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    • 15. 发明授权
    • Beam irradiation apparatus and beam irradiation method
    • 光束照射装置和光束照射方法
    • US09449791B2
    • 2016-09-20
    • US14736928
    • 2015-06-11
    • Sumitomo Heavy Industries Ion Technology Co., Ltd.
    • Mitsukuni TsukiharaNoriyasu IdoNoriyuki Suetsugu
    • H01J37/302H01J37/304H01J37/317
    • H01J37/304H01J37/3171H01J2237/30455H01J2237/31701H01J2237/31703
    • Provided is a beam irradiation apparatus including: a beam scanner that is configured such that a charged particle beam is reciprocatively scanned in a scanning direction; a measurement device that is capable of measuring an angular component of charged particles incident into a region of a measurement target; and a data processor that calculates effective irradiation emittance of the charged particle beam using results measured by the measurement device. The measurement device measures a time dependent value for angular distribution of the charged particle beam. The data processor transforms time information included in the time dependent value for the angular distribution to position information and thus calculates the effective irradiation emittance. The effective irradiation emittance represents emittance of a virtual beam bundle, the virtual beam bundle being formed by summing portions of the charged particle beam which are incident into the region of the measurement target.
    • 本发明提供一种束照射装置,包括:束扫描器,被配置为使得带电粒子束沿扫描方向往复扫描; 测量装置,其能够测量入射到测量对象的区域中的带电粒子的角分量; 以及使用由测量装置测量的结果计算带电粒子束的有效照射发射率的数据处理器。 测量装置测量带电粒子束的角度分布的时间依赖值。 数据处理器将角分布的时间相关值中包含的时间信息变换为位置信息,从而计算有效的照射发射率。 有效辐射发射率表示虚拟束束的发射率,虚拟束束是通过对入射到测量目标区域的带电粒子束的部分进行求和而形成的。
    • 17. 发明授权
    • Ion implantation apparatus and ion implantation method
    • 离子注入装置和离子注入方法
    • US09236222B2
    • 2016-01-12
    • US14732239
    • 2015-06-05
    • Sumitomo Heavy Industries Ion Technology Co., Ltd.
    • Takanori YagitaMitsuaki Kabasawa
    • H01J37/317H01J37/147H01J37/10
    • H01J37/3171H01J37/147H01J37/1474
    • An ion implantation apparatus includes a beam scanning unit and a beam parallelizing unit arranged downstream thereof. The beam scanning unit has a scan origin in a central part of the scanning unit on a central axis of an incident ion beam. The beam parallelizing unit has a focal point of a parallelizing lens at the scan origin. The ion implantation apparatus is configured such that a focal position of the incident beam into the scanning unit is located upstream of the scan origin along the central axis of the incident beam. The focal position of the incident beam into the scanning unit is adjusted to be at a position upstream of the scan origin along the central axis of the incident beam such that a divergence phenomenon caused by the space charge effect in an exiting ion beam from the parallelizing unit is compensated.
    • 离子注入装置包括光束扫描单元和布置在其下游的光束并行化单元。 光束扫描单元在入射离子束的中心轴上的扫描单元的中心部分具有扫描原点。 光束平行化单元具有在扫描原点处的平行化透镜的焦点。 离子注入装置被构造成使得入射到扫描单元中的入射光束的焦点位置沿着入射光束的中心轴线位于扫描原点的上游。 将入射光束到扫描单元中的焦点位置被调整为沿着入射光束的中心轴的扫描原点的上游位置,使得由离开的离子束中的空间电荷效应引起的发散现象来自并联 单位得到补偿。
    • 18. 发明授权
    • Ion implantation apparatus and ion implantation method
    • 离子注入装置和离子注入方法
    • US09208996B2
    • 2015-12-08
    • US14077746
    • 2013-11-12
    • SEN Corporation
    • Mitsukuni TsukiharaMitsuaki Kabasawa
    • H01J37/317H01J37/302
    • H01J37/3171H01J37/302H01J2237/0455H01J2237/047H01J2237/30472
    • An ion implantation apparatus includes a beamline device for transporting ions from an ion source to an implantation processing chamber. The implantation processing chamber includes a workpiece holder for mechanically scanning a workpiece with respect to a beam irradiation region. The beamline device may be operated under a first implantation setting configuration suitable for transport of a low energy/high current beam for high-dose implantation into the workpiece, or a second implantation setting configuration suitable for transport of a high energy/low current beam for low-dose implantation into the workpiece. A beam center trajectory being a reference in a beamline is equal from the ion source to the implantation processing chamber in the first implantation setting configuration and the second implantation setting configuration.
    • 离子注入装置包括用于将离子从离子源输送到注入处理室的束线装置。 植入处理室包括用于相对于束照射区域机械地扫描工件的工件保持器。 束线装置可以在适合于将高能量/高电流束输送到工件中的低能量/高电流束的第一注入设置配置下运行,或者适于传输高能/低电流束的第二注入设置配置 低剂量注入工件。 在第一植入设置配置和第二植入设置配置中,在束线中作为参考的束中心轨迹从离子源到注入处理室相等。
    • 19. 发明授权
    • Ion implantation apparatus
    • 离子注入装置
    • US09208991B1
    • 2015-12-08
    • US14721752
    • 2015-05-26
    • Sumitomo Heavy Industries Ion Technology Co., Ltd.
    • Hiroshi MatsushitaMitsuaki KabasawaYoshitaka AmanoTakanori Yagita
    • H01J3/18H01J37/147H01J37/317H01J37/08
    • H01J37/1477H01J37/08H01J37/3171H01J2237/30483
    • An ion implantation apparatus includes a scanning unit scanning the ion beams in a horizontal direction perpendicular to the reference trajectory and a downstream electrode device disposed downstream of the scanning electrode device. The scanning electrode device includes a pair of scanning electrodes disposed to face each other in the horizontal direction with the reference trajectory interposed therebetween. The downstream electrode device includes an electrode body configured such that, with respect to an opening width in a vertical direction perpendicular to both the reference trajectory and the horizontal direction and/or an opening thickness in a direction along the reference trajectory, the opening width and/or the opening thickness in a central portion in which the reference trajectory is disposed is different from the opening width and/or the opening thickness in the vicinity of a position facing the downstream end of the scanning electrode.
    • 离子注入装置包括:扫描单元,沿垂直于参考轨迹的水平方向扫描离子束;以及下游电极装置,设置在扫描电极装置的下游。 扫描电极装置包括一对沿水平方向彼此相对设置的扫描电极,其间插入有基准轨迹。 下游电极装置包括:电极体,其构成为:相对于垂直于基准轨迹和水平方向的垂直方向的开口宽度和/或沿着基准轨迹的方向的开口厚度,开口宽度和 配置基准轨迹的中央部的开口厚度与扫描电极的下游端的位置附近的开口宽度和/或开口厚度不同。