924/00012 , H01L2924/014 , H01L2924/00
摘要： A grid array assembly is formed from an electrical insulating material with embedded solder deposits. A first portion of each of the solder deposits is exposed on a first surface of the insulating material and a second portion of each of the solder deposits is exposed on an opposite surface of the insulating material. A semiconductor die is mounted to the first surface of the insulating material and electrodes of the die are connected to the solder deposits with bond wires. The die, bond wires, and the first surface of the insulating material then are covered with a protective encapsulating material.
摘要翻译：栅极阵列组件由具有嵌入式焊料沉积物的电绝缘材料形成。每个焊料沉积物的第一部分暴露在绝缘材料的第一表面上，并且每个焊料沉积物的第二部分暴露在绝缘材料的相对表面上。将半导体管芯安装在绝缘材料的第一表面上，并且将管芯的电极与焊丝连接到焊料沉积物上。然后用保护性封装材料覆盖管芯，接合线和绝缘材料的第一表面。

5. 发明申请

US20150367529A1 CLEANING MECHANISM FOR SEMICONDUCTOR SINGULATION SAWS 有权
标题翻译：用于半导体谐振器的清洁机构
公开(公告)号：US20150367529A1
公开(公告)日：2015-12-24
申请号：US14555562
申请日：2014-11-26
申请人： Zhijie Wang , Zhigang Bai , Mei Liu , Jiyong Niu , Zhimei Sun , Huchang Zhang
发明人： Zhijie Wang , Zhigang Bai , Mei Liu , Jiyong Niu , Zhimei Sun , Huchang Zhang
IPC分类号： B28D7/02 , B08B1/04 , B28D1/04 , H01L21/67 , B28D5/02
CPC分类号： B28D7/02 , B28D1/04 , B28D5/022 , H01L21/67046 , H01L21/67092
摘要： A cleaning subsystem removes unwanted material, such as glaze, from saw blades used in a semiconductor singulation process. A cleaning module moves radially towards the saw blade and vertically with respect to the plane of the saw blade in order to enable abrasive cleaning blocks of the cleaning module to selectively remove material from either the upper and lower surfaces of the saw blade or the outer edge of the saw blade. The cleaning assembly can remove material from the saw blade at a predetermined time or position during the singulation process or upon detection of load imbalance during the rotation of the saw blade.
摘要翻译：清洁子系统从用于半导体分离过程的锯片中除去不想要的材料，例如釉料。清洁模块相对于锯片的平面径向朝向锯片并且垂直移动，以便清洁模块的研磨清洁块能够选择性地从锯片的上表面和下表面或外边缘去除材料的锯片。清洁组件可以在切割过程期间的预定时间或位置处或者在锯片旋转期间检测到负载不平衡时从锯片上移除材料。

6. 发明申请

US20150243623A1 SEMICONDUCTOR DEVICE GRID ARRAY PACKAGE 有权
标题翻译：半导体器件阵列阵列
公开(公告)号：US20150243623A1
公开(公告)日：2015-08-27
申请号：US14551070
申请日：2014-11-23
申请人： Zhijie Wang , Zhigang Bai , Aipeng Shu , Yanbo Xu , Huchang Zhang , Fei Zong
发明人： Zhijie Wang , Zhigang Bai , Aipeng Shu , Yanbo Xu , Huchang Zhang , Fei Zong
IPC分类号： H01L23/00 , H01L23/29 , H01L21/56
CPC分类号： H01L24/17 , H01L23/3128 , H01L23/49838 , H01L23/49861 , H01L24/11 , H01L24/48 , H01L24/49 , H01L24/85 , H01L24/97 , H01L2224/05552 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/85 , H01L2224/85401 , H01L2224/92247 , H01L2924/00014 , H01L2924/15173 , H01L2924/181 , H01L2224/45099 , H01L2924/00012 , H01L2924/014 , H01L2924/00
摘要： A grid array assembly is formed from an electrical insulating material with embedded solder deposits. A first portion of each of the solder deposits is exposed on a first surface of the insulating material and a second portion of each of the solder deposits is exposed on an opposite surface of the insulating material. A semiconductor die is mounted to the first surface of the insulating material and electrodes of the die are connected to the solder deposits with bond wires. The die, bond wires, and the first surface of the insulating material then are covered with a protective encapsulating material.
摘要翻译：栅极阵列组件由具有嵌入式焊料沉积物的电绝缘材料形成。每个焊料沉积物的第一部分暴露在绝缘材料的第一表面上，并且每个焊料沉积物的第二部分暴露在绝缘材料的相对表面上。将半导体管芯安装在绝缘材料的第一表面上，并且将管芯的电极与焊丝连接到焊料沉积物上。然后用保护性封装材料覆盖管芯，接合线和绝缘材料的第一表面。

7. 发明授权

US09053715B1 System for providing a transducer having a split main pole 有权
标题翻译：用于提供具有分裂主极的换能器的系统
公开(公告)号：US09053715B1
公开(公告)日：2015-06-09
申请号：US13075070
申请日：2011-03-29
申请人： Lisha Wang , Tao Pan , Sining Mao , Zhigang Bai , Feng Liu , Zhanjie Li
发明人： Lisha Wang , Tao Pan , Sining Mao , Zhigang Bai , Feng Liu , Zhanjie Li
IPC分类号： G11B5/147 , G11B5/31
CPC分类号： G11B5/3116 , G11B5/1278 , Y10T29/49044
摘要： A method and system for providing a magnetic recording head is described. The magnetic recording head has an air-bearing surface (ABS) configured to reside in proximity to a media during use. The magnetic recording head includes a main pole, at least one auxiliary pole, a nonmagnetic spacer, and at least one coil. The main pole includes a first main pole piece and a second main pole piece. The first main pole piece includes a pole tip occupying a portion of the ABS and a back edge distal from the ABS. The second main pole piece has a front surface. The auxiliary pole(s) have a front recessed from the ABS and are magnetically coupled with the main pole. The nonmagnetic spacer is between the back edge of the first main pole piece and the front surface of the second main pole piece. The coil(s) are for energizing the main pole.
摘要翻译：描述了一种用于提供磁记录头的方法和系统。磁记录头具有在使用期间被配置为驻留在介质附近的空气轴承表面（ABS）。磁记录头包括主极，至少一个辅助极，非磁性间隔物和至少一个线圈。主极包括第一主极片和第二主极片。第一主极件包括占据ABS的一部分的极尖和远离ABS的后边缘。第二主极片具有前表面。辅助极具有从ABS凹入的前部并与主极磁耦合。非磁性间隔物位于第一主极片的后边缘和第二主极片的前表面之间。线圈用于激励主极。

8. 发明申请

US20140191383A1 POWER DEVICE AND METHOD OF PACKAGING SAME 审中-公开
标题翻译：电源装置及其包装方法
公开(公告)号：US20140191383A1
公开(公告)日：2014-07-10
申请号：US14205374
申请日：2014-03-12
申请人： Jinzhong YAO , Zhigang Bai , Xuesong Xu
发明人： Jinzhong YAO , Zhigang Bai , Xuesong Xu
IPC分类号： H01L23/495
CPC分类号： H01L23/49537 , H01L21/561 , H01L21/565 , H01L23/3107 , H01L23/4334 , H01L23/49551 , H01L23/49568 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/13101 , H01L2224/1329 , H01L2224/16245 , H01L2224/2919 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/49171 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/83192 , H01L2224/92242 , H01L2224/97 , H01L2924/00014 , H01L2924/0781 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/0665 , H01L2924/014 , H01L2924/00012
摘要： A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers.
摘要翻译：封装功率半导体管芯的方法包括提供双量规引线框架的第一引线框架。第一引线框架包括厚的芯片焊盘。磁带附着到厚芯片焊盘的第一侧，并且功率管芯附接到厚芯片焊盘的第二侧。提供了双量规引线框架的第二引线框架。第二引线框架具有薄的引线指。引线指的一端连接到功率管芯的有源表面，使得引线指电连接到功率管芯的焊盘。然后将模塑料分配到双量规引线框架的顶表面上，使得模制化合物覆盖电源模具和引线指。

9. 发明授权

US08705205B1 Magnetic recording head having a dual sidewall angle 有权
标题翻译：具有双重侧壁角度的磁记录头
公开(公告)号：US08705205B1
公开(公告)日：2014-04-22
申请号：US13169685
申请日：2011-06-27
申请人： Yunfei Li , Lijie Guan , Ying Hong , Zhigang Bai , Jinqiu Zhang , Yugang Wang , Feng Liu , Tao Pan
发明人： Yunfei Li , Lijie Guan , Ying Hong , Zhigang Bai , Jinqiu Zhang , Yugang Wang , Feng Liu , Tao Pan
IPC分类号： G11B5/127
CPC分类号： G11B5/3163 , G11B5/1278 , G11B5/3116 , G11B5/315
摘要： A magnetic transducer having an air-bearing surface (ABS) is described. The magnetic transducer includes a pole and at least one coil for energizing the pole. The pole has a pole tip proximate to the ABS, a yoke distal from the ABS, and a bottom surface including a bottom bevel. At least the yoke includes at least one sidewall having a first angle and a second angle. The first angle is between the bottom surface and the at least one sidewall. The second angle is a constant distance along the at least one sidewall from the first angle.
摘要翻译：描述了具有空气轴承表面（ABS）的磁换能器。磁换能器包括极和用于激励极的至少一个线圈。杆具有靠近ABS的极尖端，远离ABS的轭，以及包括底部斜面的底表面。至少轭包括具有第一角度和第二角度的至少一个侧壁。第一角度在底表面和至少一个侧壁之间。第二角度是从第一角度沿着至少一个侧壁的恒定距离。

10. 发明授权

US08582238B1 Systems and methods for providing perpendicular magnetic writers having gradient magnetic moment side shields 有权
标题翻译：用于提供具有梯度磁矩侧屏蔽的垂直磁性写入器的系统和方法
公开(公告)号：US08582238B1
公开(公告)日：2013-11-12
申请号：US13279105
申请日：2011-10-21
申请人： Feng Liu , Zhigang Bai , Dehua Han , Ming Sun , Yugang Wang , Tao Pan
发明人： Feng Liu , Zhigang Bai , Dehua Han , Ming Sun , Yugang Wang , Tao Pan
IPC分类号： G11B5/33
CPC分类号： G11B5/3163 , G11B5/1278 , G11B5/3116 , G11B5/315
摘要： Systems and methods for providing perpendicular magnetic writers having gradient magnetic moment side shields are provided. In one case, the system includes a pole having a leading edge and trailing edge, a leading shield positioned closer to the leading edge than the trailing edge, the leading shield having a leading shield moment, a trailing shield positioned closer to the trailing edge than the leading edge, the trailing shield having a trailing shield moment greater than the leading shield moment, and a side shield positioned along side of the pole, the side shield including a gradient magnetic moment progressing from a first side shield moment to a second side shield moment, where the first side shield moment is about equal to the leading shield moment, and where the second side shield moment is about equal to the trailing shield moment and positioned closer to the trailing shield than the leading shield.
摘要翻译：提供了用于提供具有梯度磁矩侧屏蔽的垂直磁性写入器的系统和方法。在一种情况下，系统包括具有前缘和后缘的杆，位于比后缘更靠近前缘的前护罩，前护罩具有前屏蔽力矩，位于靠近后缘的后挡板比所述前缘，所述后挡板具有大于所述前屏蔽力矩的后屏蔽力矩，以及沿所述杆的侧面定位的侧屏蔽，所述侧屏蔽包括从第一侧屏蔽力矩到第二侧屏蔽的梯度磁矩其中第一侧面屏蔽力矩大约等于前导屏蔽力矩，并且其中第二侧面屏蔽力矩大约等于尾部屏蔽力矩，并且位于比前导屏蔽件更靠近尾部屏蔽件的位置。

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