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1. 发明申请

US20180310404A1 FLEXIBLE CIRCUIT BOARD 审中-公开
公开(公告)号：US20180310404A1
公开(公告)日：2018-10-25
申请号：US15765308
申请日：2016-09-12
申请人： LG INNOTEK CO., LTD.
发明人： Jun Young LIM , Woong Sik KIM , Hyung Kyu YOON
IPC分类号： H05K1/09 , H05K3/28 , H05K1/02 , H05K1/03
CPC分类号： H05K1/09 , H05K1/028 , H05K1/0393 , H05K1/18 , H05K1/189 , H05K3/244 , H05K3/28 , H05K3/3452 , H05K2201/0154 , H05K2201/0191 , H05K2201/0338 , H05K2201/10136
摘要： An embodiment of the present invention relates to a flexible printed circuit board (FPCB), which is applied to various electronic display devices, and may provide the FPCB, including a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

2. 发明申请

US20180270949A1 CIRCUIT BOARD AND ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20180270949A1
公开(公告)日：2018-09-20
申请号：US15986553
申请日：2018-05-22
申请人： FUJITSU LIMITED
发明人： Taiga Fukumori
IPC分类号： H05K1/03 , H05K1/02 , H01P3/08
CPC分类号： H05K1/0366 , H01P3/08 , H01P3/082 , H01P3/085 , H05K1/02 , H05K1/0225 , H05K1/113 , H05K1/181 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/029 , H05K2201/0715 , H05K2201/0723 , H05K2201/10378 , H05K2201/10734
摘要： A circuit board includes an insulation layer, a signal line formed over the insulation layer and extending in a direction X, and a conductor layer formed under the insulation layer. The insulation layer has periodic dielectric-constant distribution in a direction Y orthogonal to the direction X. The conductor layer includes a slit at a position corresponding to the signal line. The slit expands an electric field produced between the signal line and the conductor layer; causes less difference in dielectric constants of the insulation layer in the vicinity of the signal line (the difference is caused by the positional relationship between the signal line and the dielectric-constant distribution of the insulation layer); and reduces difference in signal transmission speeds caused by the positional relationship.

3. 发明授权

US10021780B2 Wired circuit board and producing method thereof 有权
公开(公告)号：US10021780B2
公开(公告)日：2018-07-10
申请号：US15800680
申请日：2017-11-01
申请人： NITTO DENKO CORPORATION
发明人： Daisuke Yamauchi , Hiroyuki Tanabe
IPC分类号： H05K1/03 , H05K1/02 , H05K3/06 , H05K3/18
CPC分类号： H05K1/028 , G11B5/484 , H05K1/056 , H05K3/064 , H05K3/18 , H05K3/243 , H05K2201/0191 , H05K2201/0347 , H05K2201/09736 , H05K2203/0353
摘要： A wired circuit board includes an insulating layer and a conductive layer. The insulating layer continuously has a first insulating portion, a second insulating portion having a thickness smaller than that of the first insulating portion, and a third insulating portion disposed between the first insulating portion and the second insulating portion and having a thickness that gradually becomes smaller from the first insulating portion toward the second insulating portion. The conductive layer continuously has a first conductive portion disposed at one-side surface of the first insulating portion and a second conductive portion disposed at one-side surface of the second insulating portion and having a thickness smaller than that of the first conductive portion. The first conductive portion is disposed at one-side surface of the second insulating portion and the third insulating portion or is disposed at one-side surface of the first insulating portion and the third insulating portion.

4. 发明申请

US20170339784A1 Circuit Board Having an Asymmetric Layer Structure 有权
公开(公告)号：US20170339784A1
公开(公告)日：2017-11-23
申请号：US15534897
申请日：2015-12-10
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Andreas Zluc , Gerald Weidinger , Mario Schober , Hannes Stahr , Timo Schwarz , Benjamin Gruber
IPC分类号： H05K1/02 , H01L21/48 , H01L23/14 , H01L23/00 , H05K3/46 , H05K3/00 , H05K1/18 , H05K1/03 , H05K1/11 , H01L23/538
CPC分类号： H05K1/0271 , H01L21/481 , H01L21/4857 , H01L21/568 , H01L23/145 , H01L23/5383 , H01L23/5385 , H01L23/5387 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L2224/2518 , H01L2224/32145 , H01L2224/73267 , H01L2224/9222 , H01L2924/0002 , H01L2924/18162 , H01L2924/19105 , H01L2924/3511 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K1/0393 , H05K1/115 , H05K1/185 , H05K1/189 , H05K3/0017 , H05K3/0097 , H05K3/4602 , H05K2201/0129 , H05K2201/0133 , H05K2201/0187 , H05K2201/0191 , H05K2201/068 , H05K2201/09136 , H01L2924/00
摘要： A circuit board is described which includes a layer composite with at least one dielectric layer which includes a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto, and which includes a layer thickness along a z-axis which is perpendicular with respect to the x-axis and to the y-axis; and at least one metallic layer which is attached to the dielectric layer in a planar manner. The layer composite along the z-axis is free from a symmetry plane which is oriented in parallel with respect to the xy-plane, and the dielectric layer includes a dielectric material which has an elastic modulus E in a range between 1 and 20 GPa and along the x-axis and along the y-axis a coefficient of thermal expansion in a range between 0 and 17 ppm/K. A method of manufacturing such a circuit board is also described. Further, a method of manufacturing a circuit board structure comprising two asymmetric circuit boards and a method of manufacturing two processed asymmetric circuit boards from a larger circuit board structure is described.

5. 发明申请

US20170339783A1 SemiFlexible Printed Circuit Board With Embedded Component 审中-公开
公开(公告)号：US20170339783A1
公开(公告)日：2017-11-23
申请号：US15534172
申请日：2015-12-10
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Hannes Stahr , Andreas Zluc , Timo Schwarz , Gerald Weidinger
IPC分类号： H05K1/02 , H01L21/48 , H01L23/14 , H01L23/00 , H05K3/46 , H05K3/00 , H05K1/18 , H05K1/03 , H05K1/11 , H01L23/538
CPC分类号： H05K1/0271 , H01L21/481 , H01L21/4857 , H01L21/568 , H01L23/145 , H01L23/5383 , H01L23/5385 , H01L23/5387 , H01L23/5389 , H01L23/562 , H01L24/19 , H01L24/20 , H01L2224/32145 , H01L2224/73267 , H01L2924/0002 , H01L2924/18162 , H01L2924/19105 , H01L2924/3511 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K1/0393 , H05K1/115 , H05K1/185 , H05K1/189 , H05K3/0017 , H05K3/0097 , H05K3/4602 , H05K2201/0129 , H05K2201/0133 , H05K2201/0187 , H05K2201/0191 , H05K2201/068 , H05K2201/09136 , H01L2924/00
摘要： A circuit board and a method of manufacturing a circuit board or two circuit boards are illustrated and described. The circuit board includes (a) a dielectric layer with a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto and a layer thickness along a z-direction which is perpendicular with respect to the x-axis and to the y-axis; (b) a metallic layer which is attached to the dielectric layer in a planar manner; and (c) a component which is embedded in the dielectric layer and/or in a dielectric core-layer of the circuit board. The dielectric layer includes a dielectric material which has (i) an elastic modulus E in a range between 1 and 20 GPa and (ii) a coefficient of thermal expansion in a range between 0 and 17 ppm/K along the x-axis and along the y-axis.

6. 发明授权

US09710663B2 Applicant screening 有权
公开(公告)号：US09710663B2
公开(公告)日：2017-07-18
申请号：US14721539
申请日：2015-05-26
申请人： TransUnion Rental Screening Solutions, Inc.
发明人： Michael A. Britti , Robert D. Thornley , Joel R. Springer , Michael J. Mauseth , Michael J. Collins
IPC分类号： G06F21/62 , G06Q10/06 , G06Q10/10 , G06Q20/36 , G06Q40/02 , G06Q50/16 , G06Q50/20
CPC分类号： H01L23/49822 , G06F21/62 , G06Q10/06 , G06Q10/0635 , G06Q10/10 , G06Q10/1053 , G06Q20/3674 , G06Q40/02 , G06Q40/025 , G06Q50/16 , G06Q50/20 , H01L21/48 , H01L21/4857 , H01L23/498 , H01L23/49811 , H01L23/49827 , H01L23/49894 , H01L24/16 , H01L24/48 , H01L2224/13099 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/181 , H05K1/0271 , H05K3/4682 , H05K2201/0191 , H05K2201/0209
摘要： Systems and methods for screening applicants are disclosed herein. A method of screening applicants is performed by a screening server. The server begins by receiving a selection of screening services and an applicant profile that identifies an applicant. The screening continues by generating screening results specified by the selection of screening services based on the applicant profile. A property manager is then notified that the screening results are available for the applicant based upon the applicant profile. The screening results are then provided to the property manager based upon the applicant profile. Based on these screening results, the screener or property manager can make a decision about the applicant and communicate a decision action to the applicant.

7. 发明授权

US09699912B2 Wiring board 有权
公开(公告)号：US09699912B2
公开(公告)日：2017-07-04
申请号：US15097473
申请日：2016-04-13
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Toyoaki Sakai , Tomoyuki Shimodaira , Shunichiro Matsumoto , Kentaro Kaneko
IPC分类号： H05K1/09 , H05K1/03 , H05K1/16 , H05K1/11 , H05K7/10 , H05K7/00 , H05K3/00 , H05K3/46 , H05K1/14 , H05K3/34
CPC分类号： H05K3/007 , H05K1/144 , H05K3/3436 , H05K3/4682 , H05K3/4694 , H05K2201/0191
摘要： A wiring board includes an insulating layer; and a wiring layer embedded in the insulating layer at one surface side of the insulating layer, one surface of the wiring layer being exposed from one surface of the insulating layer, the wiring layer including a first portion and a second portion whose width is wider than that of the first portion, one surface of the first portion and one surface of the second portion being flush with each other, and the first portion being thinner than the second portion.

8. 发明授权

US09620446B2 Wiring board, electronic component device, and method for manufacturing those 有权
公开(公告)号：US09620446B2
公开(公告)日：2017-04-11
申请号：US14962527
申请日：2015-12-08
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Noriyoshi Shimizu , Hiromu Arisaka , Akio Rokugawa , Toshinori Koyama
IPC分类号： H05K7/10 , H01L23/498 , H01L23/31 , H05K1/11 , H05K1/18 , H01L23/544 , H01L23/00
CPC分类号： H01L23/49822 , H01L23/3157 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49894 , H01L23/544 , H01L23/562 , H01L2223/5442 , H01L2223/54426 , H01L2223/54486 , H01L2224/16225 , H01L2924/0002 , H01L2924/15174 , H01L2924/15311 , H05K1/0298 , H05K1/11 , H05K1/115 , H05K1/181 , H05K3/3452 , H05K2201/0191 , H05K2201/2081 , H01L2924/00
摘要： A wiring board includes plural terminals, an insulating layer, and recess portions. Each terminal includes a roughened upper surface and a roughened side surface. The insulating layer is formed between the terminals. The upper surfaces of the terminals are exposed. An upper surface of the insulating layer is a concave curved surface. The recess portions are formed in the insulating layer around the terminals so as to partially expose the side surfaces of the terminals.

9. 发明授权

US09526168B2 Printed wiring board and method for manufacturing the same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US09526168B2
公开(公告)日：2016-12-20
申请号：US14719440
申请日：2015-05-22
申请人： IBIDEN CO., LTD.
发明人： Youhong Wu
IPC分类号： H05K1/02 , H05K1/03 , H01L23/12 , H05K3/46 , H05K3/34
CPC分类号： H05K1/036 , H01L21/4857 , H01L23/12 , H01L23/49822 , H01L23/49827 , H01L2924/0002 , H05K1/0298 , H05K3/3436 , H05K3/4644 , H05K3/4673 , H05K2201/0191 , H05K2201/0195 , H05K2201/0209 , H05K2201/0266 , H05K2203/066 , Y10T29/49156 , H01L2924/00
摘要： A printed wiring board includes an inner conductive-circuit layer, an insulation layer structure including a first insulation layer laminated on inner conductive-circuit layer and a second insulation layer laminated on the first insulation layer, and an outermost conductive-circuit layer laminated on the insulation layer structure and including connection portions such that the connection portions are positioned to mount a component on the insulation layer structure. The second insulation layer is interposed between the first insulation layer and the outermost conductive-circuit layer and has a thickness which is smaller than a thickness of the first insulation layer such that an outer surface of the second insulation layer on an outermost conductive-circuit-layer side is flatter than an inner surface of the second insulation layer on a first insulation-layer side.
摘要翻译：印刷电路板包括内部导电电路层，绝缘层结构，其包括层叠在内部导电电路层上的第一绝缘层和层叠在第一绝缘层上的第二绝缘层，以及层叠在第一绝缘层上的最外部导电电路层绝缘层结构，并且包括连接部分，使得连接部分定位成将部件安装在绝缘层结构上。第二绝缘层插入在第一绝缘层和最外面的导电电路层之间，其厚度小于第一绝缘层的厚度，使得最外面的导电电路层的第二绝缘层的外表面，层侧比第一绝缘层侧的第二绝缘层的内表面平坦。

10. 发明授权

US09520222B2 Wiring board and method for manufacturing wiring board 有权
标题翻译：接线板及制造接线板的方法
公开(公告)号：US09520222B2
公开(公告)日：2016-12-13
申请号：US14041638
申请日：2013-09-30
申请人： IBIDEN CO., LTD.
发明人： Ryojiro Tominaga , Keinosuke Ino
IPC分类号： H01F5/00 , H01F27/28 , H01F41/00 , H05K1/16 , H05K1/02 , H05K3/46 , H01F17/00
CPC分类号： H01F27/2804 , H01F41/005 , H01F2017/002 , H01F2027/2809 , H05K1/0216 , H05K1/165 , H05K3/4644 , H05K2201/0191 , H05K2201/096 , Y10T156/10
摘要： A wiring board includes a substrate including first insulation layers, a second insulation layer on the first layers, a third insulation layer on the second layer, and a plain conductor on the third layer. The substrate has inductor forming portion in which inductor patterns are formed on the first layers and first via conductors formed in the first layers such that the first via conductors connect the inductor patterns through the first layers, the substrate has a land on the second layer and a second via conductor in the second layer such that the second via conductor connects the land and the outermost inductor pattern, the substrate has a third via conductor in the third layer such that the third via conductor connects the plain conductor and land and has the central axis passing through the center of the third via conductor inside projected region of the second via conductor.
摘要翻译：布线基板包括：基板，其包括第一绝缘层，第一层上的第二绝缘层，第二层上的第三绝缘层，以及第三层上的平面导体。衬底具有电感器形成部分，其中电感器图案形成在第一层上形成并且形成在第一层中的第一通孔导体，使得第一通孔导体通过第一层连接电感器图案，衬底在第二层上具有焊盘，在第二层中的第二通孔导体，使得第二通孔导体连接焊盘和最外面的电感器图案，衬底在第三层中具有第三通孔导体，使得第三通孔导体连接平面导体和焊盘，并且具有中心轴穿过第二通孔导体的投影区域内的第三通路导体的中心。

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