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    • 22. 发明授权
    • Process of forming an aramid copolymer
    • 形成芳族聚酰胺共聚物的方法
    • US08907052B2
    • 2014-12-09
    • US13559698
    • 2012-07-27
    • Kiu-Seung Lee
    • Kiu-Seung Lee
    • C08G73/00C08G69/26C08G69/32C08K5/3415C08G73/18C08K5/20C08K3/16
    • C08K5/3415C08G69/265C08G69/32C08G73/18C08K3/16C08K5/20C08L77/10C08L79/04
    • The invention concerns processes for forming a polymer comprising residues of 2-(4-amino phenyl)-5(6)amino benzimidazole (DAPBI), paraphenylene diamine (PPD), and terephthaloyl dichloride, comprising the steps of: (a) forming a slurry of DAPBI in a solvent system comprising an organic solvent and an inorganic salt; (b) adding less than a stoichiometric amount, relative to the amount of DAPBI, of terephthaloyl dichloride to the slurry; (c) agitating the slurry to react the DAPBI and terephthaloyl dichloride to form an oligomeric solution; (d) adding PPD to the oligomeric solution and agitating until essentially all of the PPD is dissolved, followed by the addition of terephthaloyl dichloride to form a prepolymer solution; and (e) allowing the prepolymer solution to form a polymer.
    • 本发明涉及形成包含2-(4-氨基苯基)-5(6)氨基苯并咪唑(DAPBI),对苯二胺(PPD)和对苯二甲酰氯的残留物的聚合物的方法,包括以下步骤:(a) DAPBI的浆料在包含有机溶剂和无机盐的溶剂体系中; (b)将相对于DAPBI的量的对苯二甲酰氯的化学计量相对于浆料加入少于; (c)搅拌浆料以使DAPBI和对苯二酰氯反应形成低聚溶液; (d)将PPD加入到低聚溶液中并搅拌直到基本上所有的PPD溶解,然后加入对苯二甲酰氯以形成预聚物溶液; 和(e)使预聚物溶液形成聚合物。
    • 27. 发明申请
    • LARGE SCALE PROCESS FOR POLYMERIZATION OF DAPBI-CONTAINING POLYARAMID
    • 含有多聚氨基甲酸酯的聚合方法的大规模化方法
    • US20110046340A1
    • 2011-02-24
    • US12937849
    • 2009-04-09
    • Richard Elena Theodorus Petrus De VosJoannes Marinus SurquinMarlieke Elisabeth Josephine Pepels
    • Richard Elena Theodorus Petrus De VosJoannes Marinus SurquinMarlieke Elisabeth Josephine Pepels
    • C08G73/18
    • C08G69/32C08G69/28C08G73/18C08K3/16
    • A method for obtaining an aromatic polyamide crumb from an aromatic diamine and an aromatic diacid chloride, which aromatic polyamide comprises 5(6)-amino-2-(p-aminophenyl)benzimidazole terephthalamide units and has a relative viscosity ηrel of at least 3, by: (1) adding at least monomers (i)-(iii) in N-methyl pyrrolidone as solvent wherein (i) is 0-30 mole % para-phenylenediamine (PPD), (ii) is 20-50 mole % 5(6)-amino-2-(p-aminophenyl)benzimidazole (DABPI), (iii) is 49.05-50.05 mole % terephthaloyl dichloride (TDC), and optionally calcium chloride to obtain a CaCl2/aromatic diamine molar ratio less than 0.5, and an aromatic diamine/aromatic diacid chloride ratio between 0.99 and 1.01; (2) mixing the monomers and the optional calcium chloride to a homogenous mixture having a monomer concentration of 5 to 12 wt %; followed by (3) adding calcium chloride to the homogeneous mixture to obtain a CaCl2/aromatic diamine molar ratio 0.6-1.0; and (4) polymerizing the mixture.
    • 芳香族聚酰胺包含5(6) - 氨基-2-(对氨基苯基)苯并咪唑对苯二甲酰胺单元的芳族二胺和芳香族二酰氯获得芳香族聚酰胺碎屑的方法,其相对粘度和相对密度至少为 3,通过:(1)在N-甲基吡咯烷酮作为溶剂中加入至少单体(i) - (iii),其中(i)为0-30摩尔%对苯二胺(PPD),(ii)为20-50摩尔 %5(6) - 氨基-2-(对氨基苯基)苯并咪唑(DABPI),(iii)为49.05-50.05摩尔%对苯二酰氯(TDC),任选氯化钙,得到CaCl 2 /芳族二胺摩尔比小于 0.5,芳族二胺/芳族二酰氯比例在0.99〜1.01之间; (2)将单体和任选的氯化钙混合到单体浓度为5至12重量%的均匀混合物中; 然后(3)向均匀混合物中加入氯化钙,得到CaCl 2 /芳族二胺摩尔比0.6-1.0; 和(4)使混合物聚合。
    • 30. 发明授权
    • High temperature resistant antistatic pressure-sensitive adhesive tape
    • 耐高温抗静电压敏胶带
    • US5914186A
    • 1999-06-22
    • US709067
    • 1996-09-06
    • Steven D. YauGustav Gutman
    • Steven D. YauGustav Gutman
    • C08G73/18C09J7/02C09J9/00H05K3/00H05K3/28H05K3/34B32B5/16
    • C09J7/02C08G73/18C09J7/0207C09J7/0246C09J9/00H05K3/0076H05K2203/0191H05K2203/0278H05K2203/125H05K3/3452Y10T428/254Y10T428/2843Y10T428/2852Y10T428/2857Y10T428/2998Y10T428/31877Y10T428/31928
    • A heat-resistant anti-static pressure-sensitive adhesive tape comprising a substrate having coated thereon an acrylic microparticulate adhesive having an average diameter of at least about 1 micrometer, wherein the microparticles have a surface bearing thereon a conductive material formed from a polymer electrolyte base polymer, and at least one ionic salt selected from the group consisting of salts of alkali metals and salts of alkaline earth metals, and at least one thermal stabilizer selected from the group consisting of hindered amines, salts of substituted toluimidazoles, and mixtures thereof, said substituted toluimidazoles having the formula: ##STR1## wherein R.sub.1 is selected from the group consisting of hydrogen, a methyl group, an ethyl group and a propyl group, R.sub.2 is selected from the group consisting of hydrogen, a methyl group and an ethyl group, M is a metal, and x is an integer selected from 1 or 2 with positive or negative identity being dependent on the valence of the metal, said adhesive being adhered to said substrate by means of a primer, said primer comprising at least one phenolic resin, at least one rubbery compound, and at least one of said thermal stabilizers, said adhesive tape being capable of surviving immersion in molten solder at 260.degree. C. for at least about 5 seconds.
    • 一种耐热性抗静电压敏粘合带,其包括在其上涂覆有平均直径为至少约1微米的丙烯酸类微粒粘合剂的基材,其中所述微粒具有承载有由聚合物电解质基材形成的导电材料的表面 聚合物和至少一种选自碱金属盐和碱土金属盐的离子盐,以及至少一种选自受阻胺,取代的甲苯咪唑的盐及其混合物的热稳定剂,所说的 取代的具有下式的甲苯咪唑:其中R1选自氢,甲基,乙基和丙基,R2选自氢,甲基和乙基,M是 金属,x是选自1或2的整数,正或负同一性取决于金属的价态 粘合剂通过底漆粘附到所述基材上,所述底漆包含至少一种酚醛树脂,至少一种橡胶状化合物和至少一种所述热稳定剂,所述粘合带能够在260℃下浸入熔融焊料中存活。 C.至少约5秒钟。