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51. 发明申请

US20180182796A1 Sensor System 审中-公开
公开(公告)号：US20180182796A1
公开(公告)日：2018-06-28
申请号：US15852420
申请日：2017-12-22
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Mikael Tuominen
IPC分类号： H01L27/146 , H04N5/225
CPC分类号： H01L27/14618 , H01L27/14627 , H01L27/14634 , H01L27/14685 , H01L27/1469 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H04N5/3745
摘要： The present invention relates to a sensor system. The sensor system comprises a component carrier and a sensor having a control unit and a sensor unit. At least a part of the sensor unit is located within the component carrier.

52. 发明授权

US09967972B2 Circuit board having an asymmetric layer structure 有权
公开(公告)号：US09967972B2
公开(公告)日：2018-05-08
申请号：US15534897
申请日：2015-12-10
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Andreas Zluc , Gerald Weidinger , Mario Schober , Hannes Stahr , Timo Schwarz , Benjamin Gruber
IPC分类号： H05K1/03 , H05K1/00 , B32B15/08 , H05K1/02 , H05K1/18 , H01L23/538 , H01L23/00 , H05K3/46 , H05K3/00 , H01L21/48 , H01L23/14 , H05K1/11
CPC分类号： H05K1/0271 , H01L21/481 , H01L21/4857 , H01L21/568 , H01L23/145 , H01L23/5383 , H01L23/5385 , H01L23/5387 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L2224/2518 , H01L2224/32145 , H01L2224/73267 , H01L2224/9222 , H01L2924/0002 , H01L2924/18162 , H01L2924/19105 , H01L2924/3511 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K1/0393 , H05K1/115 , H05K1/185 , H05K1/189 , H05K3/0017 , H05K3/0097 , H05K3/4602 , H05K2201/0129 , H05K2201/0133 , H05K2201/0187 , H05K2201/0191 , H05K2201/068 , H05K2201/09136 , H01L2924/00
摘要： A circuit board is described which includes a layer composite with at least one dielectric layer which includes a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto, and which includes a layer thickness along a z-axis which is perpendicular with respect to the x-axis and to the y-axis; and at least one metallic layer which is attached to the dielectric layer in a planar manner. The layer composite along the z-axis is free from a symmetry plane which is oriented in parallel with respect to the xy-plane, and the dielectric layer includes a dielectric material which has an elastic modulus E in a range between 1 and 20 GPa and along the x-axis and along the y-axis a coefficient of thermal expansion in a range between 0 and 17 ppm/K. A method of manufacturing such a circuit board is also described. Further, a method of manufacturing a circuit board structure comprising two asymmetric circuit boards and a method of manufacturing two processed asymmetric circuit boards from a larger circuit board structure is described.

53. 发明授权

US09820381B2 Semi-finished product for the production of a printed circuit board and method for producing the same 有权
公开(公告)号：US09820381B2
公开(公告)日：2017-11-14
申请号：US14654387
申请日：2013-12-20
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Vic Wang , Ethan Zhou , Laura Bai , Mikael Tuominen , Al Chen
IPC分类号： H05K7/10 , H05K7/12 , H05K1/11 , H05K3/46 , H05K1/18 , H05K3/00
CPC分类号： H05K1/111 , H05K1/183 , H05K3/0032 , H05K3/46 , H05K3/4697 , H05K2201/09127 , H05K2201/09227 , H05K2201/09781 , H05K2201/10734 , H05K2203/107
摘要： In a semi-finished product for the production of a printed circuit board with at least one recessed electronic component having at least one conductive layer structured to provide a connector pad for an electronic component, fan-out lines connected to the connector pad and further to provide at least one laser-stop device encompassing the connector pad, wherein the laser-stop device has at least one passage for passing-through the fan-out lines, the semi-finished product further comprises at least one cap layer applied to the conductive layer, the at least one cap layer having an opening in registration with each passage. The inventive method for producing a printed circuit board with at least one recessed component, is characterized by the steps of providing at least one conductive layer, structuring said conductive layer to provide a connector pad for an electronic component, fan-out lines connected to the connector pad and further to provide at least one laser-stop device encompassing the connector pad, leaving at least one passage in the laser-stop device for passing-through the fan-out lines, and applying a cap layer to said conductive layer, the cap layer having an opening in registration with each passage.

54. 发明授权

US09763337B2 Semi-finished product for the production of a printed circuit board, method for producing a printed circuit board and printed circuit board 有权
公开(公告)号：US09763337B2
公开(公告)日：2017-09-12
申请号：US14652416
申请日：2013-12-20
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Stefan Jäger , Markus Leitgeb , Thomas Judge
IPC分类号： H05K1/03 , H05K3/38 , H05K1/11 , H05K1/02 , H05K3/46 , H05K1/09 , H05K3/24
CPC分类号： H05K3/387 , H05K1/0298 , H05K1/034 , H05K1/0346 , H05K1/09 , H05K1/111 , H05K1/117 , H05K3/244 , H05K3/4611 , H05K3/4632 , H05K2201/015 , H05K2201/0154 , H05K2201/09127 , H05K2201/0919 , H05K2201/09845 , H05K2203/0228 , H05K2203/068
摘要： A semi-finished product for the production of a printed circuit board having a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector is characterized by the hard gold-plated edge connector being arranged on an inner conductive layer of the semi-finished product and being fully covered by at least one group of an insulating layer and a conductive layer. The inventive Method for producing a printed circuit board having a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector, where an outer conductive layer is surface treated, is characterized by the steps of providing a hard gold-plated edge connector on a group of an insulating layer and a conductive layer, covering the conductive layer and the hard gold-plated edge connector with at least one group of an insulating layer and a conductive layer, surface-treating an outer conductive layer to form connector pads for wire bonding of electronic components, cutting the insulating layers and the conductive layers down to the conductive layer forming the hard gold-plated edge connector, removing the insulating layers and conductive layers from the hard gold-plated edge connector. The inventive printed circuit board comprised of a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector is characterized by the hard gold-plated edge connector being arranged on an inner conductive layer of the printed circuit board, and the inner conductive layer forming the hard gold-plated edge connector protruding from the plurality of insulating layers and conductive layers.

55. 发明申请

US20170213955A1 MEMS Piezoelectric Transducer Formed at a PCB Support Structure 审中-公开
公开(公告)号：US20170213955A1
公开(公告)日：2017-07-27
申请号：US15411971
申请日：2017-01-21
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Jonathan Silvano De Sousa , Nick Renaud-Bezot
IPC分类号： H01L41/053 , H01L41/113 , H01L41/047 , H01L41/09 , B81B3/00 , B81C1/00
摘要： A microelectro-mechanical system (MEMS) device includes a support structure formed of printed circuit board (PCB) materials; and a piezoelectric transducer formed at the support structure. Further, a MEMS assembly is described which shows such a MEMS device mounted at a component carrier. Furthermore, a method for manufacturing such a MEMS device is described.

56. 发明授权

US09698130B2 Connection system for electronic components 有权
公开(公告)号：US09698130B2
公开(公告)日：2017-07-04
申请号：US15272568
申请日：2016-09-22
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Gerald Weis , Christian Vockenberger , Roland Sekavcnik
IPC分类号： H01L23/34 , H01L25/16 , H01L23/467 , H01L23/538 , H01L23/00 , H01L25/07 , H05K1/02 , H05K1/11 , H05K1/18 , H05K7/20 , H01L23/367 , H01L25/10
CPC分类号： H01L25/16 , H01L23/3677 , H01L23/467 , H01L23/5383 , H01L23/5384 , H01L23/5389 , H01L24/17 , H01L24/19 , H01L24/20 , H01L25/074 , H01L25/105 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/2518 , H01L2225/1035 , H01L2225/1047 , H01L2225/1094 , H01L2924/1033 , H01L2924/13055 , H01L2924/1306 , H01L2924/1426 , H01L2924/1436 , H01L2924/153 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19102 , H01L2924/19105 , H05K1/0206 , H05K1/0209 , H05K1/0212 , H05K1/0298 , H05K1/115 , H05K1/181 , H05K1/185 , H05K7/20154 , H05K2201/10015 , H05K2201/10166 , Y02P70/611
摘要： In a connection system for electronic components (1) comprising a plurality of insulating layers (2) and conductive layers (3) and further comprising at least one embedded electronic component (4) embedded within at least one of the plurality of insulating layers (2) and conductive layers (3) the at least one embedded electronic component (4) is at least one first transistor having a bulk terminal thereof in thermal contact with a thermal duct (6) comprised of a plurality of vias (7) reaching through at least one of an insulating layer (2) and a conductive layer (3) of the connection system for electronic components (1) and emerging on a first outer surface (8) of the connection system for electronic components (1) under a first surface-mounted component (10).

57. 发明申请

US20170167799A1 HEAT PIPE AND METHOD TO EMBED A HEAT PIPE IN A PRODUCT 审中-公开
公开(公告)号：US20170167799A1
公开(公告)日：2017-06-15
申请号：US15372781
申请日：2016-12-08
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Jonathan Silvano de Sousa , Bernhard Reitmaier , Michael Polic , Gerhard Maringer
IPC分类号： F28D15/02 , H05K3/46 , F28F21/08 , H05K1/02
CPC分类号： F28D15/0275 , F28D2021/0028 , F28F21/085 , H05K1/0206 , H05K3/46 , H05K7/20336 , H05K7/20345 , H05K2201/064
摘要： A heat pipe (10) for cooling an electronic device, especially a component carrier (100), that comprises a central section (13) with a cavity (12) filled with a heat transfer fluid (20). In longitudinal direction (11) of the heat pipe (10) directly connected with the central section (13) are a first end section (14) on a first end of the central section and a second end section (15) on the opposite second end of the central section, wherein the first end section and the second end section each comprise a landing structure (17) with a surface length (SL, SL1, SL2) and a surface width (SW, SW1, SW2) and wherein each landing structure is thermoconductively coupled with the central section of the heat pipe. A component carrier comprising at least one heat pipe for cooling it, and a method for producing the component carrier are also provided.

58. 发明授权

US09418930B2 Power module 有权
标题翻译：电源模块
公开(公告)号：US09418930B2
公开(公告)日：2016-08-16
申请号：US14897217
申请日：2014-05-06
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Johannes Stahr , Andreas Zluc , Gernot Grober , Timo Schwarz
IPC分类号： H01L23/36 , H01L23/498 , H01L23/373 , H01L23/31 , H01L23/367 , H01L23/538
CPC分类号： H01L23/49838 , H01L23/3121 , H01L23/36 , H01L23/367 , H01L23/3735 , H01L23/49833 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/06181 , H01L2224/18 , H01L2224/24137 , H01L2224/32245 , H01L2224/73267 , H01L2224/82005 , H01L2224/92244 , H01L2924/0002 , H01L2924/00
摘要： A power module, having a printed circuit board core, which contains at least one electronic power component embedded in an insulating layer, the core being arranged between two heat dissipation plates, wherein each heat dissipation plate has a metal outer layer and a metal inner layer electrically separated from said metal outer layer by a thermally conductive, electrically insulating intermediate layer, and electrode terminals of the at least one power component are guided out from the core via terminal lines, wherein the printed circuit board core on both sides of the insulating layer has a conductor layer, at least one conductor layer is structured at least in portions, and each conductor layer is connected at least in portions via a conductive, metal intermediate layer to a metal inner layer of the heat dissipation plate, contacts run from the structured conductor layer to the electrode terminals of the at least one power component, and at least one power terminal of the at least one power component is connected via a contact, a portion of a structured conductor layer, and the conductive, metal intermediate layer to at least one portion of the metal inner layer of the heat dissipation plate, which forms part of the terminal line to the electrode terminal.
摘要翻译：一种具有印刷电路板芯的功率模块，其包含嵌入绝缘层中的至少一个电子功率部件，所述芯布置在两个散热板之间，其中每个散热板具有金属外层和金属内层通过导热的电绝缘中间层与所述金属外层电隔离，并且至少一个功率部件的电极端子经由端子线从芯引出，其中绝缘层两侧的印刷电路板芯具有导体层，至少一个导体层至少部分地构成，并且每个导体层至少部分地通过导电的金属中间层连接到散热板的金属内层，从结构化导体层至少一个功率部件的电极端子，以及至少一个功率部件的至少一个电源端子通过接触，结构化导体层的一部分和导电的金属中间层将热功率元件连接到散热板的金属内层的至少一部分，其形成端子线的一部分到电极终奌站。

59. 发明申请

US20160105953A1 METHOD FOR PRODUCING A CIRCUIT BOARD CONSISTING OF A PLURALITY OF CIRCUIT BOARD AREAS AND CIRCUIT BOARD 审中-公开
标题翻译：生产电路板区和电路板多路电路板的方法
公开(公告)号：US20160105953A1
公开(公告)日：2016-04-14
申请号：US14971688
申请日：2015-12-16
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Nikolai HASLEBNER , Markus LEITGEB , Michael GOESSLER , Mike MORIANZ
IPC分类号： H05K1/02 , H05K1/18 , H05K1/14 , H05K1/11
CPC分类号： H05K1/0266 , H01L2224/2518 , H05K1/0269 , H05K1/028 , H05K1/0298 , H05K1/11 , H05K1/115 , H05K1/14 , H05K1/18 , H05K1/182 , H05K1/189 , H05K3/36 , H05K3/4638 , H05K3/4688 , H05K2201/0355 , H05K2201/058 , H05K2201/09918 , H05K2201/09936 , H05K2203/166 , Y10T29/49126
摘要： For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base material and a conducting pattern located on or in, the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled.
摘要翻译：对于用于制造由多个电路板区域组成的电路板的方法，其中各个电路板区域包括至少一层由绝缘基材制成的层和位于基材上或其中的导电图案，下列提供：衬底材料，形成在衬底材料中的至少一个对准标记，布置在衬底材料上的第一电路板区域，至少一个额外的电路板区域，其基本上邻接第一电路板区域或至少部分重叠所述第一电路板，所述附加电路板区域相对于所述对准标记定向，以及所述第一电路板区域和所述至少一个附加电路板区域的导电图案的多个连接。因此，当电路板区域耦合时，可以实现改进的配准和取向。

60. 发明申请

US20160007450A1 Method for Producing a Printed Circuit Board with MultiLayer Sub-Areas in Sections 有权
标题翻译：生产印刷电路板与多层子区域的方法
公开(公告)号：US20160007450A1
公开(公告)日：2016-01-07
申请号：US14773201
申请日：2014-03-05
申请人： AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
发明人： Alexander Kasper , Dietmar Drofenikü , Ravi Hanyal Shivarudrappa , Michael Gössler
IPC分类号： H05K1/02 , H05K3/42 , H05K1/11 , H05K3/00 , H05K1/16 , H05K1/09 , H05K3/46 , H05K3/10
CPC分类号： H05K1/0298 , H05K1/028 , H05K1/09 , H05K1/115 , H05K1/162 , H05K3/0047 , H05K3/10 , H05K3/429 , H05K3/4611 , H05K3/4682 , H05K3/4691 , H05K3/4694 , H05K2201/0355 , H05K2201/096 , H05K2203/061 , H05K2203/063
摘要： A method for producing a printed circuit board (13, 15, 16) with multilayer subareas in sections, characterized by the following steps: a) providing at least one conducting foil (1, 1′) and application of a dielectric insulating foil (3, 3′) to at least one subarea of the conducting foil; b) applying a structure of conducting paths (4, 4′) to the insulating layer (3, 3′); c) providing one further printed circuit board structure; d) joining of the further printed circuit board structure with the conducting foil (1, 1′) plus insulating layer (3, 3′) and conducting paths (4, 4′) by interposing a prepreg layer (5, 85; 18, 18′), and e) laminating the parts joined in step d) under pressing pressure and heat; and a printed circuit board produced according to this method.
摘要翻译：一种用于制造具有多层子区域的印刷电路板（13,15,16）的方法，其特征在于以下步骤：a）提供至少一个导电箔（1,1'）和施加绝缘箔（3），3'）到导电箔的至少一个子区域; b）将导电路径（4,4'）的结构施加到绝缘层（3,3'）; c）提供一个另外的印刷电路板结构; d）通过插入预浸料层（5,85; 18'）将另外的印刷电路板结构与导电箔（1,1'）加绝缘层（3,3'）和导电路径（4,4'）的接合， 18'），和e）在加压和加热下层压在步骤d）中连接的部分; 以及根据该方法制造的印刷电路板。

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