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    • 47. 发明授权
    • Electroplating apparatus and process for wafer level packaging
    • 电镀设备及晶圆级封装工艺
    • US09404194B2
    • 2016-08-02
    • US13305384
    • 2011-11-28
    • Steven T. MayerDavid W. Porter
    • Steven T. MayerDavid W. Porter
    • C25D21/12C25D21/14C25D21/18C25D7/12C25D3/60C25D17/00C25D3/56C25D5/02C25C1/20C25C7/00
    • C25D3/60C25C1/20C25C7/00C25D3/56C25D5/022C25D5/48C25D7/123C25D17/001C25D17/002C25D21/12C25D21/14C25D21/18
    • An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.
    • 用于连续同时电镀具有基本上不同的标准电沉积电位(例如,用于沉积Sn-Ag合金)的两种金属的装置包括阳极室,用于容纳包含第一少量贵金属(例如锡)的离子的阳极电解液, 但不是第二个,更高贵的金属(例如银)和活性阳极; 阴极室,用于容纳包含第一金属(例如锡)的离子,第二,更贵金属(例如银)的离子和底物的阴极电解液; 位于阳极室和阴极室之间的分离结构,其中分离结构基本上防止更贵族金属从阴极电解液转移到阳极电解液; 流体特征和相关联的控制器,其耦合到所述装置并且被配置为执行连续电镀,同时在延长的使用期限内保持基本恒定的电镀浴组分的浓度。
    • 50. 发明授权
    • Light metal production
    • 轻金属生产
    • US09315914B2
    • 2016-04-19
    • US14168332
    • 2014-01-30
    • Qinbai Fan
    • Qinbai Fan
    • C25C1/02C25C1/06C25C5/02C25C7/04C25C7/00B01D61/24
    • C25C1/02B01D61/246C25C1/06C25C5/02C25C7/00C25C7/04
    • An electrochemical process for the production of light metals, particularly aluminum. Such a process involves contacting a light metal source material with an inorganic acid to form a solution containing the light metal ions in high concentration. The solution is fed to an electrochemical reactor assembly having an anode side containing an anode and a cathode side containing a cathode, with anode side and the cathode side separated by a bipolar membrane, with the solution being fed to the anode side. Light metal ions are electrochemically transferred through the bipolar membrane to the cathode side. The process further involves reducing the light metal ions to light metal powder. An associated processing system is also provided.
    • 用于生产轻金属,特别是铝的电化学工艺。 这种方法包括使轻金属源材料与无机酸接触以形成含有高浓度的轻金属离子的溶液。 将溶液进料到具有阳极侧的电化学反应器组件,阳极侧包含阴极,阴极侧包含阴极,阳极侧和阴极侧由双极膜分离,溶液被馈送到阳极侧。 轻金属离子通过双极膜电化学转移到阴极侧。 该方法还涉及将轻金属离子还原成轻金属粉末。 还提供了一种相关联的处理系统。