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1. 发明申请

US20230058192A1 DEVICE FOR TRANSFERRING HEAT 有权
公开(公告)号：US20230058192A1
公开(公告)日：2023-02-23
申请号：US17911348
申请日：2021-02-19
申请人： SAFRAN , SAFRAN ELECTRONICS & DEFENSE
发明人： Toni YOUSSEF , Stéphane Joseph AZZOPARDI , Jean-Christophe RIOU
IPC分类号： H01L23/367 , H01L23/467 , H01L23/373 , F28F3/02 , F28F1/16 , F28F13/08
摘要： The invention relates to a device (2) for transferring heat from a thermally conductive plate (3) capable of capturing the heat from a zone placed on a first side (32) of the plate, the device comprising at least one fin (35) placed on a second side (34) of the plate (30) opposite the first side (32) and having a duct (36) extending in a longitudinal direction (L) between a first end (38) connected to the plate and a second end (4) opposite the first end and which opens out, the duct (36) being connected to at least one Venturi-effect neck (42) bringing cooling air into the duct, the neck (42) being formed in the vicinity of the first end of the duct and the plate (30).

2. 发明授权

US11589480B2 Tubular heat spreaders for memory modules and memory modules incorporating the same 有权
公开(公告)号：US11589480B2
公开(公告)日：2023-02-21
申请号：US17523750
申请日：2021-11-10
申请人： Micron Technology, Inc.
发明人： Thomas H. Kinsley , George E. Pax , Yogesh Sharma , Gregory A. King , Chan H. Yoo , Randon K. Richards
IPC分类号： H05K7/20 , H01L23/367 , H01L23/373 , G06F1/20 , H01L23/467
摘要： Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. An apparatus may have a printed circuit board (PCB) having an edge connector. At least one integrated circuit device may be disposed on a surface of the PCB. A tubular heat spreader may be disposed along an edge of the PCB opposite the edge connector.

3. 发明授权

US11579252B2 Sensor-cooling apparatus 有权
公开(公告)号：US11579252B2
公开(公告)日：2023-02-14
申请号：US16595581
申请日：2019-10-08
申请人： Ford Global Technologies, LLC
发明人： Michael Robertson, Jr. , Tyler D. Hamilton , Ashwin Arunmozhi , Raghu Raman Surineedi
IPC分类号： G01S7/481 , F28F3/02 , G01S7/483 , H01L23/467 , G01S7/497 , G01S13/931
摘要： A sensor apparatus includes a sensor having a field of view, a sensor window through which the field of view extends; an air nozzle positioned to direct airflow across the sensor window; a surface fixed relative to the sensor window, the surface including a plurality of heat-dissipation fins; and a cover extending over the fins and including an inlet. The inlet is positioned at an opposite edge of the sensor window from the air nozzle. The air nozzle is aimed at the inlet.

4. 发明授权

US11576276B2 Break out module system 有权
公开(公告)号：US11576276B2
公开(公告)日：2023-02-07
申请号：US17506709
申请日：2021-10-21
申请人： Molex, LLC
发明人： Augusto Panella , Daniel B. McGowan , Raymond Matyka , Gregory B. Walz , Kirk B. Peloza
IPC分类号： H05K7/14 , G06F1/20 , H01L23/467 , H05K7/20
摘要： A server rack with a plurality of compute nodes is positioned in a facility that includes a spine and the server rack includes a middle of rack (MOR) switch located near the middle of the server rack, vertically speaking. The MOR switch includes a plurality of ports that are connected via passive cables to the compute nodes provided in the server rack. In an embodiment the passive cables are configured to function at 56 Gbps using non-return to zero (NRZ) encoding and each cable may be about or less than 1.5 meters long. An electrical to optical panel (EOP) can be positioned adjacent a top of the server rack and the EOP includes connections to the MOR switch and to the spine, thus the EOP helps connect the MOR switch to the spine. Connections between adjacent server racks can provide for additional compute bandwidth when needed.

5. 发明授权

US11502019B2 Heat sink, heat dissipation apparatus, heat dissipation system, and communications device 有权
公开(公告)号：US11502019B2
公开(公告)日：2022-11-15
申请号：US17320533
申请日：2021-05-14
申请人： HUAWEI TECHNOLOGIES CO., LTD.
发明人： Shoubiao Xu , Shanjiu Chi , Wenhui Zeng
IPC分类号： H01L23/00 , H01L23/40 , H01L23/467 , H01L23/427 , H05K7/20 , F28F3/06
摘要： One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.

6. 发明申请

US20220293575A1 SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF 有权
公开(公告)号：US20220293575A1
公开(公告)日：2022-09-15
申请号：US17229866
申请日：2021-04-14
申请人： BroadPak Corporation
发明人： Farhang YAZDANI
IPC分类号： H01L25/10 , H01L23/66 , H01L25/18 , H01L25/00 , H01L23/498 , H01L23/36 , H01L23/14 , H01L25/065 , H01L23/31 , H01L23/13 , H01L23/00 , H01L23/538 , H01L21/48 , H01L23/04 , H01L21/52 , H01L23/467
摘要： An integrated circuit package comprising a heat spreader; one or more substrate(s); one or more standoff(s); and one or more electronic component(s). One or more component(s) is/are coupled to a substrate and the substrate maybe coupled to a heat spreader. Standoff(s) are coupled on the heat spreader or substrates forming a cavity, and one or more component(s) and substrate(s) are located inside the cavity.

7. 发明授权

US11444003B2 Integrated heat spreader with multiple channels for multichip packages 有权
公开(公告)号：US11444003B2
公开(公告)日：2022-09-13
申请号：US16144584
申请日：2018-09-27
申请人： INTEL CORPORATION
发明人： Zhimin Wan , Chia-Pin Chiu , Chandra Mohan Jha , Weihua Tang , Shankar Devasenathipathy
IPC分类号： H01L23/473 , H01L25/18 , H01L23/467 , H01L23/367 , H01L23/373
摘要： An integrated heat spreader includes channel structures assembled in a frame. Each channel structure is independent of the other, and can be used to dissipate heat from integrated circuitry at a specific location within a package, and without allowing heat from that particular location to propagate to integrated circuitry at other locations within the package. Each channel structure can be implemented with metal having a high thermal conductivity (e.g., copper). The channel structures can be used in conjunction with liquid-based cooling or air-based cooling. The frame can be implemented with low thermal conductivity molding compound or plastic so the heat transfer from one channel structure to another is inhibited. The channel structures can have different configurations (e.g., straight, pillars, and/or pin fins) to provide different rates of flow, mixing, and/or cooling. The flow direction of air or liquid for the channel structures can be the same (parallel) or different (counter).

8. 发明授权

US11425840B2 Heat sink with protrusions on multiple sides thereof and apparatus using the same 有权
公开(公告)号：US11425840B2
公开(公告)日：2022-08-23
申请号：US17092301
申请日：2020-11-08
申请人： Gerald Ho Kim
发明人： Gerald Ho Kim
IPC分类号： H05K7/20 , H05K1/02 , H01L23/367 , H01L23/427 , H01L23/467 , H05K5/03 , H05K5/04 , H01L23/13 , H01L29/06 , F28F3/04
摘要： A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.

9. 发明授权

US11424953B2 Modular physical layer and integrated connector module for local area networks 有权
公开(公告)号：US11424953B2
公开(公告)日：2022-08-23
申请号：US16696850
申请日：2019-11-26
申请人： KinnexA, Inc.
发明人： Ian Crayford , Kuan-Hsiung Wei , Shin-Hao Chien
IPC分类号： G06F1/26 , H04L12/40 , H04L49/351 , G05F1/08 , H01R24/64 , H02J7/00 , H02M3/335 , H01L23/467 , H03K19/173 , G06F1/3203
摘要： An Ethernet network is composed of one or more network infrastructure devices, such as a hubs, repeaters, switches or routers, which provides data interconnection and may provide operational power, or some part thereof, to remote network data terminal equipment such as a wireless access point, IP telephone, IP camera or network end station. Most Ethernet networks operate over a combination of the pairs in an unshielded twisted pair (UTP) or shielded twisted pair (STP) cable, or in some cases may operate over fiber optic cables. The individual links of Ethernet network, between the network infrastructure device and the Data Terminal Equipment (DTE) may be able to operate at one or more data rates such as 10 Mb/s, 100 Mb/s, 1 Gb/s, 2.5 Gb/s, 5 Gb/s and 10 Gb/s, or any combination thereof. The invention discloses an Ethernet Physical Layer (PHY) circuit, in combination with an Integrated Connector Module (ICM), which may reside inside the network equipment at either end of the Ethernet link. The combined PHY-ICM physical layer network device provides the appropriate encoding/decoding and signaling to operate over the specific network cable medium at the required data rate(s). The electrical and mechanical design of the combined PHY-ICM enables a modular approach such that during final assembly, the PHY-ICM can be optimized for operation over the appropriate data rate(s), whether it supports the provision of operational power between the network equipment, and if so at what power level, as well as other functionality. Furthermore, the PHY-ICM is designed to maintain a common electrical and mechanical footprint regardless of which of the features are included or excluded, to optimize the system cost for a specific maximum data rate, as well as minimize any re-engineering necessary on the part of the network equipment designer.

10. 发明授权

US11419239B2 Thermal management of circuit boards 有权
公开(公告)号：US11419239B2
公开(公告)日：2022-08-16
申请号：US16941212
申请日：2020-07-28
申请人： Micron Technology, Inc.
发明人： Xiaopeng Qu , Hyunsuk Chun
IPC分类号： H05K7/20 , H01L23/473 , H01R12/72 , H01L23/467 , H05K1/02
摘要： A semiconductor component system includes a motherboard and a cooling system mounted to the motherboard. The cooling system includes sidewalls projecting from the motherboard. A sub-motherboard extends between the sidewalls and is spaced apart from the motherboard. The sidewalls and the sub-motherboard define a cooling channel over the motherboard. A connector is attached to the sub-motherboard and is configured to receive a semiconductor device daughterboard. The connector has contacts to electrically couple the semiconductor device daughterboard to the sub-motherboard.

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