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1. 发明公开

US20230413420A1 LAMINATED ASSEMBLY COMPRISING RADIO-FREQUENCY INTERFACE BOARD 审中-公开
公开(公告)号：US20230413420A1
公开(公告)日：2023-12-21
申请号：US18248631
申请日：2021-06-23
申请人： AGC GLASS EUROPE , AGC INC. , AGC FLAT GLASS NORTH AMERICA, INC. , AGC VIDROS DO BRASIL LTDA
发明人： Mohsen YOUSEFBEIKI , Rafik ADDACI
IPC分类号： H05K1/02 , H05K1/03 , H01P3/08 , H05K3/46
CPC分类号： H05K1/0237 , H05K1/0353 , H01P3/08 , H05K3/4614 , H05K2201/0145
摘要： The present invention discloses an improved RF interface board and a laminated assembly having a RF interface board having an inner and an outer part. The laminated assembly includes a dielectric support having a first and a second surfaces and at least a first and a second RF transmission strips disposed on the dielectric support. The first and the second RF transmission strips are electrically isolated from each other, are configured to be connected to a connector at the outer part, and are each configured to be connected to a different conductive element at the inner part. The first RF transmission strip is on the first surface of the dielectric support.

2. 发明授权

US11657989B2 Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch including air 有权
公开(公告)号：US11657989B2
公开(公告)日：2023-05-23
申请号：US17029282
申请日：2020-09-23
申请人： HARRIS CORPORATION
发明人： Louis Joseph Rendek, Jr. , Lawrence Wayne Shacklette , Paul Brian Jaynes , Philip Anthony Marvin
IPC分类号： H01H13/704 , H05K3/30 , H05K3/46 , H01H11/00 , H05K1/02
CPC分类号： H01H13/704 , H01H11/00 , H05K3/303 , H05K3/4614 , H05K3/4626 , H05K3/4632 , H05K1/0284 , H05K2201/0141 , H05K2201/091 , Y10T29/4913 , Y10T29/49107
摘要： A method is for making an electronic device that includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.

3. 发明申请

US20180166230A1 METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTILAYER CIRCUIT BOARD INCLUDING MEMBRANE SWITCH INCLUDING AIR 审中-公开
公开(公告)号：US20180166230A1
公开(公告)日：2018-06-14
申请号：US15890532
申请日：2018-02-07
申请人： HARRIS CORPORATION
发明人： LOUIS JOSEPH RENDEK, JR. , LAWRENCE WAYNE SHACKLETTE , PAUL BRIAN JAYNES , PHILIP ANTHONY MARVIN
IPC分类号： H01H13/704 , H05K3/46 , H05K3/30 , H01H11/00
CPC分类号： H01H13/704 , H01H11/00 , H05K1/0284 , H05K3/303 , H05K3/4614 , H05K3/4626 , H05K3/4632 , H05K2201/0141 , H05K2201/091 , Y10T29/49107 , Y10T29/4913
摘要： A method is for making an electronic device including forming a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein, the multilayer circuit board including at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The method also includes filling the membrane switch recess with air, and positioning at least one biasing member in the membrane switch recess.

4. 发明授权

US09967975B2 Multi-layer circuit board 有权
公开(公告)号：US09967975B2
公开(公告)日：2018-05-08
申请号：US15143354
申请日：2016-04-29
申请人： KINSUS INTERCONNECT TECHNOLOGY CORP.
发明人： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
IPC分类号： H05K1/09 , H05K1/02
CPC分类号： H05K1/09 , H05K1/0298 , H05K1/144 , H05K3/4614 , H05K2201/0367 , H05K2201/042 , H05K2201/09472
摘要： A multi-layer circuit board includes a first circuit board, multiple conducting blocks, a second circuit board, and multiple conducting recesses. The first circuit board has a first conductor layer formed thereon. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the surface of the second circuit board. Each conducting recess has a conducting layer electrically connected to the second conductor layer. When the conducting blocks are mounted in the conducting recesses, the first conductor layer and the second conductor layer are electrically connected through the conducting blocks and the conducting recesses. As can be separated from the first circuit board for test of the two conductor layers, the yield of the second circuit board is enhanced.

5. 发明授权

US09936590B2 Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs 有权
公开(公告)号：US09936590B2
公开(公告)日：2018-04-03
申请号：US15626437
申请日：2017-06-19
申请人： Second Sight Medical Products, Inc.
发明人： Jerry Ok , Robert J Greenberg
IPC分类号： C03B29/00 , B32B37/00 , B29C65/00 , H05K3/40 , H05K3/00 , H05K3/46 , C04B37/00 , H05K3/12 , B32B37/14 , H05K1/03
CPC分类号： H05K3/4061 , B32B37/14 , C04B35/10 , C04B37/00 , C04B2237/064 , H05K1/0306 , H05K3/0044 , H05K3/0047 , H05K3/005 , H05K3/12 , H05K3/1225 , H05K3/1233 , H05K3/4614 , H05K3/4623 , H05K3/4629 , H05K2201/0376 , H05K2201/096 , H05K2201/09609 , H05K2203/1147 , H05K2203/308 , Y10T156/10
摘要： A method for fabricating a biocompatible hermetic housing including electrical feedthroughs, the method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thick film paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via.

6. 发明申请

US20170290171A1 Method for Making a Biocompatible Hermetic Housing Including Hermetic Electrical Feedthroughs 有权
公开(公告)号：US20170290171A1
公开(公告)日：2017-10-05
申请号：US15626437
申请日：2017-06-19
申请人： Second Sight Medical Products, Inc.
发明人： Jerry Ok , Robert J. Greenberg
IPC分类号： H05K3/40 , H05K3/00
CPC分类号： H05K3/4061 , B32B37/14 , C04B35/10 , C04B37/00 , C04B2237/064 , H05K1/0306 , H05K3/0044 , H05K3/0047 , H05K3/005 , H05K3/12 , H05K3/1225 , H05K3/1233 , H05K3/4614 , H05K3/4623 , H05K3/4629 , H05K2201/0376 , H05K2201/096 , H05K2201/09609 , H05K2203/1147 , H05K2203/308 , Y10T156/10
摘要： A method for fabricating a biocompatible hermetic housing including electrical feedthroughs, the method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thick film paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via.

7. 发明授权

US09437535B2 Wireless module and production method for wireless module 有权
标题翻译：无线模块的无线模块和生产方法
公开(公告)号：US09437535B2
公开(公告)日：2016-09-06
申请号：US14388349
申请日：2014-01-29
申请人： PANASONIC CORPORATION
发明人： Maki Nakamura , Suguru Fujita
IPC分类号： H01L23/495 , H01L23/498 , H01L23/31 , H01L21/56 , H01L21/48 , H01L23/66 , H05K3/36 , H05K1/14 , H05K1/18 , H05K3/46
CPC分类号： H01L23/49838 , H01L21/4853 , H01L21/56 , H01L21/565 , H01L23/3121 , H01L23/49811 , H01L23/49833 , H01L23/66 , H01L2223/6677 , H01L2224/16225 , H01L2224/32225 , H01L2224/73253 , H01L2924/15192 , H01L2924/1533 , H01L2924/18161 , H05K1/144 , H05K1/186 , H05K3/368 , H05K3/4614 , H05K2201/0379 , H05K2201/042 , H05K2201/10098 , H05K2201/10234 , H05K2203/061
摘要： Provided is a wireless module whose size can be made smaller. The wireless module includes: a first substrate on which an antenna is mounted; a second substrate which opposes the first substrate and on which an electronic component is mounted; and a plurality of electric conductors which connect the first substrate and the second substrate and which transmit a signal between the antenna and the electronic components, wherein the plurality of electric conductors are disposed between the first substrate and the second substrate in series in a substantially vertical direction with respect to mounting surfaces of the first substrate and the second substrate.
摘要翻译：提供了可以使其尺寸更小的无线模块。无线模块包括：第一基板，其上安装天线; 第二基板，其与所述第一基板相对并且安装有电子部件; 以及多个电导体，其连接所述第一基板和所述第二基板，并且在所述天线和所述电子部件之间传输信号，其中，所述多个电导体以基本垂直的方式串联设置在所述第一基板和所述第二基板之间相对于第一基板和第二基板的安装表面的方向。

8. 发明授权

US09386696B2 Multilayer ceramic substrate and manufacturing method therefor 有权
标题翻译：多层陶瓷基板及其制造方法
公开(公告)号：US09386696B2
公开(公告)日：2016-07-05
申请号：US14136004
申请日：2013-12-20
申请人： Murata Manufacturing Co., Ltd.
发明人： Shinichiro Banba , Yutaka Fukuda
IPC分类号： H05K1/11 , H05K1/16 , G01R1/20 , H05K1/03 , H05K3/42 , H05K3/46 , G01R3/00
CPC分类号： H05K1/115 , G01R1/203 , G01R3/00 , H05K1/0306 , H05K1/167 , H05K3/429 , H05K3/4614 , H05K3/4629 , H05K2201/0269
摘要： A multilayer ceramic substrate includes a ceramic element body including a plurality of stacked ceramic layers, a resistor including a resistance film disposed between the ceramic layers, and a lead via conductor penetrating the ceramic layers in a thickness direction and connected at a first end portion to the resistance film. The resistance film and the lead via conductor both contain, for example, Ni and Cu that constitute an alloy resistive material. A concentration of the Ni component in the lead via conductor has a gradient structure that is comparatively high in the first end portion connected to the resistance film and gradually decreases from the first end portion toward a second end portion opposite therefrom.
摘要翻译：多层陶瓷基板包括陶瓷元件体，该陶瓷元件体包括多个堆叠的陶瓷层，包括设置在陶瓷层之间的电阻膜的电阻器和在厚度方向上贯穿陶瓷层的引线通孔导体，并在第一端部连接到电阻膜。电阻膜和引线通孔导体都包含例如构成合金电阻材料的Ni和Cu。导线通孔导体中的Ni成分的浓度在与电阻膜连接的第一端部具有比较高的梯度结构，并且从第一端部向与其相反的第二端部逐渐减小。

9. 发明申请

US20160095231A1 MULTI-LAYER CIRCUIT BOARD HAVING CAVITY AND MANUFACTURING METHOD THEREOF 有权
标题翻译：多层电路板及其制造方法
公开(公告)号：US20160095231A1
公开(公告)日：2016-03-31
申请号：US14603363
申请日：2015-01-23
申请人： Chien-Hung Wu
发明人： Chien-Hung Wu
IPC分类号： H05K3/46
CPC分类号： H05K3/4697 , H05K3/4614 , H05K3/462 , H05K3/4644 , H05K3/465 , H05K2203/061 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913
摘要： A manufacturing method of a multi-layer circuit board having a cavity is provided, including the following steps: a core board is provided, and a through hole is formed penetrating the core board; two build-up structures are bonded to two opposite sides of the core board to foam the multi-layer circuit board, and the two build-up structures cover the through hole; and a portion of one of the two build-up structures corresponding to the through hole is removed to make the through hole communicate with the outside and form the cavity. A multi-layer circuit board having a cavity, manufactured by the aforementioned method, is also provided.
摘要翻译：提供一种具有空腔的多层电路板的制造方法，包括以下步骤：设置芯板，并且形成穿透芯板的通孔; 两个堆积结构被结合到芯板的两个相对侧以使多层电路板发泡，并且两个堆积结构覆盖通孔; 并且去除与通孔相对应的两个堆积结构中的一个的一部分，以使通孔与外部连通并形成空腔。还提供了通过上述方法制造的具有空腔的多层电路板。

10. 发明申请

US20150359087A1 CIRCUIT BOARD HAVING INTERIOR SPACE 有权
标题翻译：具有室内空间的电路板
公开(公告)号：US20150359087A1
公开(公告)日：2015-12-10
申请号：US14299017
申请日：2014-06-09
申请人： BOARDTEK ELECTRONICS CORPORATION
发明人： CHIEN-CHENG LEE
IPC分类号： H05K1/02 , H05K1/03
CPC分类号： H05K1/0284 , H05K1/0326 , H05K3/4614 , H05K3/4697 , H05K2201/0145 , H05K2201/0154 , H05K2201/0195 , H05K2201/10424 , H05K2201/2018
摘要： A circuit board having an interior space includes a multi-layer structure and a compartmentalized frame embedded in the multi-layer structure. The multi-layer structure has a plurality of plates stacked along a stacking direction and a gel combining any two adjacent plates. The plates include two outer plates and at least one inner plate arranged between the outer plates. The compartmentalized frame defines a predetermined space. The compartmentalized frame is arranged between the outer plates and substantially abuts the outer plates. The compartmentalized frame is arranged in a path of a flowing direction of gel which flows toward the predetermined space to prevent any gel from flowing into the predetermined space. Thus, the circuit board of the instant disclosure is provided with the interior space accurately formed by embedding the compartmentalized frame.
摘要翻译：具有内部空间的电路板包括多层结构和嵌入多层结构中的分隔框架。多层结构具有多个层叠堆叠的板和凝胶组合任何两个相邻的板。板包括两个外板和布置在外板之间的至少一个内板。分隔框架限定了预定的空间。分隔框架布置在外板之间并且基本上邻接外板。分隔框架布置在朝向预定空间流动的凝胶流动方向的路径中，以防止任何凝胶流入预定空间。因此，本公开的电路板设置有通过嵌入隔间框架而精确地形成的内部空间。

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