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31. 发明申请

US20110088431A1 FUSION-BONDING PROCESS FOR GLASS 有权
标题翻译：玻璃熔融粘合工艺
公开(公告)号：US20110088431A1
公开(公告)日：2011-04-21
申请号：US12994539
申请日：2009-06-03
申请人： Satoshi Matsumoto
发明人： Satoshi Matsumoto
IPC分类号： C03C27/06 , C03C17/02 , C03B29/00
CPC分类号： C03C23/0025 , B23K26/324 , C03C17/04 , C03C27/10
摘要： When fixing a glass layer 3 to a glass member 4, a region to be fused R from an irradiation initiation position A in the region to be fused R to the irradiation initiation position A is irradiated therealong with a laser beam L1, and successively an unstable region extending from the irradiation initiation position A in the region to be fused R to a stable region initiation position B is therealong irradiated with the laser beam L1 again, so as to remelt the glass layer 3 in the unstable region, turn the unstable region into a stable region, and then fix the glass layer 3 to the glass member 4. Thereafter, a laser beam L2 fuses glass members 4, 5 together through the glass layer 3 having the whole region to be fused R turned into the stable region, so as to yield a glass fusing structure 1.
摘要翻译：当将玻璃层3固定在玻璃构件4上时，从熔融区域R的照射开始位置A到照射开始位置A的熔融区域R被照射到激光束L1上，并且依次不稳定从熔融区域R的照射开始位置A延伸到稳定区域开始位置B的区域再次被激光束L1照射，以使玻璃层3重新熔融在不稳定区域，将不稳定区域变成稳定区域，然后将玻璃层3固定到玻璃构件4.之后，激光束L2通过玻璃层3将具有整个区域的熔融R的玻璃层3熔合在一起变成稳定区域，因此以产生玻璃熔化结构1。

32. 发明授权

US07888277B2 Methods of repairing a substrate 有权
标题翻译：修复基材的方法
公开(公告)号：US07888277B2
公开(公告)日：2011-02-15
申请号：US12621120
申请日：2009-11-18
申请人： James A. Riedell , Timothy E. Easler
发明人： James A. Riedell , Timothy E. Easler
IPC分类号： C04B35/00 , C03B29/00
CPC分类号： C04B35/565 , B64G1/58 , C04B35/58078 , C04B35/6269 , C04B41/009 , C04B41/5059 , C04B41/87 , C04B2111/00982 , C04B2235/3225 , C04B2235/3813 , C04B2235/3826 , C04B2235/483 , C04B2235/5436 , C04B2235/5445 , C04B41/0054 , C04B41/4535 , C04B41/4554 , C04B41/4572 , C04B41/5045 , C04B41/507 , C04B35/83 , C04B35/80
摘要： A precursor of a ceramic adhesive suitable for use in a vacuum, thermal, and microgravity environment. The precursor of the ceramic adhesive includes a silicon-based, preceramic polymer and at least one ceramic powder selected from the group consisting of aluminum oxide, aluminum nitride, boron carbide, boron oxide, boron nitride, hafnium boride, hafnium carbide, hafnium oxide, lithium aluminate, molybdenum silicide, niobium carbide, niobium nitride, silicon boride, silicon carbide, silicon oxide, silicon nitride, tin oxide, tantalum boride, tantalum carbide, tantalum oxide, tantalum nitride, titanium boride, titanium carbide, titanium oxide, titanium nitride, yttrium oxide, zirconium boride, zirconium carbide, zirconium oxide, and zirconium silicate. Methods of forming the ceramic adhesive and of repairing a substrate in a vacuum and microgravity environment are also disclosed, as is a substrate repaired with the ceramic adhesive.
摘要翻译：适用于真空，热和微重力环境的陶瓷粘合剂的前体。陶瓷粘合剂的前体包括硅基预陶瓷聚合物和选自氧化铝，氮化铝，碳化硼，氧化硼，氮化硼，硼化铪，碳化铪，氧化铪中的至少一种陶瓷粉末，铝酸锂，硅化钼，碳化铌，氮化铌，硼化硅，碳化硅，氧化硅，氮化硅，氧化锡，硼化钽，碳化钽，氧化钽，氮化钽，硼化钛，碳化钛，氧化钛，氮化钛，氧化钇，硼化锆，碳化锆，氧化锆和硅酸锆。还公开了在真空和微重力环境中形成陶瓷粘合剂和修复基材的方法，以及用陶瓷粘合剂修复的基材。

33. 发明授权

US07867349B2 Thick film green sheet slurry, production method of thick film green sheet slurry, production method of thick film green sheet and production methods of thick film green sheet and electronic device 失效
标题翻译：厚膜生片，厚膜生片生产方法，厚膜生片生产方法及厚膜生片及电子器件的生产方法
公开(公告)号：US07867349B2
公开(公告)日：2011-01-11
申请号：US11658767
申请日：2004-08-04
申请人： Toru Tonogai , Shigeki Satou , Hisashi Kobayashi
发明人： Toru Tonogai , Shigeki Satou , Hisashi Kobayashi
IPC分类号： C03B29/00 , C04B35/03
CPC分类号： H01G4/1227 , B32B18/00 , C04B35/465 , C04B35/4682 , C04B35/47 , C04B35/6261 , C04B35/6264 , C04B35/6342 , C04B35/638 , C04B2235/3206 , C04B2235/3225 , C04B2235/3239 , C04B2235/3241 , C04B2235/3436 , C04B2235/3454 , C04B2235/5445 , C04B2235/6025 , C04B2235/606 , C04B2235/608 , C04B2235/61 , C04B2235/612 , C04B2235/6562 , C04B2235/6565 , C04B2235/6567 , C04B2235/6582 , C04B2235/6584 , C04B2235/9661 , C04B2237/346 , C04B2237/704 , H01G4/1209 , H01G4/30
摘要： A thick film green sheet slurry, a production method of thick film green sheet slurry, a production method of a thick film green sheet, a thick film green sheet and a production method of an electronic device are provided; by which coating of a relatively thick film becomes possible, a sheet formed after coating has excellent cutting property (strength capable of being cut), and a sheet having high air permeability, excellent handleability and a high adhesive force can be formed. In the present invention, a thick film green sheet slurry comprises a ceramic powder, a binder resin including a butyral based resin as the main component, and a solvent: wherein the solvent includes a good solvent for letting the binder resin dissolved well therein and a poor solvent having lower solubility to the binder resin comparing with that of the good solvent; and the poor solvent is included in a range of 30 to 60 wt % with respect to the entire solvent. The good solvent is alcohol, and the poor solvent may be toluene, xylene, mineral spirit, benzyl acetate, solvent naphtha, etc.
摘要翻译：提供厚膜生片浆料，厚膜生片浆料的制造方法，厚膜生片的制造方法，厚膜生片和电子器件的制造方法。通过这样可以形成相对厚的膜的涂层，涂布后形成的片材具有优异的切割性（能够切割的强度），并且可以形成具有高透气性，优异的可操作性和高粘合力的片材。在本发明中，厚膜生片浆料包括陶瓷粉末，包含丁缩醛树脂作为主要成分的粘合剂树脂和溶剂：其中溶剂包括用于使粘合剂树脂很好地溶解在其中的良好溶剂和与溶剂相比，粘合剂树脂的溶解性差; 相对于整个溶剂，不良溶剂的含量为30〜60重量％。好的溶剂是醇，不良溶剂可以是甲苯，二甲苯，矿物油，乙酸苄酯，溶剂石脑油等。

34. 发明申请

US20100101702A1 METHOD OF MANUFACTURING MULTILAYER CERAMIC SUBSTRATE 失效
标题翻译：制造多层陶瓷基板的方法
公开(公告)号：US20100101702A1
公开(公告)日：2010-04-29
申请号：US12476538
申请日：2009-06-02
申请人： Yong Seok CHOI , Seung Gyo Jeong , Eun Tae Park , Ki Pyo Hong , Soo Hyun Lyoo
发明人： Yong Seok CHOI , Seung Gyo Jeong , Eun Tae Park , Ki Pyo Hong , Soo Hyun Lyoo
IPC分类号： C03B29/00
CPC分类号： B32B18/00 , C04B35/634 , C04B37/005 , C04B2235/36 , C04B2237/10 , C04B2237/341 , C04B2237/562 , C04B2237/565 , C04B2237/595 , C04B2237/62 , C04B2237/68 , C04B2237/704 , C04B2237/708 , C04B2237/72 , H01G4/105 , H01G4/232 , H01G4/30 , H05K3/4629 , H05K2201/0195 , H05K2203/061 , Y10T156/1089
摘要： Disclosed is a method of manufacturing a multilayer ceramic substrate. The method includes providing a plurality of ceramic blocks, each including a ceramic laminate having a first surface and a second surface and having a laminated structure of a plurality of ceramic green sheets containing a glass ceramic component, and a first bonding ceramic green sheet including a glass component and disposed on a surface of the first and second surfaces of the ceramic laminate, which is to contact another ceramic laminate, firing the plurality of ceramic blocks, laminating the plurality of ceramic blocks such that the first bonding ceramic green sheets of the adjacent ceramic blocks face each other, and bonding the plurality of ceramic blocks using the glass component of the first bonding ceramic green sheets.
摘要翻译：公开了一种制造多层陶瓷基板的方法。该方法包括提供多个陶瓷块，每个陶瓷块包括具有第一表面和第二表面的陶瓷层压体，并且具有包含玻璃陶瓷部件的多个陶瓷生片的层叠结构，以及第一粘合陶瓷生片，玻璃组分，并且设置在陶瓷层压体的第一和第二表面的与另一陶瓷层压体接触的表面上，烧制多个陶瓷块，层叠多个陶瓷块，使得相邻的第一粘合陶瓷生片陶瓷块彼此面对，并且使用第一接合陶瓷生片的玻璃成分接合多个陶瓷块。

35. 发明授权

US07699299B2 Gripping jig for assembling, assembling device, and producing method of assembled body 失效
标题翻译：组装装配夹具，组装体的生产方法
公开(公告)号：US07699299B2
公开(公告)日：2010-04-20
申请号：US11867035
申请日：2007-10-04
申请人： Kunihiko Yoshioka , Kazuhi Matsumoto , Koji Kimura , Shinya Yoshida , Takashi Ota
发明人： Kunihiko Yoshioka , Kazuhi Matsumoto , Koji Kimura , Shinya Yoshida , Takashi Ota
IPC分类号： B29C65/00 , B32B37/00 , C03B29/00 , B23Q3/08 , B25B1/20 , B23Q1/25
CPC分类号： B28B1/002 , H01J9/266 , Y10T29/49895 , Y10T29/53961 , Y10T29/53991 , Y10T156/10 , Y10T156/1002
摘要： A gripping jig for assembling applies a force to a molded body in a direction perpendicular to an assembling direction. When an assembling load is applied to the molded body, the force is adjustable with an adjustment screw such that the molded body is guided to move in the assembling direction. Since the force is applied from a direction different from the assembling direction, the molded body can move in the assembling direction, and as the force is adjustable, application of the assembling load to the molded body and movement of the molded body can be adjusted. Since a plurality of molded bodies are fixed and assembled respectively, when there are variations in size of the molded bodies, if an excessive assembling load is applied, each molded body is guided to move, so that more uniform assembling load is applied to the plurality of molded bodies.
摘要翻译：用于组装的夹持夹具在垂直于组装方向的方向上对模制体施加力。当组装负载施加到成型体时，可以通过调节螺钉调节力，使得成型体被引导以沿组装方向移动。由于从与组装方向不同的方向施加力，所以成型体能够沿组装方向移动，并且随着力的调整，可以调节组装负荷对成型体的应用和成形体的移动。由于多个成型体分别被固定和组装，所以当成形体的尺寸有变化时，如果施加过大的组装载荷，则各个成型体被引导移动，使得更多的组装载荷被施加到多个的成型体。

36. 发明申请

US20100068601A1 FIBROUS CERAMIC MATERIAL AND METHOD FOR MAKING THE SAME 有权
标题翻译：纤维陶瓷材料及其制造方法
公开(公告)号：US20100068601A1
公开(公告)日：2010-03-18
申请号：US12233427
申请日：2008-09-18
申请人： Chao-Yi Yuh , Dana A. Kelley , Nikhil H. Jalani
发明人： Chao-Yi Yuh , Dana A. Kelley , Nikhil H. Jalani
IPC分类号： H01M2/08 , C04B35/00 , C03B29/00
CPC分类号： C04B35/803 , B32B18/00 , C04B35/62231 , C04B35/62236 , C04B35/6225 , C04B2235/3217 , C04B2235/3272 , C04B2235/3418 , C04B2235/5268 , C04B2235/72 , C04B2237/34 , C04B2237/343 , C04B2237/348 , C04B2237/38 , H01M8/0282 , H01M8/2485 , H01M2008/147 , Y02E60/526 , Y02P70/56 , Y10T428/249922 , Y10T428/249964 , Y10T428/24997 , Y10T442/614 , Y10T442/67 , Y10T442/696
摘要： A fibrous ceramic material including a plurality of fibers entangled with one another. The fibrous ceramic material includes at least one connector projecting between the fibers. At least a portion of the fibers have the connectors extending between and attach the fibers to one another. A method of manufacturing the fibrous ceramic material includes providing a precursor material having a plurality of fibers. A holder is provided for holding the precursor material. The precursor material is placed on the holder and both are heated to between about 1500 degrees Celsius and about 1700 degrees Celsius to form the fibrous ceramic material, thereby causing connectors to project from a portion of the fibers and attach the fibers to one another.
摘要翻译：一种纤维状陶瓷材料，包括彼此缠结的多根纤维。纤维状陶瓷材料包括在纤维之间突出的至少一个连接器。纤维的至少一部分具有在彼此之间延伸并将纤维连接在一起的连接器。制造纤维状陶瓷材料的方法包括提供具有多根纤维的前体材料。提供用于保持前体材料的保持器。将前体材料放置在保持器上并且两者都被加热到约1500摄氏度和约1700摄氏度之间，以形成纤维状陶瓷材料，从而使得连接器从纤维的一部分突出并将纤维彼此附接。

37. 发明授权

US07666268B2 Green sheet coating material, green sheet, production method of green sheet and production method of electronic device 失效
标题翻译：绿板涂料，生坯片，生片的生产方法和电子设备的生产方法
公开(公告)号：US07666268B2
公开(公告)日：2010-02-23
申请号：US10571348
申请日：2004-08-26
申请人： Hisashi Kobayashi , Shigeki Satou
发明人： Hisashi Kobayashi , Shigeki Satou
IPC分类号： C03B29/00 , C04B33/34 , C04B33/32 , C04B33/36 , C04B35/64 , B28B1/00 , B28B3/00 , B28B5/00
CPC分类号： C04B35/4682 , B32B18/00 , B32B2311/22 , C04B35/62625 , C04B35/6263 , C04B35/6264 , C04B35/62655 , C04B35/63 , C04B35/632 , C04B35/634 , C04B35/6342 , C04B35/63488 , C04B2235/3206 , C04B2235/3208 , C04B2235/3215 , C04B2235/3225 , C04B2235/3239 , C04B2235/3241 , C04B2235/3436 , C04B2235/3454 , C04B2235/5445 , C04B2235/6025 , C04B2235/6582 , C04B2235/6584 , C04B2237/346 , C04B2237/405 , C04B2237/704 , H01G4/1209 , H01G4/1218 , H01G4/30
摘要： A coating material, green sheet and the method capable of producing a green sheet without a pin hole, having enough strength to be peeled from a support body and excellent surface smoothness even when the green sheet is extremely thin, and being suitable to make an electronic device thin and multilayered, are provided. The present invention provides a green sheet coating material comprising a ceramic powder, a binder resin including a butyral based resin as a main component thereof, and a solvent. The solvent includes a first solvent having an SP value as a solubility parameter of 10 or larger and a second solvent having the SP value of 8 or larger but smaller than 10. The second solvent is included by 20 to 60 wt % and, preferably, 25 to 60 wt % with respect to 100 wt % of the solvent as the entire weight.
摘要翻译：一种涂料，生片和能够生产没有针孔的生片的方法，具有足够的强度从支撑体剥离并且即使当生片极薄时也具有优异的表面光滑度，并且适合于制造电子提供薄且多层的设备。本发明提供了包含陶瓷粉末，包含丁缩醛树脂作为其主要成分的粘合剂树脂和溶剂的生片涂料。溶剂包括SP值为10以上的溶解度参数的第一溶剂和SP值为8以上且小于10的第二溶剂。第二溶剂的含量为20〜60重量％，优选为相对于总重量为100重量％的溶剂为25〜60重量％。

38. 发明申请

US20100038120A1 Layered ceramic electronic component and manufacturing method therefor 审中-公开
标题翻译：层状陶瓷电子元件及其制造方法
公开(公告)号：US20100038120A1
公开(公告)日：2010-02-18
申请号：US12461372
申请日：2009-08-10
申请人： Tatsuya Kojima , Osamu Hirose
发明人： Tatsuya Kojima , Osamu Hirose
IPC分类号： H05K1/09 , H05K1/11 , C03B29/00
CPC分类号： H05K3/4061 , H01G4/232 , H01G4/2325 , H01G4/30 , H05K1/0306 , H05K1/092 , H05K3/4611 , H05K3/4629 , H05K2201/0272 , H05K2203/1438
摘要： Provided is a manufacturing method of a layered ceramic electronic component capable of preventing appearance of a gap between a dielectric layer and a via electrode to achieve reliable conduction between the via electrode and an internal electrode and at the same time, capable of effectively preventing occurrence of structural defects in the dielectric layer and the like.In a layered (multilayer) ceramic capacitor, dielectric layers and internal electrodes are stacked alternately. Of the internal electrodes, those placed opposite to each other via the dielectric layer are connected through the via electrode. The layered (multilayer) ceramic capacitor is produced by forming a via hole in stacked layers of a ceramic green sheet for forming the dielectric layer and a conductive paste for forming the internal electrode, followed by firing to obtain stacked layers having the dielectric layers and the internal electrodes formed therein. A conductive paste for forming the via electrode is filled in the via hole of the stacked layers and then baked to form the via electrode.
摘要翻译：提供一种层叠陶瓷电子部件的制造方法，其能够防止介电层和通孔电极之间的间隙的出现，以实现通孔电极和内部电极之间的可靠的导通，并且同时能够有效地防止电介质层的结构缺陷等。在层叠（多层）陶瓷电容器中，电介质层和内部电极交替堆叠。在内部电极中，经由电介质层彼此相对放置的内部电极通过通孔电极连接。层叠（多层）陶瓷电容器通过在形成电介质层的陶瓷生片的层叠中形成通孔而形成内部电极的导电性糊料，然后进行烧成，得到具有电介质层的层叠体，形成内部电极。用于形成通孔电极的导电膏被填充在堆叠层的通孔中，然后烘焙以形成通孔电极。

39. 发明授权

US07628878B2 Ceramic material suitable for repair of a space vehicle component in a microgravity and vacuum environment, method of making same, and method of repairing a space vehicle component 有权
标题翻译：适用于在微重力和真空环境中修复空间车辆部件的陶瓷材料，其制造方法以及修理空间车辆部件的方法
公开(公告)号：US07628878B2
公开(公告)日：2009-12-08
申请号：US11228469
申请日：2005-09-15
申请人： James A. Riedell , Timothy E. Easler
发明人： James A. Riedell , Timothy E. Easler
IPC分类号： C03B29/00
CPC分类号： C04B35/565 , B64G1/58 , C04B35/58078 , C04B35/6269 , C04B41/009 , C04B41/5059 , C04B41/87 , C04B2111/00982 , C04B2235/3225 , C04B2235/3813 , C04B2235/3826 , C04B2235/483 , C04B2235/5436 , C04B2235/5445 , C04B41/0054 , C04B41/4535 , C04B41/4554 , C04B41/4572 , C04B41/5045 , C04B41/507 , C04B35/83 , C04B35/80
摘要： A precursor of a ceramic adhesive suitable for use in a vacuum, thermal, and microgravity environment. The precursor of the ceramic adhesive includes a silicon-based, preceramic polymer and at least one ceramic powder selected from the group consisting of aluminum oxide, aluminum nitride, boron carbide, boron oxide, boron nitride, hafnium boride, hafnium carbide, hafnium oxide, lithium aluminate, molybdenum silicide, niobium carbide, niobium nitride, silicon boride, silicon carbide, silicon oxide, silicon nitride, tin oxide, tantalum boride, tantalum carbide, tantalum oxide, tantalum nitride, titanium boride, titanium carbide, titanium oxide, titanium nitride, yttrium oxide, zirconium diboride, zirconium carbide, zirconium oxide, and zirconium silicate. Methods of forming the ceramic adhesive and of repairing a substrate in a vacuum and microgravity environment are also disclosed, as is a substrate repaired with the ceramic adhesive.
摘要翻译：适用于真空，热和微重力环境的陶瓷粘合剂的前体。陶瓷粘合剂的前体包括硅基预陶瓷聚合物和选自氧化铝，氮化铝，碳化硼，氧化硼，氮化硼，硼化铪，碳化铪，氧化铪中的至少一种陶瓷粉末，铝酸锂，硅化钼，碳化铌，氮化铌，硼化硅，碳化硅，氧化硅，氮化硅，氧化锡，硼化钽，碳化钽，氧化钽，氮化钽，硼化钛，碳化钛，氧化钛，氮化钛，氧化钇，二硼化锆，碳化锆，氧化锆和硅酸锆。还公开了在真空和微重力环境中形成陶瓷粘合剂和修复基材的方法，以及用陶瓷粘合剂修复的基材。

40. 发明申请

US20090294020A1 MULTILAYER CERAMIC SUBSTRATE, METHOD FOR PRODUCING SAME, AND ELECTRONIC COMPONENT 有权
标题翻译：多层陶瓷基板，其制造方法和电子部件
公开(公告)号：US20090294020A1
公开(公告)日：2009-12-03
申请号：US12539629
申请日：2009-08-12
申请人： Yasutaka SUGIMOTO
发明人： Yasutaka SUGIMOTO
IPC分类号： C03B29/00
CPC分类号： H05K1/111 , C03C14/004 , H05K1/0306 , H05K3/285 , H05K3/4614 , H05K3/4629 , H05K2201/017 , H05K2201/068 , H05K2201/09481 , H05K2201/099 , Y02P70/611 , Y10T428/24917 , Y10T428/24926
摘要： A multilayer ceramic substrate includes an inner layer portion and surface portions that sandwich the inner layer portion in the stacking direction and have an increased transverse strength because of the surface layer portion having a thermal expansion coefficient less than that of the inner layer portion. At least one of the surface portions covers peripheries of main-surface conductive films arranged on a main surface of an inner portion so as to leave central portions of the main-surface conductive films exposed, so that the main-surface conductive films function as via conductors, thereby eliminating the need to provide a via conductor in the surface portions.
摘要翻译：多层陶瓷基板包括内层部分和由于表面层部分的热膨胀系数小于内层部分的热膨胀系数而在层叠方向上夹着内层部分并具有增加的横向强度的表面部分。表面部分中的至少一个覆盖布置在内部主表面上的主表面导电膜的周边，以使主表面导电膜的中心部分露出，使得主表面导电膜用作通孔导体，从而不需要在表面部分中提供通孔导体。

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