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1. 发明授权

US12019111B2 Manufacturing method of a multi-layer for a probe card 有权
公开(公告)号：US12019111B2
公开(公告)日：2024-06-25
申请号：US16677581
申请日：2019-11-07
申请人： TECHNOPROBE S.p.A.
发明人： Roberto Crippa , Flavio Maggioni , Raffaele Vallauri
IPC分类号： G01R31/00 , G01R1/073 , G01R3/00 , H05K3/00 , H05K3/40 , H05K3/46
CPC分类号： G01R3/00 , G01R1/07342 , H05K3/0029 , H05K3/4061 , H05K3/4679
摘要： A method of manufacturing a multi-layer for a probe card comprises providing first contact pads on an exposed face of a first dielectric layer and second contact pads on an exposed face of a last dielectric layer. Each dielectric layer is laser ablated to realize pass-through structures and the pass-through structures are conductively filled to realize conductive structures. The dielectric layers are superimposed in a way that each conductive structure contacts a corresponding conductive structure of a contiguous dielectric layer in the multi-layer and forms conductive paths electrically connected the first and second contact pads. The second contact pads having a greater distance between its symmetry centers than the first contact pads, the multi-layer thus performing a spatial transformation between the first and second contact pads connected through the connective paths.

2. 发明授权

US09936590B2 Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs 有权
公开(公告)号：US09936590B2
公开(公告)日：2018-04-03
申请号：US15626437
申请日：2017-06-19
申请人： Second Sight Medical Products, Inc.
发明人： Jerry Ok , Robert J Greenberg
IPC分类号： C03B29/00 , B32B37/00 , B29C65/00 , H05K3/40 , H05K3/00 , H05K3/46 , C04B37/00 , H05K3/12 , B32B37/14 , H05K1/03
CPC分类号： H05K3/4061 , B32B37/14 , C04B35/10 , C04B37/00 , C04B2237/064 , H05K1/0306 , H05K3/0044 , H05K3/0047 , H05K3/005 , H05K3/12 , H05K3/1225 , H05K3/1233 , H05K3/4614 , H05K3/4623 , H05K3/4629 , H05K2201/0376 , H05K2201/096 , H05K2201/09609 , H05K2203/1147 , H05K2203/308 , Y10T156/10
摘要： A method for fabricating a biocompatible hermetic housing including electrical feedthroughs, the method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thick film paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via.

3. 发明申请

US20170290171A1 Method for Making a Biocompatible Hermetic Housing Including Hermetic Electrical Feedthroughs 有权
公开(公告)号：US20170290171A1
公开(公告)日：2017-10-05
申请号：US15626437
申请日：2017-06-19
申请人： Second Sight Medical Products, Inc.
发明人： Jerry Ok , Robert J. Greenberg
IPC分类号： H05K3/40 , H05K3/00
CPC分类号： H05K3/4061 , B32B37/14 , C04B35/10 , C04B37/00 , C04B2237/064 , H05K1/0306 , H05K3/0044 , H05K3/0047 , H05K3/005 , H05K3/12 , H05K3/1225 , H05K3/1233 , H05K3/4614 , H05K3/4623 , H05K3/4629 , H05K2201/0376 , H05K2201/096 , H05K2201/09609 , H05K2203/1147 , H05K2203/308 , Y10T156/10
摘要： A method for fabricating a biocompatible hermetic housing including electrical feedthroughs, the method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thick film paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via.

4. 发明授权

US09706662B2 Adaptive interposer and electronic apparatus 有权
公开(公告)号：US09706662B2
公开(公告)日：2017-07-11
申请号：US14755490
申请日：2015-06-30
申请人： Raytheon Company
发明人： Tse E. Wong , Kenneth T. Teshiba , Shea Chen
IPC分类号： H05K1/11 , H05K1/18 , H01L23/498 , H05K1/14 , H05K3/40 , H01L23/00 , H05K3/34 , B23K35/26 , C22C11/06 , C22C13/00
CPC分类号： H05K1/181 , B23K35/262 , B23K35/268 , C22C11/06 , C22C13/00 , H01L23/15 , H01L23/49827 , H01L23/49866 , H01L24/80 , H05K1/111 , H05K1/141 , H05K3/3436 , H05K3/3463 , H05K3/4061 , H05K2201/10378 , H05K2201/2081 , Y02P70/613
摘要： An adaptive interposer is provided to be operably disposable between first and second solder materials of first and second electronic devices, respectively. The adaptive interposer includes a plate element formed to define cavities and third solder material disposable in the cavities to be electrically communicative with the first and second solder materials. The third solder material is more compliant and has a higher melting temperature than at least the second solder materials.

5. 发明授权

US09616223B2 Media-exposed interconnects for transducers 有权
公开(公告)号：US09616223B2
公开(公告)日：2017-04-11
申请号：US11323896
申请日：2005-12-30
申请人： Michael A. Schugt , Kamal D. Mothilal , David A. Ruben , Lary R. Larson , Michael F. Mattes
发明人： Michael A. Schugt , Kamal D. Mothilal , David A. Ruben , Lary R. Larson , Michael F. Mattes
IPC分类号： H05K1/16 , A61N1/05 , A61B5/0215 , H05K1/02 , B81B3/00 , H01L21/48 , H05K3/40
CPC分类号： A61N1/056 , A61B5/0215 , B81B3/0072 , B81C2201/0167 , H01L21/4857 , H05K1/0271 , H05K3/4061 , H05K3/4092
摘要： Media-exposed interconnects for transducer modules are disclosed. The transducers may be sensing transducers, actuating transducers, IC-only transducers, or combinations thereof, or other suitable transducers. The transducers may be used in connection with implantable medical devices and may be exposed to various media, such as body fluids. The media-exposed interconnects for transducer modules may allow transducers to communicate electrically with other components, such as implantable medical devices.

6. 发明申请

US20170030858A1 SENSOR ELEMENT FOR DETECTING AT LEAST ONE PROPERTY OF A MEASURED GAS IN A MEASURED GAS CHAMBER, AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：用于检测在测量气室中测量的气体的一个特性的传感器元件及其制造方法
公开(公告)号：US20170030858A1
公开(公告)日：2017-02-02
申请号：US15302392
申请日：2015-02-20
申请人： Robert Bosch GmbH
发明人： Alexander Bischoff , Andreas Rottmann , Antje Taeuber , Frank Buse , Jens Schneider , Oliver Dotterweich , Peter Alt , Thomas Juestel
IPC分类号： G01N27/407 , H05K3/42 , G01K13/02 , G01N27/406 , G01K7/26
CPC分类号： G01N27/4075 , G01K7/26 , G01K13/02 , G01K2013/024 , G01N27/4062 , G01N27/4071 , G01N27/4073 , H05K3/4061 , H05K3/42
摘要： A sensor element for detecting a level of a gas component in the measured gas or a temperature of the measured gas. The sensor element includes at least one solid electrolyte layer. The solid electrolyte layer has at least one plated-through hole. The sensor element further includes a conductive element, which produces an electrically conductive connection through the plated-through hole. In the plated-through hole, the solid electrolyte layer is electrically insulated from the conductive element by an insulating element. At least one opening region of the plated-through hole is stabilized against phase transition by a stabilizing element. The stabilizing element is made at least partially of a material, which includes a noble metal and an element selected from the group consisting of: V, Nb, Ta, Sb, Bi, Cr, Mo, W. A method for manufacturing the sensor element is also provided.
摘要翻译：用于检测测量气体中的气体成分的水平或测量气体的温度的传感器元件。传感器元件包括至少一个固体电解质层。固体电解质层具有至少一个电镀通孔。传感器元件还包括导电元件，其通过电镀通孔产生导电连接。在电镀通孔中，固体电解质层通过绝缘元件与导电元件电绝缘。电镀通孔的至少一个开口区域通过稳定元件稳定而防止相变。所述稳定元件至少部分地由包括贵金属和选自由V，Nb，Ta，Sb，Bi，Cr，Mo，W组成的组的元素的材料制成。也提供。

7. 发明授权

US09307649B2 Mixed-metal system conductors for use in low-temperature co-fired ceramic circuits and devices 有权
标题翻译：用于低温共烧陶瓷电路和器件的混合金属系统导体
公开(公告)号：US09307649B2
公开(公告)日：2016-04-05
申请号：US14257306
申请日：2014-04-21
申请人： E I DU PONT DE NEMOURS AND COMPANY
发明人： Kumaran Manikantan Nair , Scott E Gordon , Mark Frederick McCombs
IPC分类号： H05K3/00 , H05K1/09 , H01B1/22 , H05K1/11 , H05K3/40
CPC分类号： H05K3/0094 , H01B1/22 , H05K1/09 , H05K1/092 , H05K1/095 , H05K1/115 , H05K3/4061 , H05K2201/032 , H05K2201/09481 , H05K2201/09563 , H05K2203/1126
摘要： A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.
摘要翻译：公开了一种用于形成过渡通孔和过渡管线导体的组合物，用于最小化异种金属组合物之间电连接处的界面效应。该组合物具有（a）选自（i）20-45wt％金和80-55wt％银和（ii）100wt％银 - 金固溶体合金的无机成分，和（b）有机中。该组合物还可以含有（c）基于组合物重量的1-5重量％的选自Cu，Co，Mg和Al的金属的氧化物或混合氧化物和/或主要含有难熔氧化物。组合物可以用作通孔填充物中的多层组合物。也可以使用用于形成过渡通孔和过渡管线导体的组合物来形成诸如LTCC电路和器件的多层电路。

8. 发明授权

US09155208B2 Conductive connection structure for conductive wiring layer of flexible circuit board 有权
标题翻译：柔性电路板导电布线层导电连接结构
公开(公告)号：US09155208B2
公开(公告)日：2015-10-06
申请号：US14138383
申请日：2013-12-23
申请人： ADVANCED FLEXIBLE CIRCUITS CO., LTD.
发明人： Kuo-Fu Su , Gwun-Jin Lin
IPC分类号： H05K1/11 , H05K1/02 , H05K3/40
CPC分类号： H05K3/4061 , H05K1/0283 , H05K1/115 , H05K1/118 , H05K2201/09845 , H05K2201/09854 , H05K2203/1572
摘要： A conductive connection structure for a conductive wiring layer of a flexible circuit board includes a first through hole and a second through hole formed in a lamination structure including a conductive wiring layer, a first covering layer, and a second covering layer. The first through hole extends through the first covering layer and the conductive wiring layer. The second through hole extends through the second covering layer. The second through hole is formed at a location corresponding to an exposed zone on a second surface of the conductive wiring layer and communicates with the first through hole. A first conductive paste layer is formed on a surface of the first covering layer and fills in the first through hole to form a pillar portion in the first through hole. The pillar portion has a bottom end forming a curved cap. The exposed zone of the second surface of the conductive wiring layer is at least partially covered by the curved cap.
摘要翻译：用于柔性电路板的导电布线层的导电连接结构包括形成在包括导电布线层，第一覆盖层和第二覆盖层的叠层结构中的第一通孔和第二通孔。第一通孔延伸穿过第一覆盖层和导电布线层。第二通孔延伸穿过第二覆盖层。第二通孔形成在与导电布线层的第二表面上的暴露区相对应的位置处，并与第一通孔连通。第一导电浆料层形成在第一覆盖层的表面上并填充在第一通孔中，以在第一通孔中形成柱部分。柱部具有形成弯曲帽的底端。导电布线层的第二表面的暴露区域至少部分被弯曲的盖子覆盖。

9. 发明授权

US09085051B2 Fluorinated silver paste for forming electrical connections in highly dielectric films, and related products and methods 有权
标题翻译：用于在高介电膜中形成电连接的氟化银糊剂及相关产品和方法
公开(公告)号：US09085051B2
公开(公告)日：2015-07-21
申请号：US12662047
申请日：2010-03-29
申请人： Jemssy Alvarez
发明人： Jemssy Alvarez
IPC分类号： H01B1/00 , H01B1/12 , B23K35/36 , B23K35/30 , H05B3/86 , H05K1/09 , H01B1/02 , H01B1/22 , B05D5/06 , C03C17/00 , G02B1/10 , B60L1/02 , H05K3/40
CPC分类号： B23K35/36 , B23K35/3006 , B23K35/3605 , H05B3/86 , H05B2203/016 , H05K1/092 , H05K3/4007 , H05K3/4061 , H05K2201/0209
摘要： Certain example embodiments of this invention relate to silver pastes that are capable of making an electrical connection with at least one conductive layer in a layer stack, even where the at least one conductive layer is protected by one or more strong dielectric layers, and/or methods of making the same. Certain example embodiments include a chemically modified silver paste that may be cured or fired using a standard glass tempering furnace (e.g., an electrical or gas-fuelled furnace) or a short-wave infrared heating process at temperatures below 750 degrees C. In certain example embodiments, the fluorine causes apertures or micro-factures in the dielectric layer(s), which allows the silver in the paste to move therethrough (e.g., by capillary action) to form a contact with the conductive layer(s).
摘要翻译：本发明的某些示例性实施例涉及能够与层叠中的至少一个导电层进行电连接的银浆，即使在至少一个导电层被一个或多个强电介质层保护的情况下，和/或制作相同的方法某些示例性实施方案包括可以在低于750℃的温度下使用标准玻璃回火炉（例如电气或气体燃料炉）或短波红外加热方法固化或烧制的化学改性的银浆。在某些实施例中在实施方案中，氟引起电介质层中的孔或微生物，其允许糊料中的银通过其移动（例如通过毛细作用）以形成与导电层的接触。

10. 发明申请

US20150157862A1 Cortical Implant System for Brain Stimulation and Recording 有权
标题翻译：脑刺激和记录皮质植入系统
公开(公告)号：US20150157862A1
公开(公告)日：2015-06-11
申请号：US14563778
申请日：2014-12-08
申请人： Second Sight Medical Products, Inc.
发明人： Robert J. Greenberg , Neil H. Talbot , James S. Little
IPC分类号： A61N1/36 , A61N1/05 , A61N1/375 , A61N1/372
CPC分类号： H05K3/282 , A61B5/0006 , A61B5/0478 , A61B5/4836 , A61B5/6868 , A61B2562/0209 , A61B2562/046 , A61B2562/125 , A61N1/0529 , A61N1/0531 , A61N1/0534 , A61N1/3606 , A61N1/36071 , A61N1/36082 , A61N1/36139 , A61N1/375 , A61N1/3752 , A61N1/3754 , H01L23/055 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H05K1/02 , H05K1/0271 , H05K1/028 , H05K1/0281 , H05K1/0306 , H05K1/092 , H05K1/11 , H05K1/111 , H05K1/145 , H05K1/147 , H05K1/189 , H05K3/0044 , H05K3/005 , H05K3/0058 , H05K3/28 , H05K3/321 , H05K3/363 , H05K3/4015 , H05K3/4061 , H05K2201/0245 , H05K2201/053 , H05K2201/055 , H05K2201/09063 , H05K2201/09145 , H05K2201/09163 , H05K2201/097 , H05K2201/09981 , H05K2201/10303 , H05K2201/10318 , H05K2201/10674 , H05K2201/10795 , H05K2201/10931 , H05K2201/2009 , H05K2203/0195 , H05K2203/025 , H05K2203/0278 , H05K2203/0307 , H05K2203/068 , H05K2203/082 , H05K2203/1322 , H05K2203/1327 , H05K2203/1394 , H05K2203/1461 , H05K2203/1476 , H05K2203/162 , H05K2203/304 , H01L2924/00014 , H01L2924/00
摘要： The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.
摘要翻译：本发明包括具有至少一个封装的可植入装置，该封装装置容纳通过连接到至少一个封装件的至少一个线圈从外部系统发送和接收数据或信号并可选地供电的电子装置，并处理数据，包括记录的神经活动，并且通过连接到所述至少一个包装的多个电极的至少一个阵列将电脉冲递送给神经组织。该器件适用于电皮质（ECoG）和局部场电位（LFP）信号。大脑刺激器，优选深部脑刺激器，在闭合反馈环路中响应于神经记录而刺激大脑。该装置有利于为神经障碍如慢性疼痛，创伤后应激障碍（PTSD），主要抑郁症或类似疾病提供神经调节疗法。本发明及其组分旨在安装在头部，或者在头颅或硬脑膜上，或在脑中或脑中。

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